Thermal Evap 2 (Solder)

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Thermal Evap 2 (Solder)

Tool Type	Vacuum Deposition
Location	Bay 3
Supervisor	Brian Lingg
Supervisor Phone	(805) 893-8145
Supervisor E-Mail	lingg_b@ucsb.edu

Description	?
Manufacturer	Custom
Vacuum Deposition Recipes

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Materials Table

Materials Table
Material	Symbol	Density, g/cm3	Z Ratio	Tooling, %	Current, Amp	Dep.rate, A/sec	Comments

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