Packaging Recipes: Difference between revisions
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!Flange Diam. |
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!Blade Exposure |
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|2.187" (55.55mm) |
|2.187" (55.55mm) |
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|47mm |
|47mm |
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|4.275mm |
|4.275mm |
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|2.187" (55.55mm) |
|2.187" (55.55mm) |
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|49mm |
|49mm |
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|3.275mm |
|3.275mm |
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|2.187" (55.55mm) |
|2.187" (55.55mm) |
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|51mm |
|51mm |
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|2.275mm |
|2.275mm |
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|''51mm Currently Unavailable'' |
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|2.187" (55.55mm) |
|2.187" (55.55mm) |
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|52mm |
|52mm |
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|1.775mm |
|1.775mm |
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|2.187" (55.55mm) |
|2.187" (55.55mm) |
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|53mm |
|53mm |
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|1.275mm |
|1.275mm |
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=== Mounting/Unmounting Samples === |
=== Mounting/Unmounting Samples === |
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Revision as of 20:04, 24 July 2019
Dicing Saw Recipes (ADT 7100)
Recommended Dicing Parameters
| Material | Blade P/N | Spindle Speed
(KRPM) |
Cut Speed
(mm/s) |
|---|---|---|---|
| Alumina, AlN | 2.187-8C-54RU-3 | 25 | 0.5-2 |
| Ceramic | 2.187-4C-30RU-3 | 18 | 0.5-2 |
| GaAs | 2.187-4C-9RU-3 | 35 | 1-5 |
| GaN (<550um) | 2.187-4C-30RU-3 | 35 | 0.5-3 |
| GaN (>550um) | 2.187-8C-30RU-3 | 35 | 0.5-2 |
| Glass/Fused Silica | 2.187-4C-22RU-3 | 25 | 1-5 |
| InP | 2.187-4C-9RU-3 | 35 | 1-5 |
| QuCalculated Blades Exposuresartz | 2.187-4C-30RU-3 | 25 | 1-5 |
| Sapphire | 2.187-8C-54RU-3 | 18 | 0.5-2 |
| Si | 2.187-4C-9RU-3 | 35 | 4-10 |
| Si on Glasss | 2.187-4C-9RU-3 | 25 | 1-5 |
| SiC | 2.187-8C-30RU-3 | 25 | 0.5-2 |
| Ti | 2.187-8C-54RU-3 | 15 | 0.5-2 |
Calculated Blade Exposures
| Blade Diam | Flange Diam. | Blade Exposure | |
|---|---|---|---|
| 2.187" (55.55mm) | 47mm | 4.275mm | |
| 2.187" (55.55mm) | 49mm | 3.275mm | |
| 2.187" (55.55mm) | 51mm | 2.275mm | 51mm Currently Unavailable |
| 2.187" (55.55mm) | 52mm | 1.775mm | |
| 2.187" (55.55mm) | 53mm | 1.275mm |
Mounting/Unmounting Samples
The UV-Release Tape dispenser is most-often used for mounting sample for dicing.
The Tape Model installed is Ultron 1042R. Data Sheet Here.
- Procedure for mounting sample on UV-Release Tape
- Full Release: 60 sec exposure
- Partial Release for Shipping: 9 sec exposure
Surface Protection
Users most often use sacrificial photoresists to protect the surface from accumulating dicing dust. The static-buildup of dielectric films causes the dust to adhere strongly. Ensure that the PR thickness will adequately coat all your exposed topography (eg. use a ≥2µm thick PR for protecting 1.5-2.0µm tall etched features).
- Choose a photoresist of appropriate thickness, and spin-coat it & soft-bake it according to a standard recipe. Contact Alignment PR Recipes Stepper PR Recipes
- Perform your dicing
- Strip the PR in Acetone and ISO & N2 dry
Wafer Bonder (Logitech WBS7)
This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax.