Packaging Recipes: Difference between revisions
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=== Recommended Dicing Parameters === |
=== Recommended Dicing Parameters === |
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This table is for our stocked Resnoid blades: -4C blades are 4mils/100µm wide, while -8C blades are 8mils/200µm wide. Plan for ~50–100µm extra edge clearance to account for chipping etc. |
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Narrower (~30-50µm) Nickel Hubbed blades are often used for even narrower dicing streets, these must be purchased by the user. |
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=== Surface Protection === |
=== Surface Protection === |
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==== Photoresist ==== |
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Users most often use sacrificial photoresists to protect the surface from accumulating dicing dust. The static-buildup of dielectric films causes the dust to adhere strongly. Ensure that the PR thickness will adequately coat all your exposed topography (eg. use a ≥2µm thick PR for protecting 1.5-2.0µm tall etched features). |
Users most often use sacrificial photoresists to protect the surface from accumulating dicing dust. The static-buildup of dielectric films causes the dust to adhere strongly. Ensure that the PR thickness will adequately coat all your exposed topography (eg. use a ≥2µm thick PR for protecting 1.5-2.0µm tall etched features). |
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# Choose a photoresist of appropriate thickness, and spin-coat it & soft-bake it according to a standard recipe. |
# Choose a photoresist of appropriate thickness, and spin-coat it & soft-bake it according to a standard recipe. |
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# Remove the die from the UV release tape (60sec UV Exposure) |
# Remove the die from the UV release tape (60sec UV Exposure) |
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# Strip the PR from each die in Acetone and ISO & N2 dry |
# Strip the PR from each die in Acetone and ISO & N2 dry |
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==== Blue Tape ==== |
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Alternatively our low-tack residue-free Blue tape can be used to protect the die surface. Blue tape removal is easy for large die, but does require manual removal from each die, and eliminates sample exposure to solvents. |
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The very edges of the die may accumulate a bit more dicing dust due to the tape delaminating slightly during dicing. Plan for about 50-100µm of edge clearance on each die. |
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== [[Wafer Bonder (Logitech WBS7)]] == |
== [[Wafer Bonder (Logitech WBS7)]] == |
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This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax. |
This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax. |
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Revision as of 17:58, 7 August 2019
Dicing Saw Recipes (ADT 7100)
Recommended Dicing Parameters
This table is for our stocked Resnoid blades: -4C blades are 4mils/100µm wide, while -8C blades are 8mils/200µm wide. Plan for ~50–100µm extra edge clearance to account for chipping etc.
Narrower (~30-50µm) Nickel Hubbed blades are often used for even narrower dicing streets, these must be purchased by the user.
| Material | Blade P/N | Spindle Speed
(KRPM) |
Cut Speed
(mm/s) |
|---|---|---|---|
| Alumina, AlN | 2.187-8C-54RU-3 | 25 | 0.5-2 |
| Ceramic | 2.187-4C-30RU-3 | 18 | 0.5-2 |
| GaAs | 2.187-4C-9RU-3 | 35 | 1-5 |
| GaN (<550um) | 2.187-4C-30RU-3 | 35 | 0.5-3 |
| GaN (>550um) | 2.187-8C-30RU-3 | 35 | 0.5-2 |
| Glass/Fused Silica | 2.187-4C-22RU-3 | 25 | 1-5 |
| InP | 2.187-4C-9RU-3 | 35 | 1-5 |
| QuCalculated Blades Exposuresartz | 2.187-4C-30RU-3 | 25 | 1-5 |
| Sapphire | 2.187-8C-54RU-3 | 18 | 0.5-2 |
| Si | 2.187-4C-9RU-3 | 35 | 4-10 |
| Si on Glasss | 2.187-4C-9RU-3 | 25 | 1-5 |
| SiC | 2.187-8C-30RU-3 | 25 | 0.5-2 |
| Ti | 2.187-8C-54RU-3 | 15 | 0.5-2 |
Calculated Blade Exposures
| Blade Diam | Flange Diam. | Blade Exposure | |
|---|---|---|---|
| 2.187" (55.55mm) | 47mm | 4.275mm | |
| 2.187" (55.55mm) | 49mm | 3.275mm | |
| 2.187" (55.55mm) | 51mm | 2.275mm | 51mm Currently Unavailable |
| 2.187" (55.55mm) | 52mm | 1.775mm | |
| 2.187" (55.55mm) | 53mm | 1.275mm |
Mounting/Unmounting Samples
The UV-Release Tape dispenser is most-often used for mounting sample for dicing.
The Tape Model installed is Ultron 1042R. Data Sheet Here.
- Procedure for mounting sample on UV-Release Tape
- Full Release: 60 sec exposure
- Partial Release for Shipping: 9 sec exposure
Surface Protection
Photoresist
Users most often use sacrificial photoresists to protect the surface from accumulating dicing dust. The static-buildup of dielectric films causes the dust to adhere strongly. Ensure that the PR thickness will adequately coat all your exposed topography (eg. use a ≥2µm thick PR for protecting 1.5-2.0µm tall etched features).
- Choose a photoresist of appropriate thickness, and spin-coat it & soft-bake it according to a standard recipe.
- Perform your dicing
- Remove the die from the UV release tape (60sec UV Exposure)
- Strip the PR from each die in Acetone and ISO & N2 dry
Blue Tape
Alternatively our low-tack residue-free Blue tape can be used to protect the die surface. Blue tape removal is easy for large die, but does require manual removal from each die, and eliminates sample exposure to solvents.
The very edges of the die may accumulate a bit more dicing dust due to the tape delaminating slightly during dicing. Plan for about 50-100µm of edge clearance on each die.
Wafer Bonder (Logitech WBS7)
This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax.