Surface Analysis (KLA/Tencor Surfscan)

Surface Analysis (KLA/Tencor Surfscan) Location Bay 5 Tool Type Inspection, Test and Characterization Manufacturer Tencor Description Surface Analysis KLA/Tencor Surfscan Primary Supervisor Biljana Stamenic (805) 893-4002 biljana@ece.ucsb.edu Secondary Supervisor Don Freeborn Recipes

About

This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches.

Documentation

• Standard Operating Procedure
• Operations Manual
  • For detailed measurement info, it is highly recommended that you read the manual.
• Wafer scanning process traveler
• Glossary
• Errors

Examples

A low-particle 4-inch wafer example:

Gain 4: Small Particles (0.160µm – 1.60µm)	Gain 2: Large Particles (1.60µm – 28.0µm)

A high-particle 4-inch wafer example:

Gain 4: Small Particles (0.160µm – 1.60µm)	Gain 2: Large Particles (1.60µm – 28.0µm)