Vacuum Deposition Recipes: Difference between revisions

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(added sputters' rankings)
(added Thermal Evap rankings to wiki)
 
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| bgcolor="#eeffff" |[[Atomic Layer Deposition Recipes#Al2O3 deposition .28ALD CHAMBER 3.29|R4]]
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|[https://wiki.nanotech.ucsb.edu/w/index.php?title=Sputtering_Recipes#Sputter_3_.28AJA_ATC_2000-F.29 R3]
|[https://wiki.nanotech.ucsb.edu/w/index.php?title=Sputtering_Recipes#Sputter_3_.28AJA_ATC_2000-F.29 R3]
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|{{Rl|Sputtering_Recipes|Sputter_5_.28AJA_ATC_2200-V.29|R3}}
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|[[Thermal Evaporation Recipes|A]]
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|[[Atomic Layer Deposition Recipes#AlN deposition .28ALD CHAMBER 3.29|R4]]
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| bgcolor="#eeffff" |[[Thermal Evaporation Recipes#Thermal Evaporator 2|R3]]
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| bgcolor="#eeffff" |[[Thermal Evaporation Recipes|A]]
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| bgcolor="#eeffff" |[[Thermal Evaporation Recipes#Thermal Evaporator 2|R1]]
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| bgcolor="#eeffff" |[https://wiki.nanotech.ucsb.edu/w/index.php?title=PECVD_Recipes#Amorphous-Si_deposition_.28PECVD_.232.29 R3]
| bgcolor="#eeffff" |[https://wiki.nanotech.ucsb.edu/w/index.php?title=PECVD_Recipes#Amorphous-Si_deposition_.28PECVD_.232.29 R3]
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| bgcolor="#eeffff" |[[PECVD Recipes#SiO2 deposition .28PECVD .231.29|R6]]
| bgcolor="#eeffff" |[[PECVD Recipes#SiO2 deposition .28PECVD .231.29|R6]]
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Latest revision as of 00:11, 24 August 2024

Process Control Data

See linked page for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.

Deposition Tools/Materials Table

The Key/Legend for this table's A...R6 values is at the bottom of the page.

Vacuum Deposition Recipes

 E-Beam Evaporation Sputtering Thermal Evaporation Plasma Enhanced Chemical
Vapor Deposition (PECVD) 		Atomic Layer Deposition Molecular Vapor Deposition
Material E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 3
(AJA ATC 2000-F) 		Sputter 4
(AJA ATC 2200-V) 		Sputter 5 (AJA ATC 2200-V) Ion Beam
Deposition (Veeco Nexus) 		Thermal
Evap 1 		Thermal Evap 2 (Solder) PECVD 1
(PlasmaTherm 790) 		PECVD 2
(Advanced Vacuum) 		Unaxis VLR ICP-PECVD Atomic Layer Deposition (Oxford FlexAL) Molecular Vapor Deposition (Tool)
Ag R2
R2 R2 R1 R1

R1 R1




AgBr R1
AgCl R1
Al R2
R2 R2 R1 R3 R1 R1 R3 R1




Al2O3 R2

R3 R3 R1 R5




R4
As R1
AuPd R1
AuZn R1
AuGe R1
AlN



R1 R1
R1




R4
Au R2
R2 R2 R1 R3

R3 R2




B








R1




Be R1
C R3 R1
Cd R1
CdS R1
CdTe R1
CaF2 R2
CeO2
R3












Co R2

R2 R3


R1 R1




Cr R1

R2 R3
R3
R3 R2




Cu R1


R3 R2

R2 R1




Fe R2

R2 R3


R1 R1




Ga R1
GaAs R1
Ge R2
R2 R2 R1 R1


R1




GeO2 R2
Gd R2

R1










Hf R1


R1










HfO2



R1 R1






R4
Hg R1
In








R3




InSb R1
Ir R1

R1



R1 R1




ITO
R3

R1 R1
R1






KCl R1
LiF R1
Mg R1 R1
MgF2 R1 R1 R1
MgO R2 R1
Mn R2 R1
MnS R1
Mo R2


R3 R1


R1




Na R1
NaCl R1
Nb R2



R3


R1




NbO5 R1
Nd



R1








Ni R2
R2 R2 R3


R3 R2




NiCr R2 R2 R3
NiFe R1 R2 R1 R3
Pb R1
PbS R1
Pd R2
R2 R2



R3 R1




Pt R2
R2 R2 R3 R3 R3

R1


R4
Ru R2

R2
R3






R4
Sb R1
Se R1
Si
R2

R3 R1
R1
R1
R3

SiN



R3 R1
R6

R6 R6 R6

SiN - Low Stress R4 R6 R6
SiO2 R2 R2

R3 R1 R2 R6
R1 R6 R6 R6 R4
SiOx R1
SiO R1 R1
SiOxNy






R3

R4



Sn








R2




SrF2
R2





R1





Ta R1


R3 R1
R1
R1




Ta2O5
R1
R1


R6
R1




Ti R2
R2 R2 R3 R3 R3 R1
R2




TiN




R3
R1




R4
TiW R1


R2 R3








TiO R1
TiO2
R2

R1 R3
R5
R1


R4
V



R1 R1








W R2


R2 R3


R1




WC R1
Zn







R3 R2




ZnO







R1 R1


R3
ZnS R1
Zr R2

R2 R1 R1


R1




ZrO2








R1


R4
Material E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 3
(ATC 2000-F) 		Sputter 4
(ATC 2200-V) 		Sputter 5 (ATC 2200-V) Ion Beam
Deposition (Veeco Nexus) 		Thermal
Evap 1 		Thermal Evap 2 (Solder) PECVD 1
(PlasmaTherm 790) 		PECVD 2
(Advanced Vacuum) 		Unaxis VLR ICP-PECVD Atomic Layer Deposition (Oxford FlexAl) Molecular Vapor Deposition (Tool)

Process Ranking Table

Processes in the table above are ranked by their "Process Maturity Level" as follows:

Process Level Description of Process Level Ranking
A Process Allowed and materials available but never done
R1 Process has been ran at least once
R2 Process has been ran and/or procedure is documented or/and data available
R3 Process has been ran, procedure is documented, and data is available
R4 Process has a documented procedure with regular (≥4x per year) data or lookahead/in-Situ control available
R5 Process has a documented procedure with regular (≥4x per year) data and lookahead/in-Situ control available
R6 Process has a documented procedure, regular ( ≥4x per year) data, and control charts/limits available
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