Difference between revisions of "Dry Etching Recipes"

From UCSB Nanofab Wiki
Jump to navigation Jump to search
(link to Fluorine etcher Ru-masked SiO2 etch.)
(deleted extra blank column, linked Technics & YES Ecoclean to recipes page.)
 
(22 intermediate revisions by 4 users not shown)
Line 1: Line 1:
−
{{Recipe Table Explanation}}
+
===<u>[[Process Group - Process Control Data#Etching .28Process Control Data.29|Process Control Data]]</u>===
 +
<small>''See [[Process Group - Process Control Data#Etching .28Process Control Data.29|linked page]] for [https://en.wikipedia.org/wiki/Statistical_process_control process control data] (dep rate/stress etc. over time), for a selection of often-used thin-film depositions.''</small>
 +
 
 +
===Dry Etching Tools/Materials Table===
 +
 
 +
*<small>'''R''': ''Recipe is available. Clicking this link will take you to the recipe.''</small>
 +
*<small>'''A''': ''Material is available for use, but no recipes are provided.''</small>
 +
 
 
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" border="1"
 
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" border="1"
−
|- bgcolor="#d0e7ff"
+
|-  
 
! colspan="17" width="725" height="45" |<div style="font-size: 150%;">Dry Etching Recipes</div>
 
! colspan="17" width="725" height="45" |<div style="font-size: 150%;">Dry Etching Recipes</div>
 
|- bgcolor="#d0e7ff"
 
|- bgcolor="#d0e7ff"
−
|<!-- INTENTIONALLY LEFT BLANK -->
+
| bgcolor="#eaecf0" |<!-- INTENTIONALLY LEFT BLANK -->
 
! colspan="3" |'''[[RIE Etching Recipes|RIE Etching]]'''
 
! colspan="3" |'''[[RIE Etching Recipes|RIE Etching]]'''
−
! colspan="5" |'''[[ICP Etching Recipes|ICP Etching]]'''
+
! colspan="6" |'''[[ICP Etching Recipes|ICP Etching]]'''
−
! colspan="5" bgcolor="#d0e7ff" align="center" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
+
! colspan="4" bgcolor="#d0e7ff" align="center" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
 
! colspan="3" bgcolor="#d0e7ff" align="center" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
 
! colspan="3" bgcolor="#d0e7ff" align="center" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
−
|-
+
|- bgcolor="#d0e7ff"
−
! width="65" bgcolor="#d0e7ff" align="center" |'''Material'''
+
! bgcolor="#d0e7ff" align="center" |'''Material'''
−
| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
+
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> <span style="font-size: 88%;">(MRC)</span>]]
−
| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
+
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> <span style="font-size: 88%;">(MRC)</span>]]
−
| width="100" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
+
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
−
| width="100" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
+
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
−
| width="100" bgcolor="#daf1ff" |[https://wiki.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#PlasmaTherm.2FSLR_Fluorine_Etcher SLR Fluorine ICP (PlasmaTherm)]
+
| bgcolor="#daf1ff" |[[ICP Etching Recipes#PlasmaTherm.2FSLR Fluorine Etcher|Fluorine ICP <span style="font-size: 88%;">(PlasmaTherm)</span>]]
−
| width="120" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic 1)]]
+
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br><span style="font-size: 88%;">(Panasonic E626I)</span>]]
−
| width="120" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic 2)]]
+
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br><span style="font-size: 88%;">(Panasonic E640)</span>]]
−
| width="85" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br>(Unaxis VLR)]]
+
| bgcolor="#daf1ff" |[[ICP Etching Recipes#Oxford ICP Etcher .28PlasmaPro 100 Cobra.29|Oxford ICP <span style="font-size: 88%;">(PlasmaPro 100)</span>]]
−
| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
+
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br><span style="font-size: 88%;">(Unaxis VLR)</span>]]
−
| width="95" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
+
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br><span style="font-size: 88%;">(Technics PEII)</span>]]
−
| width="95" bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean (YES EcoClean)]]
+
| bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean <span style="font-size: 88%;">(YES EcoClean)</span>]]
−
| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
+
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
−
| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
+
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br><span style="font-size: 88%;">(EVG 810)</span>]]
−
| width="85" bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br>(Xetch)]]
+
| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br><span style="font-size: 88%;">(Xetch)</span>]]
−
| width="85" bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
+
| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br><span style="font-size: 88%;">(uETCH)</span>]]
−
| width="85" bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
+
| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br><span style="font-size: 88%;">(Oxford)</span>]]
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! bgcolor="#d0e7ff" align="center" |Ag
 
