Bill Millerski: Difference between revisions
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{{staff|{{PAGENAME}} |
{{staff|{{PAGENAME}} |
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|position = Equipment Engineer |
|position = Senior Equipment Engineer |
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|room = 1109F |
|room = 1109F |
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|phone = (805) |
|phone = (805) 839-2655 |
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|cell = |
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|email = wmillerski@ucsb.edu |
|email = wmillerski@ucsb.edu |
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}} |
}} |
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=About= |
= About = |
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=Current Work= |
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=Tools= |
=Tools= |
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{{PAGENAME}} is the supervisor for the following tools. |
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{| |
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* [[Atomic Layer Deposition (Oxford FlexAL)]] |
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* [[Stepper 1 (GCA 6300)]] |
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* [[Stepper 2 (AutoStep 200)]] |
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* [[Ion Beam Deposition (Veeco NEXUS)]] |
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* [[RIE 5 (PlasmaTherm)]] |
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* [[Rapid Thermal Processor (AET RX6)]] |
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* [[Rapid Thermal Processor (SSI Solaris 150)]] |
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* [[Step Profilometer (KLA Tencor P-7)]] |
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* [[Chemical-Mechanical Polisher (Logitech)]] |
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* [[XeF2 Etch (Xetch)]] |
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* [[Mechanical Polisher (Allied)]] |
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* [[Tube Furnace Wafer Bonding (Thermco)]] |
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* [[E-Beam 1 (Sharon)]] |
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* [[Resistivity Mapper (CDE RESMAP)]] |
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* [[Optical Film Thickness (Nanometric)]] |
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* [[Vapor HF Etch]] |
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* [[Wafer Bonder (Logitech WBS7)]] |
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Latest revision as of 15:28, 28 October 2021
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About
.
.
.
Tools
Bill Millerski is the supervisor for the following tools.