Difference between revisions of "Template:News"

Latest revision as of 18:32, 20 September 2023

News from the U.C. Santa Barbara Nanofabrication Facility.

JEOL SEM's Installed

Both SEM's have been replaced with new JEOL SEM's #1 and SEM #2. SEM#1 has the NABITY lithography system installed, and SEM #2 has always-on EDAX elemental analysis. Contact the supervisor, Aidan Hopkins, for more information. // John d 18:31, 20 September 2023 (PDT)

Wide FOV Microscope Installed

We have installed an AmScope stereo microscope in Bay 4 for wide field-of-view digital imaging/capture, with >2cm of FOV currently available. Wiki page here: AmScope Wide Field of View Stereoscope // John d 14:52, 19 April 2023 (PDT)

Loomis Scribe & Break installed

We have installed a new Loomis LSD-155LT Automated Scribe & Break Cleaving tool in the Back-End Processing lab. Qualifications are underway. Contact supervisor, Aidan Hopkins, for more information. // John d 09:41, 16 April 2023 (PDT)

Dektak XT installed

We have replaced the old Dektak 6M with a new Dektak XT profilometer. This tool will provide robust, fast metrology for rapid in-process topography inspection. // John d 10:41, 25 January 2023 (PST)

New Process Control data tables

We have added "Process Control Data" - data on deposition/etch repeatability - to a number of our highest used etchers and deposition tools. The datasheets are linked in multiple places, mainly on the Recipes pages for each tool, or on the general Recipes pages for Deposition Recipes or Etch Recipes. // John d 16:07, 5 January 2023 (PST)

Oxford PlasmaPro ICP Etcher installed

We have a new ICP etcher in Bay 2: Oxford_ICP_Etcher_(PlasmaPro_100_Cobra)

The tool has been qualified for InP Ridge and InGaAsP Grating etches, and is intended for III-V etching in general (GaAs, GaN, GaSb etc.)

In addition, the tool is capable of Atomic Layer Etching on various materials. Contact the supervisor for training. // John d 11:27, 29 September 2021 (PDT)

SiO2 etching, High-Aspect Ratio

Dr. Bill Mitchell recently published an article detailing high-aspect ratio SiO2 etching (JVST-A, May 2021) in the Plasma-Therm Fluorine ICP etcher, using a novel Ruthenium Hard Mask.

Ruthenium can be deposited using the Oxford ALD or AJA Sputter and etched in one of the Panasonic ICP's.

You can find a full process flow at the FL-ICP's Recipe Page, in this case using a Sputtered Ru hard mask and I-line stepper lithography. // John d 08:05, 27 May 2021 (PDT)

Wafer Polisher available

We have added an Allied Wafer Polish tool to our equipment list. Contact Bill_Millerski for more information. // John d 16:49, 10 May 2021 (PDT)

Digital Microscope: Olympus DSX-1000

You'll see a new digital microscope in Bay 4/Metrology, that's our new Olympus DSX-1000. We are currently developing procedures, keep an eye out for training emails. // John d 13:49, 8 April 2021 (PDT)

Raith Velion: FIB/SEM Installation

We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1. The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.

Learn more about the tool's capabilities at the Raith website:

Tool qualification is currently underway. Dr. Dan Read is the resident expert on this new tool.

// John d 06:53, 30 November 2020 (PST)