! bgcolor="#d0e7ff" align="center" |Ag
Line 45: Line 52:
 
|
 
|
 
|A
 
|A
−
|- bgcolor="#eeffff"
+
|- bgcolor="#ffffff"
 
! bgcolor="#d0e7ff" align="center" |Al
 
! bgcolor="#d0e7ff" align="center" |Al
 
|
 
|
Line 81: Line 88:
 
|
 
|
 
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
−
|- bgcolor="#eeffff"
+
|- bgcolor="#ffffff"
 
! bgcolor="#d0e7ff" align="center" |Cr
 
! bgcolor="#d0e7ff" align="center" |Cr
 
|
 
|
Line 117: Line 124:
 
|
 
|
 
|A
 
|A
−
|-
+
|- bgcolor="#ffffff"
 
! bgcolor="#d0e7ff" align="center" |Ge
 
! bgcolor="#d0e7ff" align="center" |Ge
 
|
 
|
Line 124: Line 131:
 
|
 
|
 
|
 
|
−
|
+
|A
−
|
+
|A
 
|
 
|
 
|
 
|
Line 154: Line 161:
 
|A
 
|A
 
|-
 
|-
 +
!Nb
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|A
 +
|A
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|- bgcolor="#ffffff"
 
! bgcolor="#d0e7ff" align="center" |Ni
 
! bgcolor="#d0e7ff" align="center" |Ni
 
|
 
|
Line 172: Line 197:
 
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 
|-
 
|-
 +
!Os
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|A
 +
|A
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|- bgcolor="#eeffff"
 
! bgcolor="#d0e7ff" align="center" |Pt
 
! bgcolor="#d0e7ff" align="center" |Pt
 
|
 
|
Line 189: Line 232:
 
|
 
|
 
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
−
|-
+
|- bgcolor="#ffffff"
 
! bgcolor="#d0e7ff" align="center" |Ru
 
! bgcolor="#d0e7ff" align="center" |Ru
 
|
 
|
Line 213: Line 256:
 
|
 
|
 
|{{rl|ICP Etching Recipes|DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)}}
 
|{{rl|ICP Etching Recipes|DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)}}
−
|{{Rl|ICP Etching Recipes|Si Etching}}
+
|{{Rl|ICP Etching Recipes|Si_Etching_.28Fluorine_ICP_Etcher.29}}
−
|
 
 
|
 
|
 
|
 
|
 +
|A
 
|
 
|
 
|
 
|
Line 225: Line 268:
 
|
 
|
 
|A
 
|A
−
|-
+
|- bgcolor="#ffffff"
 
! bgcolor="#d0e7ff" align="center" |Ta
 
! bgcolor="#d0e7ff" align="center" |Ta
 
|
 
|
Line 232: Line 275:
 
|
 
|
 
|
 
|
−
|
+
|A
−
|
+
|A
 
|
 
|
 
|
 
|
Line 243: Line 286:
 
|
 
|
 
|A
 
|A
−
|-
+
|- bgcolor="#eeffff"
 
! bgcolor="#d0e7ff" align="center" |Ti
 
! bgcolor="#d0e7ff" align="center" |Ti
 
|
 
|
Line 261: Line 304:
 
|
 
|
 
|A
 
|A
−
|-
+
|- bgcolor="#ffffff"
 
! bgcolor="#d0e7ff" align="center" |Al<sub>2</sub>O<sub>3</sub>
 
! bgcolor="#d0e7ff" align="center" |Al<sub>2</sub>O<sub>3</sub>
 
|
 
|
Line 268: Line 311:
 
|
 
|
 
|
 
|
−
|
+
|A
−
|[https://wiki.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#Al2O3_Etching_.28Panasonic_2.29 R]
+
|[https://wiki.nanotech.ucsb.edu/w/index.php?title=ICP_Etching_Recipes#Al2O3_Etching_.28Panasonic_2.29 R]
 
|
 
|
 
|
 
|
Line 297: Line 340:
 
|
 
|
 
|A
 
|A
−
|-
+
|- bgcolor="#ffffff"
 
