Vacuum Deposition Recipes: Difference between revisions

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| width="65" bgcolor="#DAF1FF" | [[Sputtering_Recipes#Sputter_4_.28AJA_ATC_2200-V.29|Sputter 4<br>(ATC 2200-V)]]
| width="65" bgcolor="#DAF1FF" | [[Sputtering_Recipes#Sputter_4_.28AJA_ATC_2200-V.29|Sputter 4<br>(ATC 2200-V)]]
| width="65" bgcolor="#DAF1FF" | [[Sputtering Recipes#Sputter_5_.28Lesker_AXXIS.29|Sputter 5 (Lesker AXXIS)]]
| width="65" bgcolor="#DAF1FF" | [[Sputtering Recipes#Sputter_5_.28Lesker_AXXIS.29|Sputter 5 (Lesker AXXIS)]]
| width="55" bgcolor="#DAF1FF" | [[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|Ion Beam<br>Deposition (Tool)]]
| width="55" bgcolor="#DAF1FF" | [[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|Ion Beam<br>Deposition (Veeco Nexus)]]
| width="45" bgcolor="#DAF1FF" | [[Thermal Evaporation Recipes#Thermal_Evap_1|Thermal<br>Evap 1]]
| width="45" bgcolor="#DAF1FF" | [[Thermal Evaporation Recipes#Thermal_Evap_1|Thermal<br>Evap 1]]
| width="65" bgcolor="#DAF1FF" | [[Thermal Evaporation Recipes#Thermal_Evap_2_.28Solder.29|Thermal Evap 2 (Solder)]]
| width="65" bgcolor="#DAF1FF" | [[Thermal Evaporation Recipes#Thermal_Evap_2_.28Solder.29|Thermal Evap 2 (Solder)]]
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| width="65" bgcolor="#DAF1FF" | [[PECVD Recipes#PECVD_2_.28Advanced_Vacuum.29|PECVD 2<br>(Advanced Vacuum)]]
| width="65" bgcolor="#DAF1FF" | [[PECVD Recipes#PECVD_2_.28Advanced_Vacuum.29|PECVD 2<br>(Advanced Vacuum)]]
| width="65" bgcolor="#DAF1FF" | [[PECVD_Recipes#ICP-PECVD_.28Unaxis_VLR.29|Unaxis VLR ICP-PECVD]]
| width="65" bgcolor="#DAF1FF" | [[PECVD_Recipes#ICP-PECVD_.28Unaxis_VLR.29|Unaxis VLR ICP-PECVD]]
| width="65" bgcolor="#DAF1FF" | [[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition (Tool)]]
| width="65" bgcolor="#DAF1FF" | [[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition (Oxford FlexAL)]]
| width="65" bgcolor="#DAF1FF" | [[Molecular Vapor Deposition|Molecular Vapor Deposition (Tool)]]
| width="65" bgcolor="#DAF1FF" | [[Molecular Vapor Deposition|Molecular Vapor Deposition (Tool)]]
|-
|-
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| width="65" bgcolor="#DAF1FF" | [[Sputtering_Recipes#Sputter_4_.28AJA_ATC_2200-V.29|Sputter 4<br>(ATC 2200-V)]]
| width="65" bgcolor="#DAF1FF" | [[Sputtering_Recipes#Sputter_4_.28AJA_ATC_2200-V.29|Sputter 4<br>(ATC 2200-V)]]
| width="65" bgcolor="#DAF1FF" | [[Sputtering Recipes#Sputter_5_.28Lesker_AXXIS.29|Sputter 5 (Lesker AXXIS)]]
| width="65" bgcolor="#DAF1FF" | [[Sputtering Recipes#Sputter_5_.28Lesker_AXXIS.29|Sputter 5 (Lesker AXXIS)]]
| width="55" bgcolor="#DAF1FF" | [[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|Ion Beam<br>Deposition (Tool)]]
| width="55" bgcolor="#DAF1FF" | [[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|Ion Beam<br>Deposition (Veeco Nexus)]]
| width="45" bgcolor="#DAF1FF" | [[Thermal Evaporation Recipes#Thermal_Evap_1|Thermal<br>Evap 1]]
| width="45" bgcolor="#DAF1FF" | [[Thermal Evaporation Recipes#Thermal_Evap_1|Thermal<br>Evap 1]]
| width="65" bgcolor="#DAF1FF" | [[Thermal Evaporation Recipes#Thermal_Evap_2_.28Solder.29|Thermal Evap 2 (Solder)]]
| width="65" bgcolor="#DAF1FF" | [[Thermal Evaporation Recipes#Thermal_Evap_2_.28Solder.29|Thermal Evap 2 (Solder)]]
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| width="65" bgcolor="#DAF1FF" | [[PECVD Recipes#PECVD_2_.28Advanced_Vacuum.29|PECVD 2<br>(Advanced Vacuum)]]
| width="65" bgcolor="#DAF1FF" | [[PECVD Recipes#PECVD_2_.28Advanced_Vacuum.29|PECVD 2<br>(Advanced Vacuum)]]
| width="65" bgcolor="#DAF1FF" | [[PECVD_Recipes#ICP-PECVD_.28Unaxis_VLR.29|Unaxis VLR ICP-PECVD]]
| width="65" bgcolor="#DAF1FF" | [[PECVD_Recipes#ICP-PECVD_.28Unaxis_VLR.29|Unaxis VLR ICP-PECVD]]
| width="65" bgcolor="#DAF1FF" | [[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition (Tool)]]
| width="65" bgcolor="#DAF1FF" | [[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition (Oxford FlexAl)]]
| width="65" bgcolor="#DAF1FF" | [[Molecular Vapor Deposition|Molecular Vapor Deposition (Tool)]]
| width="65" bgcolor="#DAF1FF" | [[Molecular Vapor Deposition|Molecular Vapor Deposition (Tool)]]
|}
|}

