Dry Etching Recipes

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• A = Material is available for use, but no recipes are provided.

Dry Etching Recipes
	RIE Etching				ICP Etching					Oxygen Plasma Systems					Other Dry Etchers
Material	RIE 1 (Retired)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	DSEIII (PlasmaTherm)	SLR Fluorine ICP (PlasmaTherm)	ICP Etch 1 (Panasonic 1)	ICP Etch 2 (Panasonic 2)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	Plasma Clean (YES EcoClean)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)
Ag
Al				A			R1	R1
Au																	A
Cr				A			R1	A
Cu
Ge															A
Mo
Ni																	R1
Pt																	R1
Ru							A	R1
Si					R1	R1									R1
Ta
Ti							R1	A
Al2O3								R
Al2O3 (Sapphire)							R1	A
AlGaAs				R1			R1		GaAs-AlGaAs Etch (Unaxis VLR)
AlGaN									R1
AlN									R1
CdZnTe		R1
GaAs				R1			R1	R1	GaAs-AlGaAs Etch (Unaxis VLR)
GaN				R1			R1		R1
GaSb								A	GaSb Etch Unaxis VLR)
HfO2
InGaAlAs		InP-InGaAsP-InGaAlAs Etching (RIE 2)							InP-InGaAs-InAlAs Etch (Unaxis VLR)
InGaAsP		InP-InGaAsP-InGaAlAs Etching (RIE 2)							InP-InGaAs-InAlAs Etch (Unaxis VLR)
InP		InP-InGaAsP-InGaAlAs Etching (RIE 2)					A	A	InP-InGaAs-InAlAs Etch (Unaxis VLR)
ITO		R1
Photoresist & ARC			A	R			R	R		A	A
SiC							R1	A
SiN			SiNx Etching (RIE 3)				R1	R1		A
SiO2			SiO2 Etching (RIE 3)			A	R1	R1								R1
SiOxNy							A	A
Ta2O5								A
TiN
TiO2
W-TiW							R1	A
ZnO2
ZnS		R1
ZnSe		R1
ZrO2
Material	RIE 1 (Retired)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	DSEIII (PlasmaTherm)	SLR Fluorine ICP (PlasmaTherm)	ICP Etch 1 (Panasonic E626I)	ICP Etch 2 (Panasonic E640)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	Plasma Clean (YES EcoClean)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)