! bgcolor="#d0e7ff" align="center" |AlGaAs
 
! bgcolor="#d0e7ff" align="center" |AlGaAs
 
|
 
|
Line 304: Line 347:
 
|
 
|
 
|
 
|
−
|{{rl|ICP Etching Recipes|AlGaAs Etch (Panasonic 1)}}
+
|{{rl|ICP Etching Recipes|GaAs-AlGaAs Etch (Panasonic 1)}}
 
|
 
|
 +
|[[ICP Etching Recipes#GaAs Etch .28Oxford ICP Etcher.29|R]]
 
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaAs-AlGaAs Etch (Unaxis VLR)|AlGaAs Etch (Unaxis VLR)}}
 
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaAs-AlGaAs Etch (Unaxis VLR)|AlGaAs Etch (Unaxis VLR)}}
−
|
 
 
|
 
|
 
|
 
|
Line 324: Line 367:
 
|
 
|
 
|
 
|
 +
|[[ICP Etching Recipes#GaN Etch .28Oxford ICP Etcher.29|R]]
 
|{{rl|ICP Etching Recipes|GaN Etch (Unaxis VLR)}}
 
|{{rl|ICP Etching Recipes|GaN Etch (Unaxis VLR)}}
−
|
 
 
|
 
|
 
|
 
|
Line 333: Line 376:
 
|
 
|
 
|A
 
|A
−
|-
+
|- bgcolor="#ffffff"
 
! bgcolor="#d0e7ff" align="center" |AlN
 
! bgcolor="#d0e7ff" align="center" |AlN
 +
|
 
|
 
|
 
|
 
|
Line 345: Line 389:
 
|
 
|
 
|
 
|
 +
|
 +
|
 +
|
 +
|
 +
|A
 +
|-
 +
!BCB
 
|
 
|
 
|
 
|
Line 351: Line 402:
 
|
 
|
 
|A
 
|A
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! bgcolor="#d0e7ff" align="center" |CdZnTe
 
! bgcolor="#d0e7ff" align="center" |CdZnTe
Line 369: Line 430:
 
|
 
|
 
|A
 
|A
−
|- bgcolor="#eeffff"
+
|- bgcolor="#ffffff"
 
! bgcolor="#d0e7ff" align="center" |GaAs
 
! bgcolor="#d0e7ff" align="center" |GaAs
 
|
 
|
Line 376: Line 437:
 
|
 
|
 
|
 
|
−
|{{rl|ICP Etching Recipes|GaAs-AlGaAs_Etch_.28Panasonic_1.29}}
+
|{{rl|ICP Etching Recipes|GaAs-AlGaAs Etch (Panasonic 1)}}
 
|{{rl|ICP Etching Recipes|GaAs Etch (Panasonic 2)}}
 
|{{rl|ICP Etching Recipes|GaAs Etch (Panasonic 2)}}
 +
|[[ICP Etching Recipes#GaAs Etch .28Oxford ICP Etcher.29|R]]
 
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaAs-AlGaAs Etch (Unaxis VLR)|GaAs Etch (Unaxis VLR)}}
 
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaAs-AlGaAs Etch (Unaxis VLR)|GaAs Etch (Unaxis VLR)}}
−
|
 
 
|
 
|
 
|
 
|
Line 387: Line 448:
 
|
 
|
 
|A
 
|A
−
|-
+
|- bgcolor="#eeffff"
 
! bgcolor="#d0e7ff" align="center" |GaN
 
! bgcolor="#d0e7ff" align="center" |GaN
 
|
 
|
Line 395: Line 456:
 
|
 
|
 
|{{rl|ICP Etching Recipes|GaN Etch (Panasonic 1)}}
 
|{{rl|ICP Etching Recipes|GaN Etch (Panasonic 1)}}
−
|
+
|A
 +
|[[ICP Etching Recipes#GaN Etch .28Oxford ICP Etcher.29|R]]
 
|{{rl|ICP Etching Recipes|GaN Etch (Unaxis VLR)}}
 
|{{rl|ICP Etching Recipes|GaN Etch (Unaxis VLR)}}
−
|
 
 
|
 
|
 
|
 
|
Line 405: Line 466:
 
|
 
|
 
|A
 
|A
−
|- bgcolor="#eeffff"
+
|- bgcolor="#ffffff"
 