Revision as of 01:12, 16 December 2015

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Vacuum Deposition Recipes

E-Beam Evaporation Sputtering Thermal Evaporation Plasma Enhanced Chemical
Vapor Deposition (PECVD)
Atomic Layer Deposition Molecular Vapor Deposition
Material E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 1 (Custom) Sputter 2
(SFI Endeavor)
Sputter 3
(ATC 2000-F)
Sputter 4
(ATC 2200-V)
Sputter 5 (Lesker AXXIS) Ion Beam
Deposition (Veeco Nexus)
Thermal
Evap 1
Thermal Evap 2 (Solder) PECVD 1
(PlasmaTherm 790)
PECVD 2
(Advanced Vacuum)
Unaxis VLR ICP-PECVD Atomic Layer Deposition (Oxford FlexAL) Molecular Vapor Deposition (Tool)
Ag A
A A

A A








Al A
A A
R1 A R

A A




Al2O3 A A



A A
A




R1
AlN




R1 A A
A




R1
Au A
A A
R1 A R1

A A




B
















Co A

A

R









Cr A

A

R


A A




Cu A




A A








Fe A

A

R









Ge A
A A

A A








GeO2 A
Gd A

A












Hf A















HfO2





A A






R1
In










A




Ir A















ITO
A



A A
A






MgF2 A A
MgO A
Mo A




A A








Nb A





R








Nd





A








Ni A
A A

R1


A A




NiCr A A
NiFe A A A
Pd A
A A





A A




Pt A
A A

A R






R1
Ru A

A












Si
A



A A




R R

SiN





R1 A
R

R1 R1 R1

SiO2 A A



R1 A
R

R1 R1 R1 R1
SiOxNy








A

R



Sn










A




SrF2
A














Ta A




R1 A








Ta2O5


A




R






Ti A
A A

A R1








TiN




A
R
A




R1
TiW A




A R1








TiO2
A


R1 A A
R




R1
V





A A








W A




A R1








Zn









A A




ZnO














R1
Zr A

A

A A








ZrO2














R1
Material E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 1 (Custom) Sputter 2
(SFI Endeavor)
Sputter 3
(ATC 2000-F)
Sputter 4
(ATC 2200-V)
Sputter 5 (Lesker AXXIS) Ion Beam
Deposition (Veeco Nexus)
Thermal
Evap 1
Thermal Evap 2 (Solder) PECVD 1
(PlasmaTherm 790)
PECVD 2
(Advanced Vacuum)
Unaxis VLR ICP-PECVD Atomic Layer Deposition (Oxford FlexAl) Molecular Vapor Deposition (Tool)