PECVD1 Wafer Coating Process

The wafers used for process calibration are ordered from SVM. These are low particle count 4" Si wafers (particle count<100). The wafers are scanned before and after deposition. They are not re-used. Handling the wafers is important and each step could contribute in adding new particles.

SiN @250C

1. Log in to PECVD #1 (Staff account).
2. Edit standard recipes (for seasoning, deposition, and cleaning). You can ONLY change the time in recipes.
   • Seasoning recipe name
   • Deposition recipe name
   • Cleaning recipe name:
3. Load the seasoning recipe, and run it. The goal of this step is to coat chamber walls and prepare it for deposition.
4. Vent the chamber and load a 4"Si wafer (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
5. Pump down.
6. Load the deposition recipe, and run it.
7. Wait for deposition to be finished. Unload the wafer.
8. Wipe sidewall first with DI water, followed by IPA.
9. Load recipe for cleaning. Edit the recipe and enter required time for cleaning.

SiO2 @250C

1. Log in to PECVD #1 (Staff account).
2. Edit standard recipes (for seasoning, deposition, and cleaning). You can ONLY change the time in recipes.
   • Seasoning recipe name
   • Deposition recipe name
   • Cleaning recipe name:
3. Load the seasoning recipe, and run it. The goal of this step is to coat chamber walls and prepare it for deposition.
4. Vent the chamber and load a 4"Si wafer (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
5. Pump down.
6. Load the deposition recipe, and run it.
7. Wait for deposition to be finished. Unload the wafer.
8. Wipe sidewall first with DI water, followed by IPA.
9. Load recipe for cleaning. Edit the recipe and enter required time for cleaning.