! bgcolor="#d0e7ff" align="center" |GaSb
 
! bgcolor="#d0e7ff" align="center" |GaSb
 
|
 
|
Line 412: Line 473:
 
|
 
|
 
|
 
|
−
|
+
|A
 +
|A
 
|A
 
|A
 
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaSb Etch Unaxis VLR)}}
 
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaSb Etch Unaxis VLR)}}
−
|
 
 
|
 
|
 
|
 
|
Line 441: Line 502:
 
|
 
|
 
|A
 
|A
−
|- bgcolor="#eeffff"
+
|- bgcolor="#ffffff"
 
! bgcolor="#d0e7ff" align="center" |InGaAlAs
 
! bgcolor="#d0e7ff" align="center" |InGaAlAs
 
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
Line 450: Line 511:
 
|
 
|
 
|
 
|
 +
|A
 
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
 
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
−
|
 
 
|
 
|
 
|
 
|
Line 459: Line 520:
 
|
 
|
 
|A
 
|A
−
|-
+
|- bgcolor="#eeffff"
 
! bgcolor="#d0e7ff" align="center" |InGaAsP
 
! bgcolor="#d0e7ff" align="center" |InGaAsP
 
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
Line 468: Line 529:
 
|
 
|
 
|
 
|
 +
|[[ICP Etching Recipes#InP Ridge Etch .28Oxford ICP Etcher.29|R]]
 
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
 
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
−
|
 
 
|
 
|
 
|
 
|
Line 477: Line 538:
 
|
 
|
 
|A
 
|A
−
|- bgcolor="#eeffff"
+
|- bgcolor="#ffffff"
 
! bgcolor="#d0e7ff" align="center" |InP
 
! bgcolor="#d0e7ff" align="center" |InP
 
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
Line 486: Line 547:
 
|A
 
|A
 
|A
 
|A
 +
|[[ICP Etching Recipes#InP Ridge Etch .28Oxford ICP Etcher.29|R]]
 
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
 
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
−
|
 
 
|
 
|
 
|
 
|
Line 495: Line 556:
 
|
 
|
 
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
−
|-
+
|- bgcolor="#eeffff"
 
! bgcolor="#d0e7ff" align="center" |ITO
 
! bgcolor="#d0e7ff" align="center" |ITO
 
|{{rl|RIE Etching Recipes|ITO Etch (RIE 2)}}
 
|{{rl|RIE Etching Recipes|ITO Etch (RIE 2)}}
Line 513: Line 574:
 
|
 
|
 
|A
 
|A
−
|- bgcolor="#eeffff"
+
|-
 +
!LiNbO3
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|A
 +
|- bgcolor="#ffffff"
 
!Photoresist
 
!Photoresist
 
& ARC
 
& ARC
 
|
 
|
 
|A
 
|A
−
|[https://wiki.nanotech.ucsb.edu/wiki/index.php/RIE_Etching_Recipes#Photoresist_and_ARC R]
+
|[https://wiki.nanotech.ucsb.edu/wiki/RIE_Etching_Recipes#Photoresist_and_ARC_.28RIE_5.29 R]
 +
|
 +
|[https://wiki.nanotech.ucsb.edu/wiki/ICP_Etching_Recipes#Photoresist_.26_ARC_.28Fluorine_ICP_Etcher.29 R]
 +
|[https://wiki.nanotech.ucsb.edu/wiki/ICP_Etching_Recipes#Photoresist_and_ARC_Etching_.28Panasonic_1.29 R]
 +
|[https://wiki.nanotech.ucsb.edu/wiki/ICP_Etching_Recipes#Photoresist_and_ARC_etching_.28Panasonic_2.29 R]
 +
|
 +
|
 +
|[[Oxygen Plasma System Recipes#O2 Ashing|R]]
 +
|[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|R]]
 +
|
 
|
 
|
 
|
 
|
−
|[https://wiki.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#Photoresist_and_ARC_Etching R]
 
−
|[https://wiki.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#Photoresist_and_ARC_etching_2 R]
 
 
|
 
|
 
|A
 
|A
 +
|-
 +
!Ru
 +
|
 +
|
 +
|
 +
|
 +
|
 
|A
 
|A
−
|A
+
|[[ICP Etching Recipes#Ru .28Ruthenium.29 Etch .28Panasonic 2.29|R]]
 +
|
 +
|
 +
|
 +
|
 +
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
−
|A
+
|- bgcolor="#eeffff"
−
|-
 
