Wafer Cleaver (PELCO Flip-Scribe)
Jump to navigation
Jump to search
|
About
The LatticeAx is a manual cleaving system, with a diamond tip that scribes along the underside of the part/wafer. The user manually drags the part across the diamond scribe, using the guides and stops to push the part in a controlled, straight line. Manual breaking tools are provided to perform the break after scribing.
Detailed Specifications
- Wafer/Parts Sizes: 4" down to ~10mm
Operating Procedures
- LatticeAx SOP - To be added
Recipes
- Recipes > Packaging > To Be Added
Be sure to also see the recipes for protecting your sample from dicing dust on the Packaging Recipes page.