Difference between revisions of "Thermal Evap 2 (Solder)"

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Line 214: Line 214:
 
|
 
|
 
|-
 
|-
−
 
−
 
−
 
 
|Manganese
 
|Manganese
 
|Mn
 
|Mn
 
|7.20
 
|7.20
 
|0.377
 
|0.377
 +
|
 +
|
 +
|-
 +
|Manganese(II) Sulfide
 +
|MnS
 +
|3.99
 +
|0.94
 +
|
 +
|
 +
|-
 +
|Mercury
 +
|Hg
 +
|13.46
 +
|0.74
 +
|
 +
|
 +
|-
 +
|Molybdenum
 +
|Mo
 +
|10.2
 +
|0.257
 +
|
 +
|
 +
|-
 +
|Nickel
 +
|Ni
 +
|8.91
 +
|0.331
 +
|
 +
|
 +
|-
 +
|Niobium
 +
|Nb
 +
|8.57
 +
|0.493
 +
|
 +
|
 +
|-
 +
|Niobium(V) Oxide
 +
|Nb2O5
 +
|4.47
 +
|
 +
|
 +
|
 +
|-
 +
|Palladium
 +
|Pd
 +
|12.0
 +
|0.357
 +
|
 +
|
 +
|-
 +
|Platinum
 +
|Pt
 +
|21.4
 +
|0.245
 +
|
 +
|
 +
|-
 +
|Potasium Cloride
 +
|KCl
 +
|1.98
 +
|2.05
 
|
 
|
 
|
 
|
 
|-
 
|-

Revision as of 08:56, 29 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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Materials Table

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