Wafer Coating Process Traveler

There are three standard recipes : STD SiO2, STD Nitride2, and STD LS Nitride2 at 300C. Instructions bellow explain how to run each of the recipes ( seasoning, deposition, cleaning)

Standard Oxide Deposition

STD SiO v2

1. Log in to Advanced PECVD #2
2. Seasoning
   • Load the seasoning recipe (STD SiO v2). Edit deposition time to 10min and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
3. Deposition
   • Vent the chamber and load the substrate (place it in the center of platen). You can place glass slides around the wafer to protect it from moving.
   • Pump down.
   • Load the deposition recipe (STD SiO v2). Edit deposition time to desired time and run it. Deposition time is variable. Get the rate from historical data.
   • Unload the wafer.
4. Cleaning
   • Wet clean: Wipe sidewall first with DI water, followed by IPA (Do wet clean only if [coat+deposition] time was >29min]).
   • Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning [one minute clean for one minute [coat+deposition] time.
   • Log out

Standard Nitride Deposition

"STD Si3N4 v3"

1. Log in to Advanced PECVD #2
2. Seasoning
   • Load the seasoning recipe (STD Si3N4 v3). Edit deposition time to 10min and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
3. Deposition
   • Vent the chamber and load the substrate (place it in the center of platen). You can place glass slides around the wafer to protect it from moving.
   • Pump down.
   • Load the deposition recipe (STD Si3N4 v3). Edit deposition time to desired time and run it. Deposition time is variable. Get the rate from historical data.
   • Unload the wafer.
4. Cleaning
   • Wet clean: Wipe sidewall first with DI water, followed by IPA (Do wet clean only if [coat+deposition] time was >29min]).
   • Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning [(coat time+deposition time)/7].
   • Log out

Standard Low Stress Deposition

"STD LS-Si3N4 v4"

1. Log in to Advanced PECVD #2
2. Seasoning
   • Load the seasoning recipe (STD LS-Si3N4 v4). Edit deposition time to 10min and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
3. Deposition
   • Vent the chamber and load the substrate (place it in the center of platen). You can place small glass slides round the wafer to protect it from moving.
   • Pump down.
   • Load the deposition recipe (STD LS-Si3N4 v4). Edit deposition time to desired time and run it. Get the rate from historical data.
   • Make sure Loop is set correctly for HF/LF Process Step
   • Unload the wafer.
4. Cleaning
   • Wet clean: Wipe sidewall first with DI water, followed by IPA (Do wet clean only if [coat+deposition] time was >29min]).
   • Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning [(coat time+deposition time)/7].
   • Log out