Thermal Evap 2 (Solder)

Thermal Evap 2 (Solder) Tool Type Vacuum Deposition Location Bay 3 Supervisor Brian Lingg Supervisor Phone (805) 893-8145 Supervisor E-Mail lingg_b@ucsb.edu Description ? Manufacturer Custom Vacuum Deposition Recipes Sign up for this tool

Detailed Specifications

• Standard 18" bell jar pumped by 8" Varian cryopump (HV8) driven by Ebara 2.1 compressor
• Low E-7 Torr ultimate pressure
• Rate Monitor: Maxtek TM-300
• Typical material rates: Al - 1 A/s @ 85 amps
  • Au - 5 A/s @ 122 amps
  • Cr - 2 A/s @ 85 amps
  • Zn - 4.5 A/s @ 50 amps

Materials Table

Materials Table
Material	Symbol	Density, g/cm3	Z Ratio	Tooling, %	Current, Amp	Dep.rate, A/sec	Comments