 
! bgcolor="#d0e7ff" align="center" |SiC
 
! bgcolor="#d0e7ff" align="center" |SiC
 
|
 
|
Line 550: Line 647:
 
|
 
|
 
|A
 
|A
−
|-
+
|- bgcolor="#ffffff"
 
! bgcolor="#d0e7ff" align="center" |SiN
 
! bgcolor="#d0e7ff" align="center" |SiN
 
|
 
|
Line 556: Line 653:
 
|
 
|
 
|
 
|
−
|
+
|A
 
|{{rl|ICP Etching Recipes|SiNx Etching (Panasonic 1)}}
 
|{{rl|ICP Etching Recipes|SiNx Etching (Panasonic 1)}}
 
|{{rl|ICP Etching Recipes|SiNx Etching (Panasonic 2)}}
 
|{{rl|ICP Etching Recipes|SiNx Etching (Panasonic 2)}}
 +
|
 
|
 
|
 
|A
 
|A
−
|
 
 
|
 
|
 
|
 
|
Line 574: Line 671:
 
|
 
|
 
|
 
|
−
|[[ICP Etching Recipes#SiO2 Etching|R]]
+
|{{rl|ICP Etching Recipes|SiO2 Etching (Fluorine ICP Etcher)}}
 
|{{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 1)}}
 
|{{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 1)}}
 
|{{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 2)}}
 
|{{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 2)}}
Line 586: Line 683:
 
|{{rl|Other Dry Etching Recipes|Other Dry Etch (Vapor HF Etcher)}}
 
|{{rl|Other Dry Etching Recipes|Other Dry Etch (Vapor HF Etcher)}}
 
|A
 
|A
−
|- bgcolor="#eeffff"
+
|- bgcolor="#ffffff"
 
! bgcolor="#d0e7ff" align="center" |SiOxNy
 
! bgcolor="#d0e7ff" align="center" |SiOxNy
 
|
 
|
Line 605: Line 702:
 
|A
 
|A
 
|-
 
|-
 +
!SU8
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|A
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|- bgcolor="#eeffff"
 
! bgcolor="#d0e7ff" align="center" |Ta<sub>2</sub>O<sub>5</sub>
 
! bgcolor="#d0e7ff" align="center" |Ta<sub>2</sub>O<sub>5</sub>
 
|
 
|
Line 611: Line 726:
 
|
 
|
 
|
 
|
−
|
+
|A
 
|[https://www.osapublishing.org/optica/abstract.cfm?uri=optica-4-5-532 A]
 
|[https://www.osapublishing.org/optica/abstract.cfm?uri=optica-4-5-532 A]
 
|
 
|
Line 622: Line 737:
 
|
 
|
 
|A
 
|A
−
|-
+
|- bgcolor="#ffffff"
 
! bgcolor="#d0e7ff" align="center" |TiN
 
! bgcolor="#d0e7ff" align="center" |TiN
 
|
 
|
Line 658: Line 773:
 
|
 
|
 
|A
 
|A
−
|- bgcolor="#eeffff"
+
|- bgcolor="#ffffff"
 
! bgcolor="#d0e7ff" align="center" |W-TiW
 
! bgcolor="#d0e7ff" align="center" |W-TiW
 
|
 
|
Line 694: Line 809:
 
|
 
|
 
|A
 
|A
−
|-
+
|- bgcolor="#ffffff"
 
! bgcolor="#d0e7ff" align="center" |ZnS
 
! bgcolor="#d0e7ff" align="center" |ZnS
 
|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
 
|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
Line 712: Line 827:
 
|
 
|
 
|A
 
|A
−
|-
+
|- bgcolor="#eeffff"
 
! bgcolor="#d0e7ff" align="center" |ZnSe
 
! bgcolor="#d0e7ff" align="center" |ZnSe
 
|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
 
|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
Line 730: Line 845:
 
|
 
|
 
|A
 
|A
−
|-
+
|- bgcolor="#ffffff"
 
! bgcolor="#d0e7ff" align="center" |ZrO<sub>2</sub>
 
! bgcolor="#d0e7ff" align="center" |ZrO<sub>2</sub>
 
|
 
|
Line 748: Line 863:
 
|
 
|
 
|A
 
|A
−
|-
+
|- bgcolor="#eeffff"
 
! bgcolor="#d0e7ff" align="center" |'''Material'''
 
