Dry Etching Recipes
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RIE Etching
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ICP Etching
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Oxygen Plasma Systems
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Other Dry Etchers
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Material
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RIE 2 (MRC)
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RIE 3 (MRC)
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RIE 5 (PlasmaTherm)
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DSEIII (PlasmaTherm)
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Fluorine ICP (PlasmaTherm)
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ICP Etch 1 (Panasonic E626I)
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ICP Etch 2 (Panasonic E640)
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Oxford ICP (PlasmaPro 100)
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ICP-Etch (Unaxis VLR)
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Ashers (Technics PEII)
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Plasma Clean (Gasonics 2000)
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Plasma Clean (YES EcoClean)
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UV Ozone Reactor
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Plasma Activation (EVG 810)
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XeF2 Etch (Xetch)
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Vapor HF Etch (uETCH)
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CAIBE (Oxford)
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Ag
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A
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Al
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A
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R1
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R1
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A
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Au
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R1
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Cr
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A
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R1
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A
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A
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Cu
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A
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Ge
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A
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A
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A
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A
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Mo
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A
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Nb
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A
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A
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Ni
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R1
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Os
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A
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A
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Pt
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R1
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Ru
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A
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R1
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A
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Si
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R1
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R1
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A
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R1
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A
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Ta
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A
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A
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A
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Ti
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R1
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A
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A
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Al2O3
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R
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A
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Al2O3 (Sapphire)
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R1
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A
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A
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AlGaAs
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R1
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R1
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R
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GaAs-AlGaAs Etch (Unaxis VLR)
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A
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AlGaN
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R
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R1
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A
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AlN
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R1
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A
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CdZnTe
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R1
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A
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GaAs
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R1
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R1
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R1
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R
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GaAs-AlGaAs Etch (Unaxis VLR)
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A
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GaN
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R1
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R1
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A
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R
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R1
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A
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GaSb
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A
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GaSb Etch Unaxis VLR)
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A
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HfO2
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A
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InGaAlAs
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InP-InGaAsP-InGaAlAs Etching (RIE 2)
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A
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InP-InGaAs-InAlAs Etch (Unaxis VLR)
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A
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InGaAsP
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InP-InGaAsP-InGaAlAs Etching (RIE 2)
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R
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InP-InGaAs-InAlAs Etch (Unaxis VLR)
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A
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InP
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InP-InGaAsP-InGaAlAs Etching (RIE 2)
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A
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A
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R
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InP-InGaAs-InAlAs Etch (Unaxis VLR)
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R1
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ITO
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R1
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A
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Photoresist
& ARC
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A
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R
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R
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R
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R
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A
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A
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A
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A
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Ru
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A
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R
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SiC
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R1
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A
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A
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SiN
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SiNx Etching (RIE 3)
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A
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R1
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R1
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A
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A
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SiO2
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SiO2 Etching (RIE 3)
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R1
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R1
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R1
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R1
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A
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SiOxNy
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A
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A
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A
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Ta2O5
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A
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A
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TiN
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A
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TiO2
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A
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W-TiW
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R1
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A
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A
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ZnO2
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A
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ZnS
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R1
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A
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ZnSe
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R1
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A
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ZrO2
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A
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Material
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RIE 2 (MRC)
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RIE 3 (MRC)
|
RIE 5 (PlasmaTherm)
|
DSEIII (PlasmaTherm)
|
Fluorine ICP (PlasmaTherm)
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ICP Etch 1 (Panasonic E626I)
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ICP Etch 2 (Panasonic E640)
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Oxford ICP (PlasmaPro 100)
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ICP-Etch (Unaxis VLR)
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Ashers (Technics PEII)
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Plasma Clean (Gasonics 2000)
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Plasma Clean (YES EcoClean)
|
UV Ozone Reactor
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Plasma Activation (EVG 810)
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XeF2 Etch (Xetch)
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Vapor HF Etch (uETCH)
|
CAIBE (Oxford)
|