MLA Recipes: Difference between revisions
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|[[:File:SPR220-Positive-Resist-Datasheet.pdf|SPR 220-7.0]] |
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|3.5 krpm/30s |
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|105°C/90” |
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|~ 7 µm |
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|375 |
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|550 |
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| - 20 |
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|115°C/90s |
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|AZ300MIF |
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|70s |
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|Used MLA design |
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|[[:File:SPR220-Positive-Resist-Datasheet.pdf|SPR 220-3.0]] |
|[[:File:SPR220-Positive-Resist-Datasheet.pdf|SPR 220-3.0]] |
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low dose for clear-field, high does for dark-field |
low dose for clear-field, high does for dark-field |
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===Negative Resist (MLA150)=== |
===Negative Resist (MLA150)=== |
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''General notes: Hotplates used, filters, laser wavelengths, etc. “Soft Bake” is right after spin, “PEB” is post-exposure bake - right after exposure. “Flood exposure” is only for AZ5214 for image reversal, after PEB.'' |
''General notes: Hotplates used, filters, laser wavelengths, etc. “Soft Bake” is right after spin, “PEB” is post-exposure bake - right after exposure. “Flood exposure” is only for AZ5214 for image reversal, after PEB.'' |
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Revision as of 19:08, 9 May 2024
Maskless Aligner (Heidelberg MLA150)
Photolithography Recipes for the Heidelberg MLA150. Description of litho params- different lasers available, greyscale etc.
Positive Resist (MLA150)
General notes: Hotplates used, filters, laser wavelengths, etc. “Soft Bake” is right after spin, “PEB” is post-exposure bake - right after exposure
| Resist | Spin Cond. | Soft Bake | Thickness | Laser (nm) | Exposure Dose (mJ/cm2) | DeFocus | Post-Exposure Bake | Developer | Developer Time | Comments |
|---|---|---|---|---|---|---|---|---|---|---|
| AZ4110 | 4 krpm/30s | 95°C/60s | ~ 1.1 µm | 405 | 240 | 5 | none | AZ400K:DI 1:4 | 50s | Used MLA design (good for isolated lines 0.8-1um) |
| AZ4330 | 4 krpm/30s | 95°C/60s | ~ 3.3 µm | 405 | 320 | 6 | none | AZ400K:DI 1:4 | 90s | Used MLA design |
| AZ4620 | ||||||||||
| SPR 220-7.0 | 3.5 krpm/30s | 105°C/90” | ~ 7 µm | 375 | 550 | - 20 | 115°C/90s | AZ300MIF | 70s | Used MLA design |
| SPR 220-3.0 | 2.5 krpm/30s | 115°C/90” | ~ 2.7 µm | 405 | 325 | - 4 | 115°C/90s | AZ300MIF | 60s | Used MLA design |
| SPR 955-CM0.9 | 3 krpm/30s | 95°C/90” | ~ 0.9 µm | 405 | 250 | - 7 | 110°C/90s | AZ300MIF | 60s | Used MLA design |
| THMR-3600HP | 1.5 krpm/45s250 rpm/s | 100°C/60s | 0.430µm | 405 | 180–220 | -4 | 100°C/60s | AZ300MiF | 20s | line/space:
low dose for clear-field, high does for dark-field |
Negative Resist (MLA150)
General notes: Hotplates used, filters, laser wavelengths, etc. “Soft Bake” is right after spin, “PEB” is post-exposure bake - right after exposure. “Flood exposure” is only for AZ5214 for image reversal, after PEB.
| Resist | Spin Cond. | Soft Bake | Thickness | Laser (nm) | Exposure Dose (mJ/cm2) | DeFocus | PEB | Flood | Developer | Developer Time | Comments |
|---|---|---|---|---|---|---|---|---|---|---|---|
| AZ5214 | 6 krpm/30s | 95°C/60s | ~ 1.0 µm | 375 | 35 | - 5 | 110°C/60s | 60" | AZ300MIF | 60s | Used UCSB design. Good for up to ~1.3um open line space. |
| AZnLOF2020 | 4 krpm/30s | 110°C/60s | ~ 2.1µm | 375 | 340 | - 3 | 110°C/60s | none | AZ300MIF | 90s | Used UCSB design. Good for 2um open line space. |
| SU-8 2075 | ~70µm | 375 | Extremely viscous. Pour into a wide-mouthed bottle, dispense directly from bottle. Replace napkin at end. |
Greyscale Lithography (MLA150)
Description...
| Resist | Spin Cond. | Bake | Thickness | Exposure Dose (mJ/cm2) | Focus Offset | PEB | Flood | Developer | Developer Time | Comments |
|---|---|---|---|---|---|---|---|---|---|---|
| AZ4620 | – krpm/30” | 95°C/60” | 60" | AZ300MIF | 60" |
|