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+<!---feedBurner name="UCSBNanofab-NewsFeed" /-->
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-News from the U.C. Santa Barbara Nanofabrication Facility
+''News from the U.C. Santa Barbara Nanofabrication Facility.''
+<!-- these comments only show up when viewing the page source, but not when the page is viewed normally (eg. the RSS feed) -->
+<!--
+'''How to add news items'''
-<!-- the following only shows up when vieweing the template page, but not when the page is included elsewhere (eg. the RSS feed) -->
+* New news item should be inserted at the TOP of the list
-<noinclude>
+* Item titles should have a level 3 heading, like so:  === MyArticleTitle ===
-'''How to add new news items'''
+* Each item should finish with the user signature (four tildes: ~~~~) on it's own separated line.  When you 'Save' the page, this will be replaced with a timestamp and your user name.
+* Then delete your username, leaving only the two dashes, so "[[User:Thibeault|-- Brain Thibeault]]" becomes "[[User:Thibeault|-- ]]"
+* Also delete the "[[... (talk)]]" link
+* The timestamp determines the order of items in the feed. Items without a timestamp will show up at the end of the feed in random order.
+-->
+<!---------------------------------------------->
+<!-------- NEWS ITEMS: newest on top -------->
+=== JEOL SEM's Installed ===
+Both SEM's have been replaced with new JEOL [[SEM_1_(JEOL_IT800SHL)|SEM's #1]] and [[Field_Emission_SEM_2_(JEOL_IT800SHL)|SEM #2]]. SEM#1 has the NABITY lithography system installed, and SEM #2 has always-on EDAX elemental analysis. Contact the [[Aidan_Hopkins|supervisor, Aidan Hopkins]], for more information.
+// [[User:John d|John d]] 18:31, 20 September 2023 (PDT)
+=== Wide FOV Microscope Installed ===
+We have installed an AmScope stereo microscope in Bay 4 for wide field-of-view digital imaging/capture, with >2cm of FOV currently available.  Wiki page here: [[Microscopes#Microscope_.238:_AmScope_Wide_Field_of_View_Stereoscope_.28Bay_4.29|AmScope Wide Field of View Stereoscope]]
+// [[User:John d|John d]] 14:52, 19 April 2023 (PDT)
+=== Loomis Scribe & Break installed ===
+We have installed a new [https://loomisinc.com/lsd-155lt/ Loomis LSD-155LT] Automated Scribe & Break Cleaving tool in the Back-End Processing lab. Qualifications are underway. Contact [[Aidan_Hopkins|supervisor, Aidan Hopkins]], for more information.
+// [[User:John d|John d]] 09:41, 16 April 2023 (PDT)
+=== Dektak XT installed ===
+We have replaced the old Dektak 6M with a new Dektak XT profilometer. This tool will provide robust, fast metrology for rapid in-process topography inspection.
+// [[User:John d|John d]] 10:41, 25 January 2023 (PST)
+=== New Process Control data tables ===
+We have added [[Process_Group_-_Process_Control_Data|"Process Control Data"]] - data on deposition/etch repeatability - to a number of our highest used etchers and deposition tools. The datasheets are linked in multiple places, mainly on the Recipes pages for each tool, or on the general Recipes pages for [[Vacuum_Deposition_Recipes|'''Deposition Recipes''']] or [[Dry_Etching_Recipes|'''Etch Recipes''']].
+// [[User:John d|John d]] 16:07, 5 January 2023 (PST)
+=== Oxford PlasmaPro ICP Etcher installed ===
+We have a new ICP etcher in Bay 2:
+[[Oxford_ICP_Etcher_(PlasmaPro_100_Cobra)]]
+The tool has been qualified for InP Ridge and InGaAsP Grating etches, and is intended for III-V etching in general (GaAs, GaN, GaSb etc.)
+In addition, the tool is capable of Atomic Layer Etching on various materials.  Contact [[Tony_Bosch | the supervisor]] for training.
+// [[User:John d|John d]] 11:27, 29 September 2021 (PDT)
+=== SiO2 etching, High-Aspect Ratio ===
