Difference between revisions of "Automated Wafer Cleaver (Loomis LSD-155LT)"
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==About== |
==About== |
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| + | The Loomis LSD-155Lt is a production scribe and break system that can be used for processing large grids, arrays of laser bars, cleaving high quality mirror facets, and dicing wafers. |
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| − | TBD: Insert info general here. |
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==Detailed Specifications== |
==Detailed Specifications== |
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| − | *Maximum Wafer Size: |
+ | *Maximum Wafer Size: 4" |
| − | *Parts mounted to |
+ | *Parts mounted to low tack tape and used in conjunction with 6" plastic rings. |
*Automated cut maps at multiple angles (0° and 90° typical) |
*Automated cut maps at multiple angles (0° and 90° typical) |
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*~few micron alignment to on-wafer features. |
*~few micron alignment to on-wafer features. |
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| − | * |
+ | *TBD |
==Operating Procedures== |
==Operating Procedures== |
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*Recipes > Packaging > '''Wafer Cleaver Recipes (LSD-155LT)''' |
*Recipes > Packaging > '''Wafer Cleaver Recipes (LSD-155LT)''' |
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| − | * |
+ | *Wafer thinning is critical, see the Wafer Lapping (Allied XYZ) tool as well. |
Revision as of 07:59, 16 May 2023
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About
The Loomis LSD-155Lt is a production scribe and break system that can be used for processing large grids, arrays of laser bars, cleaving high quality mirror facets, and dicing wafers.
Detailed Specifications
- Maximum Wafer Size: 4"
- Parts mounted to low tack tape and used in conjunction with 6" plastic rings.
- Automated cut maps at multiple angles (0° and 90° typical)
- ~few micron alignment to on-wafer features.
- TBD
Operating Procedures
Recipes
- Recipes > Packaging > Wafer Cleaver Recipes (LSD-155LT)
- Wafer thinning is critical, see the Wafer Lapping (Allied XYZ) tool as well.