Difference between revisions of "Surface Analysis (KLA/Tencor Surfscan)"
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− | =About= |
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This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 6 inches. |
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 6 inches. |
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− | =Documentation= |
+ | ==Documentation== |
*[[KLA-Tencor Surfscan - Standard Operating Procedure|Standard Operating Procedure]] |
*[[KLA-Tencor Surfscan - Standard Operating Procedure|Standard Operating Procedure]] |
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*[[media:Surfscan-Operation-Manual.pdf|Operations Manual]] |
*[[media:Surfscan-Operation-Manual.pdf|Operations Manual]] |
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**''For detailed measurement info, it is highly recommended that you read the manual.'' |
**''For detailed measurement info, it is highly recommended that you read the manual.'' |
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*[[media:Surfscan-Surfscan 6200 info.pdf|Surfscan Info]] |
*[[media:Surfscan-Surfscan 6200 info.pdf|Surfscan Info]] |
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+ | === Screenshots === |
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Revision as of 09:44, 11 April 2019
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About
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 6 inches.
Documentation
- Standard Operating Procedure
- Operations Manual
- For detailed measurement info, it is highly recommended that you read the manual.
- Surfscan Info