! bgcolor="#d0e7ff" align="center" |'''Material'''
−
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
+
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> <span style="font-size: 88%;">(MRC)</span>]]
−
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
+
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> <span style="font-size: 88%;">(MRC)</span>]]
−
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
+
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
−
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
+
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
−
| bgcolor="#daf1ff" |[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|SLR Fluorine ICP (PlasmaTherm)]]
+
| bgcolor="#daf1ff" |[[ICP Etching Recipes#PlasmaTherm.2FSLR Fluorine Etcher|Fluorine ICP <span style="font-size: 88%;">(PlasmaTherm)</span>]]
−
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic E626I)]]
+
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br><span style="font-size: 88%;">(Panasonic E626I)</span>]]
−
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic E640)]]
+
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br><span style="font-size: 88%;">(Panasonic E640)</span>]]
−
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br>(Unaxis VLR)]]
+
| bgcolor="#daf1ff" |[[ICP Etching Recipes#Oxford ICP Etcher .28PlasmaPro 100 Cobra.29|Oxford ICP <span style="font-size: 88%;">(PlasmaPro 100)</span>]]
−
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
+
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br><span style="font-size: 88%;">(Unaxis VLR)</span>]]
−
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
+
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br><span style="font-size: 88%;">(Technics PEII)</span>]]
−
| width="95" bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean (YES EcoClean)]]
+
| bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean <span style="font-size: 88%;">(YES EcoClean)</span>]]
 
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
 
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
−
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
+
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br><span style="font-size: 88%;">(EVG 810)</span>]]
−
| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br>(Xetch)]]
+
| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br><span style="font-size: 88%;">(Xetch)</span>]]
−
| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
+
| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br><span style="font-size: 88%;">(uETCH)</span>]]
−
| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
+
| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br><span style="font-size: 88%;">(Oxford)</span>]]
 
|}
 
|}
  
 
[[Category:Processing]]
 
[[Category:Processing]]

Latest revision as of 15:40, 17 July 2023

Process Control Data

See linked page for process control data (dep rate/stress etc. over time), for a selection of often-used thin-film depositions.

Dry Etching Tools/Materials Table

  • R: Recipe is available. Clicking this link will take you to the recipe.
  • A: Material is available for use, but no recipes are provided.
Dry Etching Recipes
RIE Etching ICP Etching Oxygen Plasma Systems Other Dry Etchers
Material RIE 2
(MRC) 		RIE 3
(MRC) 		RIE 5
(PlasmaTherm) 		DSEIII
(PlasmaTherm) 		Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic E626I) 		ICP Etch 2
(Panasonic E640) 		Oxford ICP (PlasmaPro 100) ICP-Etch
(Unaxis VLR) 		Ashers
(Technics PEII) 		Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810) 		XeF2 Etch
(Xetch) 		Vapor HF Etch
(uETCH) 		CAIBE
(Oxford)
Ag A
Al A R R A
Au R
Cr A R A A
Cu A
Ge A A A A
Mo A
Nb A A
Ni R
Os A A
Pt R
Ru A R A
Si R R A R A
Ta A A A
Ti R A A
Al2O3 A R A
Al2O3 (Sapphire) R A A
AlGaAs R R R R A
AlGaN R R A
AlN R A
BCB A
CdZnTe R A
GaAs R R R R R A
GaN R R A R R A
GaSb A A A R A
HfO2 A
InGaAlAs R A R A
InGaAsP R R R A
InP R A A R R R
ITO R A
LiNbO3 A
Photoresist

& ARC

A R R R R R R A
Ru A R
SiC R A A
SiN R A R R A A
SiO2 R R R R R A
SiOxNy A A A
SU8 A
Ta2O5 A A A
TiN A
TiO2 A
W-TiW R A A
ZnO2 A
ZnS R A
ZnSe R A
ZrO2 A
Material RIE 2
(MRC) 		RIE 3
(MRC) 		RIE 5
(PlasmaTherm) 		DSEIII
(PlasmaTherm) 		Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic E626I) 		ICP Etch 2
(Panasonic E640) 		Oxford ICP (PlasmaPro 100) ICP-Etch
(Unaxis VLR) 		Ashers
(Technics PEII) 		Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810) 		XeF2 Etch
(Xetch) 		Vapor HF Etch
(uETCH) 		CAIBE
(Oxford)
Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Dry_Etching_Recipes&oldid=161207"