Difference between revisions of "Dicing Saw (ADT)"
Jump to navigation
Jump to search
(→Detailed Specifications: deleted old SOP, Lee's SOP only) |
(Added Tape expansion SOP) |
||
(11 intermediate revisions by 2 users not shown) | |||
Line 1: | Line 1: | ||
− | {{ |
+ | {{tool2|{{PAGENAME}} |
|picture=ADT.jpg |
|picture=ADT.jpg |
||
|type = Packaging |
|type = Packaging |
||
|super= Lee Sawyer |
|super= Lee Sawyer |
||
+ | |super2= Aidan Hopkins |
||
− | |location= |
+ | |location=Backend Lab: ESB 1111 |
|description = ADT Dicing Saw |
|description = ADT Dicing Saw |
||
|model = ADT 7100 |
|model = ADT 7100 |
||
Line 11: | Line 12: | ||
}} |
}} |
||
==About== |
==About== |
||
+ | The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of all types can be automatically or manually cut. This dicing Saw is optimized for multi-angle dicing of tight tolerance substrates up to 200 mm diameter in size. |
||
⚫ | |||
⚫ | |||
⚫ | |||
⚫ | |||
⚫ | |||
+ | |||
⚫ | |||
==Detailed Specifications== |
==Detailed Specifications== |
||
− | * |
+ | *Maximum Wafer Size: 8" |
− | * |
+ | *Parts mounted to UV-release tape for dicing |
− | * |
+ | *Automated cut maps at multiple angles (0° and 90° typical) |
− | * |
+ | *~Few micron alignment to on-wafer features. |
− | * |
+ | *Thermocarbon Resnoid dicing blades provided by Staff |
==Operating Procedures== |
==Operating Procedures== |
||
− | *[https://wiki. |
+ | *[https://wiki.nanofab.ucsb.edu/w/images/5/54/ADT_SOP_Rev_J.pdf ADT Dicing Saw Standard Operating Procedure] |
+ | *[https://wiki.nanofab.ucsb.edu/w/images/5/5c/Post_Dicing_Tape_Expansion_SOP.pdf Post Dicing Tape Expansion] |
||
+ | *[https://wiki.nanofab.ucsb.edu/w/images/5/5a/Ultron_1042R_Film_specs.pdf Ultron Systems, Inc. 1042R Anti-Static Ultraviolet Film TDS] |
||
*[[ADT 7100 - Recovering an Old Recipe (2019)|Recovering an Old Recipe]] |
*[[ADT 7100 - Recovering an Old Recipe (2019)|Recovering an Old Recipe]] |
||
Revision as of 14:10, 6 June 2024
|
About
The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of all types can be automatically or manually cut. This dicing Saw is optimized for multi-angle dicing of tight tolerance substrates up to 200 mm diameter in size.
Check the Dicing Saw Recipes page for the blades we currently stock.
An ADT WM-966 tape applicator is used to mount samples to UV-release tape for dicing and an Ultron Systems UH104-8 UV lamp system is used to release samples post dicing.
Contact Staff for blades and dicing frames for your group.
Detailed Specifications
- Maximum Wafer Size: 8"
- Parts mounted to UV-release tape for dicing
- Automated cut maps at multiple angles (0° and 90° typical)
- ~Few micron alignment to on-wafer features.
- Thermocarbon Resnoid dicing blades provided by Staff
Operating Procedures
- ADT Dicing Saw Standard Operating Procedure
- Post Dicing Tape Expansion
- Ultron Systems, Inc. 1042R Anti-Static Ultraviolet Film TDS
- Recovering an Old Recipe
Recipes
- Recipes > Packaging > Dicing Saw Recipes (ADT 7100)
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.