Template:News: Difference between revisions
m (fix comment tag) |
(laser monitors) |
||
| Line 16: | Line 16: | ||
<!----------------------------------------------> |
<!----------------------------------------------> |
||
<!-------- NEWS ITEMS: newest on top --------> |
<!-------- NEWS ITEMS: newest on top --------> |
||
=== Laser Endpoint Monitors === |
|||
We've installed new [[http://www.intellemetrics.com/LEP.htm Intellemetrics LEP500 Laser Endpoint Detection]] monitoring on the DSEiii & ICP#2 etchers. We are in the process of installing one onto ICP#1. |
|||
[[User:John d|John d]] ([[User talk:John d|talk]]) 11:53, 9 February 2018 (PST) |
|||
=== Metal Processes on the Atomic Layer Deposition === |
=== Metal Processes on the Atomic Layer Deposition === |
||
We now have Ruthenium (Ru) and Platinum (Pt) metal depositions developed on the [[Atomic_Layer_Deposition_(Oxford_FlexAL)|Oxford FlexAL ALD]] tool. See the [[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition: Recipes]] page or contact [[Bill_Mitchell|Bill Mitchell]] for more information. |
We now have Ruthenium (Ru) and Platinum (Pt) metal depositions developed on the [[Atomic_Layer_Deposition_(Oxford_FlexAL)|Oxford FlexAL ALD]] tool. See the [[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition: Recipes]] page or contact [[Bill_Mitchell|Bill Mitchell]] for more information. |
||
| Line 21: | Line 26: | ||
=== New Deep Silicon Etcher Online === |
=== New Deep Silicon Etcher Online === |
||
A new [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|Plasma-Therm Versaline DSE III DRIE etcher]] has been qualified for bosch etch and single-step etches, and is available for use. The new tool features much higher silicon etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer. |
A new [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|Plasma-Therm Versaline DSE III DRIE etcher]] has been qualified for bosch etch and single-step etches, and is available for use. The new tool features much higher silicon etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer. An Intellemetrics LEP500 laser end point monitor has also been installed on the system. |
||
[[User:John d|-- ]] 22:16, 27 November 2017 (PST) |
[[User:John d|-- ]] 22:16, 27 November 2017 (PST) |
||
Revision as of 19:53, 9 February 2018
News from the U.C. Santa Barbara Nanofabrication Facility.
Laser Endpoint Monitors
We've installed new [Intellemetrics LEP500 Laser Endpoint Detection] monitoring on the DSEiii & ICP#2 etchers. We are in the process of installing one onto ICP#1. John d (talk) 11:53, 9 February 2018 (PST)
Metal Processes on the Atomic Layer Deposition
We now have Ruthenium (Ru) and Platinum (Pt) metal depositions developed on the Oxford FlexAL ALD tool. See the Atomic Layer Deposition: Recipes page or contact Bill Mitchell for more information.
New Deep Silicon Etcher Online
A new Plasma-Therm Versaline DSE III DRIE etcher has been qualified for bosch etch and single-step etches, and is available for use. The new tool features much higher silicon etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer. An Intellemetrics LEP500 laser end point monitor has also been installed on the system.
-- 22:16, 27 November 2017 (PST)
2016 Survey Results
See the May 2016 User Survey Results.
-- 12:00, 01 May 2016 (PST)
CAIBE Ion Mill Available
The CAIBE (Oxford Ion Mill) is up and running! Contact Brian Lingg for more information.
-- 12:00, 01 July 2015 (PST)
NanoFiles SFTP Online
Files generated with Nanofab tools (SEM images, AFM profiles, etc.) are now available on the nanofab SFTP server. Please check SignupMonkey for details.
-- 12:00, 07 July 2013 (PST)