Wafer Cleaver (PELCO Flip-Scribe)

Wafer Cleaver (PELCO Flip-Scribe) Tool Type Packaging Location ESB 1106? Supervisor Brian Thibeault Supervisor Phone (805) 893-2268 Supervisor E-Mail thibeault@ece.ucsb.edu Description Manual Cleaving Manufacturer TedPella Inc. Model PELCO Flip-Scribe

About

The Flip-Scribe is a manual scribe+break cleaving system, with a diamond tip that scribes along the underside of the part/wafer. The user manually drags the part across the diamond scribe, using the guides and stops to push the part in a controlled, straight line. Manual breaking tools are provided to perform the break after scribing.

Can scribe/break ~350µm thick sapphire wafers. Thicker/more difficult to cleave parts should be thinned down on the Allied Polisher before cleaving.

Detailed Specifications

• Wafer/Parts Sizes: 4" down to ~10mm
• Digital microscope w/ laptop for finer alignment
• ~100µm alignment accuracy

Operating Procedures

• Flipscribe SOP - To be added

Recipes

• Recipes > Packaging > To Be Added

Be sure to also see the recipes for protecting your sample from dicing dust on the Packaging Recipes page.