E-Beam 1 (Sharon)

E-Beam 1 (Sharon) Location Bay 3 Tool Type Vacuum Deposition Manufacturer Sharon Vacuum Co., Inc. Description Four Pocket Electron Beam Evaporator Primary Supervisor Michael Barreraz (805) 893-4147 mikebarreraz@ece.ucsb.edu Secondary Supervisor Bill Millerski Recipes Vacuum Deposition Recipes SignupMonkey: Sign up for this tool

EBeam#1

About

The Sharon is a cryo-pumped thin film evaporator with a Telemark 8 pocket electron beam evaporation source. Fixturing in EBeam1 will accept any size sample up to 4-inch diameter. In addition, a rotation fixture is easily installed which permits adjustable angle, 360° rotation of any size sample, up to 4-inch diameter. This feature is particularly useful for promoting step coverage of irregular surfaces.

EBeam1 is used for the evaporation of high purity metals, e.a. Al, Au, Ni, Ge, AuGe, Ti, Pt etc., for interconnect and ohmic contact metallization for fabrication of III-V compound semiconductor and silicon device fabrication.

Detailed Specifications

• Cryopump: CTI Cryotorr 8F with air-cooled compressor
• Pumping speed: 4,000 l/sec. for H2O, 1,500 l/sec. for air, 2,200 l/sec. for H2, 200 l/sec. for Ar
• Mechanical Pump: Ebara EV-A10, 35 CFM
• Electron Beam Source: Temescal, Model STIH-270-2MB, four 15 cc hearths
• Electron Beam Power Supply: Temescal, Model CV-6SLX, 0 - 10 kV dc, 0–600 mA dc beam current; TemEBeam Sweep Control
• Deposition Control: : Inficon IC/5, 6 film programs; 37 parameters for automatic or manual deposition control based on a resonating quartz crystal sensor
• Pieces up to Four - 4" wafers in one run.
• For single wafers: tilt with motorized rotation and sample lowering for higher effective rates, sidewall coverage, angled evaporation.

Documentation

• EBeam 1 Operating Procedure
  • Operating Instructions
  • Rotation Fixture SOP

Recipes

• See the E-Beam Recipe Page, for the materials tables and deposition parameters for various materials.