Vacuum Deposition Recipes: Difference between revisions

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=== [[Process Group - Process Control Data#Deposition .28Process Control Data.29|<u>Process Control Data</u>]] ===
See [[Process Group - Process Control Data#Deposition .28Process Control Data.29|linked page]] for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.

=== Deposition Tools/Materials Table ===
{{Recipe Table Explanation}}
{{Recipe Table Explanation}}

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Revision as of 22:55, 8 June 2022

Process Control Data

See linked page for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.

Deposition Tools/Materials Table

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.


Vacuum Deposition Recipes

E-Beam Evaporation Sputtering Thermal Evaporation Plasma Enhanced Chemical
Vapor Deposition (PECVD)
Atomic Layer Deposition Molecular Vapor Deposition
Material E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 3
(AJA ATC 2000-F)
Sputter 4
(AJA ATC 2200-V)
Sputter 5 (AJA ATC 2200-V) Ion Beam
Deposition (Veeco Nexus)
Thermal
Evap 1
Thermal Evap 2 (Solder) PECVD 1
(PlasmaTherm 790)
PECVD 2
(Advanced Vacuum)
Unaxis VLR ICP-PECVD Atomic Layer Deposition (Oxford FlexAL) Molecular Vapor Deposition (Tool)
Ag A
A A A A








Al A
A A A R1

A
A A




Al2O3 A A

A R1
R




R1
AlN



A A
A




R1
Au A
A A A R1

A A




B














C R1
CeO2
CeO2 deposition (E-Beam 2)












Co A

A R









Cr A

A R


A A




Cu A


R1 A








Fe A

A R









Ge A
A A A A








GeO2 A
Gd A

A










Hf A













HfO2



A A






R1
In








A




Ir A













ITO
ITO deposition (E-Beam 2)

A A
A






MgF2 A A
MgO A
Mo A


R A








Nb A



R








Nd



A








Ni A
A A R1


A A




NiCr A A
NiFe A A A
Pd A
A A



A A




Pt A
A A A R1 R1





R1
Ru A

A
R






R1
Si
A

R A

A



R

SiN



R1 A
R

R1 R1 R1

SiN - Low Stress R1 R1 R1
SiO2 A A

R1 A A R

R1 R1 R1 R1
SiOxNy






R

R



Sn








A




SrF2
A












Ta A


R1 A

A







Ta2O5


A


R






Ti A
A A R1 R1 R1
A







TiN




R
A




R1
TiW A


A R1








TiO2
A

A R1
R




R1
V



A A








W A


A R1








Zn







A A




ZnO












R1
Zr A

A A A








ZrO2












R1
Material E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 3
(ATC 2000-F)
Sputter 4
(ATC 2200-V)
Sputter 5 (ATC 2200-V) Ion Beam
Deposition (Veeco Nexus)
Thermal
Evap 1
Thermal Evap 2 (Solder) PECVD 1
(PlasmaTherm 790)
PECVD 2
(Advanced Vacuum)
Unaxis VLR ICP-PECVD Atomic Layer Deposition (Oxford FlexAl) Molecular Vapor Deposition (Tool)