Vacuum Deposition Recipes

Process Control Data

See linked page for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.

Deposition Tools/Materials Table

Process Maturity Ranking

• R6 - most mature process with regular calibrations recorded on SPC charts.
• …
• R1 - least mature - "possible" but you'll have to figure it out.

The Key/Legend for this table's R1...R6 values is at the bottom of the page.

Vacuum Deposition Recipes
	E-Beam Evaporation				Sputtering				Thermal Evaporation		Plasma Enhanced Chemical Vapor Deposition (PECVD)			Atomic Layer Deposition	Molecular Vapor Deposition
Material	E-Beam 1 (Sharon)	E-Beam 2 (Custom)	E-Beam 3 (Temescal)	E-Beam 4 (CHA)	Sputter 3 (AJA ATC 2000-F)	Sputter 4 (AJA ATC 2200-V)	Sputter 5 (AJA ATC 2200-V)	Ion Beam Deposition (Veeco Nexus)	Thermal Evap 1	Thermal Evap 2 (Solder)	PECVD 1 (PlasmaTherm 790)	PECVD 2 (Advanced Vacuum)	Unaxis VLR ICP-PECVD	Atomic Layer Deposition (Oxford FlexAL)	Molecular Vapor Deposition (Tool)
Ag	R2		R2	R2	R1	R1			R1	R1
AgBr
AgCl
Al	R2		R2	R2	R1	R3	R6	R1	R3	R1
Al2O3		R2			R3	R3	R1	R3						R3
AuPd									R1
AuZn									R1
AuSn										R1
AuGe	R1
AlN					R1	R1		R1						R3
Au	R6		R2	R6	R1	R2	R3		R3	R2
B
C	R3
CaF2										R2
CeO2		R3
Co	R2			R2	R3				R1	R1
Cr	R6			R6	R3		R6		R3	R2
Cu	R1				R3	R2			R2	R1
Fe	R2			R2	R3				R1	R1
Ge	R2		R2	R2	R1	R1
GeO2		R1
Gd	R2			R1
Hf	R1			R1
HfO2							R1							R3
Hg
In										R3
Ir	R1			R1
ITO		R4			R1	R1	R1	R1
KCl
LiF
Mg									R1	R1
MgF2					R1	R1				R1
MgO		R2
Mn
MnS
Mo	R2				R3	R1
Na
NaCl
Nb	R2					R3
NbO5
Nd						R1
Ni	R6		R2	R6	R3		R1		R3	R2
NiCr	R2			R2					R3
NiFe	R1			R2	R1				R3
Pd	R2		R2	R2	R1	R1	R1		R3	R1
Pt	R2		R2	R2	R3	R3	R3							R3
Ru	R2			R2		R3								R3
Si		R2			R3	R1		R1				R3
SiN					R3	R1		R6			R6	R6	R6
SiN - Low Stress											R3	R6	R6
SiN - Low Stress 3xTime												R6
SiO2	R2	R2			R3	R1	R2	R6			R6	R6	R6	R3
SiO									R1	R1
SiOxNy								R3			R3
Sn										R2
SrF2		R2							R1
Ta	R1				R3	R1		R1
Ta2O5		R1						R6
Ti	R6		R2	R6	R3	R3	R6	R1
TiN						R3		R1						R3
TiW	R1				R3	R3
TiO2		R2			R1	R3		R3						R3
V					R1	R1
W	R2				R3	R3
WC
Zn									R3	R2
ZnO														R3
Zr	R2			R2	R1	R1				R1
ZrO2														R3
Material	E-Beam 1 (Sharon)	E-Beam 2 (Custom)	E-Beam 3 (Temescal)	E-Beam 4 (CHA)	Sputter 3 (ATC 2000-F)	Sputter 4 (ATC 2200-V)	Sputter 5 (ATC 2200-V)	Ion Beam Deposition (Veeco Nexus)	Thermal Evap 1	Thermal Evap 2 (Solder)	PECVD 1 (PlasmaTherm 790)	PECVD 2 (Advanced Vacuum)	Unaxis VLR ICP-PECVD	Atomic Layer Deposition (Oxford FlexAl)	Molecular Vapor Deposition (Tool)

Process Ranking Table

Processes in the table above are ranked by their "Process Maturity Level" as follows:

Process Level	Description of Process Level Ranking
A	Process Allowed and materials available but never done
R1	Process has been ran at least once
R2	Process has been ran and procedure is documented
R3	Process has been ran, procedure is documented, and data is available
R4	Process has a documented procedure with regular (≥4x per year) data no in-Situ control available
R5	Process has a documented procedure with regular (≥4x per year) data and in-Situ control available
R6	Process has a documented procedure and control charts/limits available.  Controlled process.