Dicing Saw (ADT)

Dicing Saw (ADT) Location Backend Lab: ESB 1111 Tool Type Packaging Manufacturer Advanced Dicing Technologies Ltd. Model ADT 7100 Description ADT Dicing Saw Primary Supervisor Lee Sawyer (805) 893-2123 lee_sawyer@ucsb.edu Secondary Supervisor Aidan Hopkins Recipes SignupMonkey: Sign up for this tool

About

The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the Dicing Saw Recipes page for the blades we currently stock.

An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.

Contact the tool supervisor for blades and dicing frames for your group.

Detailed Specifications

• Maximum Wafer Size: 8"
• Parts mounted to UV-release tape for cutting
• Automated cut maps at multiple angles (0° and 90° typical)
• ~few micron alignment to on-wafer features.
• Thermocarbon Resnoid dicing blades provided by staff

Operating Procedures

• ADT Dicing Saw Standard Operating Procedure
• Tape Station Standard Operating Procedure
• Recovering an Old Recipe

Recipes

• Recipes > Packaging > Dicing Saw Recipes (ADT 7100)

Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.