Difference between revisions of "Automated Wafer Cleaver (Loomis LSD-155LT)"
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Revision as of 20:11, 14 April 2023
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About
TBD: Insert info general here.
Detailed Specifications
- Maximum Wafer Size:
- Parts mounted to UV-release tape for cutting
- Automated cut maps at multiple angles (0° and 90° typical)
- ~few micron alignment to on-wafer features.
- TBD
Operating Procedures
Recipes
- Recipes > Packaging > Wafer Cleaver Recipes (LSD-155LT)
- Wafer thinning is critical, see the Wafer Lapping (Allied XYZ) tool as well.