PECVD1 Recipes

PECVD 1 (PlasmaTherm 790)

SiN deposition (PECVD #1)

• SiN Standard Recipe
• SiN Data December 2014
• SiN 1000A Thickness uniformity 2014
• Low Stress Si₃N₄ - Variable Stress Recipes
• Low Stress Si₃N₄ - Variable Stress Plot

• Deposition rate~11.23nm/min (users must calibrate this prior to critical deps)
• HF e.r.~89nm/min
• Stress~450MPa
• Refractive Index~1.942

SiO₂ deposition (PECVD #1)

• SiO₂ Standard Recipe
• SiO₂ Data December 2014
• SiO₂ 1000A Thickness uniformity 2014

• Deposition rate~35.52nm/min (users must calibrate this prior to critical deps)
• HF e.r.~645nm/min
• Stress~-408MPa
• Refractive Index~1.461

SiO_xN_y deposition (PECVD #1)

• SiO_xN_y Deposition Recipes - Varying N/O Ratio
• SiO_xN_y Stress/Index vs. O/N Ratio
• SiO_xN_y Recipe
• SiO_xN_y Data December 2014
• SiO_xN_y 3000A Thickness uniformity 2014

• Deposition rate~14.99nm/min (users must calibrate this prior to critical deps)
• HF e.r.~417nm/min
• Stress~133MPa
• Refractive Index~1.714

LS SiN deposition (PECVD #1)

• SiO_xN_y Deposition Recipes - Varying N/O Ratio
• LS SiN Stress/Index vs. O/N Ratio
• LS SiN Recipe
• LS SiN Data December 2014
• LS SiN 3000A Thickness uniformity 2014

• Deposition rate~14.99nm/min (users must calibrate this prior to critical deps)
• HF e.r.~417nm/min
• Stress~133MPa
• Refractive Index~1.714