+[[Bill_Mitchell|Dr. Bill Mitchell]] recently published an article detailing [[Template:Publications#Highly_Selective_and_Vertical_Etch_of_Silicon_Dioxide_using_Ruthenium_Films_as_an_Etch_Mask|'''high-aspect ratio SiO2 etching (JVST-A, May 2021)''']] in the [[ICP_Etching_Recipes#PlasmaTherm.2FSLR_Fluorine_Etcher|Plasma-Therm Fluorine ICP etcher]], using a novel Ruthenium Hard Mask.
+Ruthenium can be deposited using the [[Atomic_Layer_Deposition_Recipes#Ru_deposition_.28ALD_CHAMBER_1.29|Oxford ALD]] or [[Sputtering_Recipes#Ru_Deposition_.28Sputter_4.29|AJA Sputter]] and etched in one of the [[ICP_Etching_Recipes#Ru_.28Ruthenium.29_Etch_.28Panasonic_2.29|Panasonic ICP's]].
-* New news item should be inserted at the TOP of the list
+You can find a full process flow at the [[ICP_Etching_Recipes#SiO2_Etching_.28Fluorine_ICP_Etcher.29|FL-ICP's Recipe Page]], in this case using a Sputtered Ru hard mask and I-line stepper lithography.
-* Item titles should have a level 2 heading (`==`)
+// [[User:John d|John d]] 08:05, 27 May 2021 (PDT)
-* Each item should finish with user signature (four tildes `[[User:John d|-- Demis]] ([[User talk:John d|talk]]) 22:37, 27 November 2017 (PST)`).  When you **Save** the page, this will be replaced with a timestamp and your user name.  The timestamp determines the order of items in the feed - items without a timestamp show up at the end.
-</noinclude>
+=== Wafer Polisher available ===
+We have added an [https://wiki.nanotech.ucsb.edu/wiki/Mechanical_Polisher_(Allied) Allied Wafer Polish] tool to our equipment list. Contact [[Bill_Millerski]] for more information.  // [[User:John d|John d]] 16:49, 10 May 2021 (PDT)
-<!-- News items, newest on top -->
+=== Digital Microscope: Olympus DSX-1000 ===
-== New Deep Silicon Etcher ==
+You'll see a new digital microscope in Bay 4/Metrology, that's our new [https://www.olympus-ims.com/en/microscope/dsx1000/high-resolution-model/ Olympus DSX-1000]. We are currently developing procedures, keep an eye out for training emails.
-New Plasma-Therm Versaline DSE III DRIE etcher is qualified for bosch etch and single-step etches, and is available for use.  The new tool features much higher silicon etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer. [[User:John d|-- Demis]] ([[User talk:John d|talk]]) 22:16, 27 November 2017 (PST)
+// [[User:John d|John d]] 13:49, 8 April 2021 (PDT)
-== 2016 Survey Results ==
+=== Raith Velion: FIB/SEM Installation ===
-See the May 2016 User Survey Results:  {{file|Survey052016.pdf|Survey Results}}  [[User:Thibeault|-- Brian Thibeault]] 12:00, 01 May 2016
+We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1.
+The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.
-== CAIBE Ion Mill Available ==
+Learn more about the tool's capabilities at the Raith website:
-The [[CAIBE (Oxford Ion Mill)]] is up and running! Contact [[Brian Lingg]] for more information. [[User:Thibeault|-- Brian Thibeault]] 12:00, 01 July 2015
+* [https://www.raith.com/products/velion.html?mobile=0 Raith Products: Velion].
+* [https://www.youtube.com/watch?v=rW5w6nMhwfQ VIDEO: Synchronized FIB beam + Laser Interferometric Stage write, with live SEM]
-== NanoFiles SFTP Online ==
+Tool qualification is currently underway.
-Files generated with Nanofab tools (SEM images, AFM profiles, etc.) are now available on the nanofab SFTP server. Please check [http://signupmonkey.ece.ucsb.edu SignupMonkey] for details. [[User:Thibeault|-- Brian Thibeault]] 12:00, 07 July 2013
+[[Dan Read|Dr. Dan Read]] is the resident expert on this new tool.
+// [[User:John d|John d]] 06:53, 30 November 2020 (PST)
+<!---------- end of announcements ------------>
+<!---------------------------------------------->
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-<endFeed />
+<endfeed />
 <noinclude>[[Category:Templates]]</noinclude>