Vacuum Deposition Recipes

Process Control Data

See linked page for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.

Deposition Tools/Materials Table

The Key/Legend for this table's A...R6 values is at the bottom of the page.

Vacuum Deposition Recipes
	E-Beam Evaporation				Sputtering				Thermal Evaporation		Plasma Enhanced Chemical Vapor Deposition (PECVD)			Atomic Layer Deposition	Molecular Vapor Deposition
Material	E-Beam 1 (Sharon)	E-Beam 2 (Custom)	E-Beam 3 (Temescal)	E-Beam 4 (CHA)	Sputter 3 (AJA ATC 2000-F)	Sputter 4 (AJA ATC 2200-V)	Sputter 5 (AJA ATC 2200-V)	Ion Beam Deposition (Veeco Nexus)	Thermal Evap 1	Thermal Evap 2 (Solder)	PECVD 1 (PlasmaTherm 790)	PECVD 2 (Advanced Vacuum)	Unaxis VLR ICP-PECVD	Atomic Layer Deposition (Oxford FlexAL)	Molecular Vapor Deposition (Tool)
Ag	R2		R2	R2	A	A
Al	R2		R2	R2	A	R1		R1	A	A
Al2O3		R2			A	R1		R5						R4
AuGe	R1
AlN					A	A		R1						R4
Au	R2		R2	R2	A	R1			A	A
B
C	R3
CeO2		R3
Co	R2			R2	R
Cr	R1			R2	R				A	A
Cu	R1				R1	A
Fe	R2			R2	R
Ge	R2		R2	R2	A	A
GeO2		R2
Gd	R2			R1
Hf	R1			R1
HfO2					A	A								R4
In										A
Ir	R1			R1
ITO		R3			A	A		R1
MgF2					A	A
MgO		R2
Mo	R2				R	A
Nb	R2					R
Nd						A
Ni	R2		R2	R2	R1				A	A
NiCr	R2			R2
NiFe	R1			R2	A
Pd	R2		R2	R2					A	A
Pt	R2		R2	R2	A	R1	R1							R4
Ru	R2			R2		R								R4
Si		R2			R	A		R1				R3
SiN					R1	A		R6			R6	R6	R6
SiN - Low Stress											R4	R6	R6
SiO2	R2	R2			R1	A	A	R6			R6	R6	R6	R4
SiOx		R1
SiOxNy								R3			R4
Sn										A
SrF2		R2
Ta	R1				R1	A		R1
Ta2O5		R1		R1				R6
Ti	R2		R2	R2	R1	R1	R1	R1
TiN						R		R1						R4
TiW	R1				A	R1
TiO2		R2			A	R1		R5						R4
V					A	A
W	R2				A	R1
Zn									A	A
ZnO														R3
Zr	R2			R2	A	A
ZrO2														R4
Material	E-Beam 1 (Sharon)	E-Beam 2 (Custom)	E-Beam 3 (Temescal)	E-Beam 4 (CHA)	Sputter 3 (ATC 2000-F)	Sputter 4 (ATC 2200-V)	Sputter 5 (ATC 2200-V)	Ion Beam Deposition (Veeco Nexus)	Thermal Evap 1	Thermal Evap 2 (Solder)	PECVD 1 (PlasmaTherm 790)	PECVD 2 (Advanced Vacuum)	Unaxis VLR ICP-PECVD	Atomic Layer Deposition (Oxford FlexAl)	Molecular Vapor Deposition (Tool)

Process Ranking Table

Processes in the table above are ranked by their "Process Maturity Level" as follows:

Process Level	Description of Process Level Ranking
A	Process Allowed and materials available but never done
R1	Process has been ran at least once
R2	Process has been ran and/or procedure is documented or/and data available
R3	Process has been ran, procedure is documented, and data is available
R4	Process has a documented procedure with regular (≥4x per year) data or lookahead/in-Situ control available
R5	Process has a documented procedure with regular (≥4x per year) data and lookahead/in-Situ control available
R6	Process has a documented procedure, regular ( ≥4x per year) data, and control charts/limits available