Vacuum Deposition Recipes: Difference between revisions
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===[[Process Group - Process Control Data#Deposition .28Process Control Data.29|<u>Process Control Data</u>]]=== |
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This table can be used to help located the needed recipe. |
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<small>''See [[Process Group - Process Control Data#Deposition .28Process Control Data.29|linked page]] for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.''</small> |
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===Deposition Tools/Materials Table=== |
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{| border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" class="collapsible wikitable" |
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''The Key/Legend for this table's <code>A...R6</code> values is at the [[Vacuum Deposition Recipes#Process Ranking Table|<u>bottom of the page</u>]].'' |
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{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" border="1" |
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! width="1675" height="45" colspan="18" | <div style="font-size: 150%;">Vacuum Deposition Recipes</div> |
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! colspan="16" width="1675" height="45" |<div style="font-size: 150%;">Vacuum Deposition Recipes</div> |
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| <!-- INTENTIONALLY LEFT BLANK --> <br> |
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! bgcolor="#D0E7FF" align="center" colspan="4" | '''E-Beam Evaporation''' |
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|<!-- INTENTIONALLY LEFT BLANK --><br> |
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! bgcolor="#D0E7FF" align="center" colspan="5" | '''Sputtering''' |
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! colspan="4" bgcolor="#d0e7ff" align="center" |'''[[E-Beam Evaporation Recipes|E-Beam Evaporation]]''' |
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! colspan="4" |'''[[Sputtering Recipes|Sputtering]]''' |
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! bgcolor="#D0E7FF" align="center" colspan="3" | '''Plasma Enhanced Chemical<br>Vapor Deposition (PECVD)''' |
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! colspan="2" bgcolor="#d0e7ff" align="center" |'''[[Thermal Evaporation Recipes|Thermal Evaporation]]''' |
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! colspan="3" bgcolor="#d0e7ff" align="center" |'''[[PECVD Recipes|Plasma Enhanced Chemical<br>Vapor Deposition (PECVD)]]''' |
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! width="90" bgcolor="#d0e7ff" align="center" |'''[[Atomic Layer Deposition Recipes|Atomic Layer Deposition]]''' |
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! width="80" bgcolor="#d0e7ff" align="center" |'''[[Molecular Vapor Deposition Recipes|Molecular Vapor Deposition]]''' |
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! width="20" bgcolor="#d0e7ff" align="center" |'''Material''' |
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| width="65" |
| width="65" bgcolor="#daf1ff" |[[E-Beam Evaporation Recipes#E-Beam_1_.28Sharon.29|E-Beam 1 (Sharon)]] |
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| width="65" bgcolor="#daf1ff" |[[E-Beam Evaporation Recipes#E-Beam_2_.28Custom.29|E-Beam 2 (Custom)]] |
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| width="65" |
| width="65" bgcolor="#daf1ff" |[[E-Beam Evaporation Recipes#E-Beam_3_.28Temescal.29|E-Beam 3 (Temescal)]] |
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| width="65" |
| width="65" bgcolor="#daf1ff" |[[E-Beam Evaporation Recipes#E-Beam_4_.28CHA.29|E-Beam 4 (CHA)]] |
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| width="65" |
| width="65" bgcolor="#daf1ff" |[[Sputtering_Recipes#Sputter_3_.28AJA_ATC_2000-F.29|Sputter 3<br>(AJA ATC 2000-F)]] |
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| width="65" bgcolor="#daf1ff" |[[Sputtering_Recipes#Sputter_4_.28AJA_ATC_2200-V.29|Sputter 4<br>(AJA ATC 2200-V)]] |
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| width="65" bgcolor="#daf1ff" |[https://wiki.nanotech.ucsb.edu/w/index.php?title=Sputtering_Recipes#Sputter_5_.28AJA_ATC_2200-V.29 Sputter 5 (AJA ATC 2200-V)] |
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| width="75" | [[Sputter 3 (ATC 2000-F)|Sputter 3<br>(ATC 2000-F)]] |
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| width="55" bgcolor="#daf1ff" |[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|Ion Beam<br>Deposition (Veeco Nexus)]] |
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| width="75" | [[Sputter 4 (ATC 2200-V)|Sputter 4<br>(ATC 2200-V)]] |
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| width="45" bgcolor="#daf1ff" |[[Thermal Evaporation Recipes#Thermal_Evap_1|Thermal<br>Evap 1]] |
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| width="85" | [[Sputter 5 (Lesker AXXIS)]] |
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| width="65" |
| width="65" bgcolor="#daf1ff" |[[Thermal Evaporation Recipes#Thermal_Evap_2_.28Solder.29|Thermal Evap 2 (Solder)]] |
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| width="65" bgcolor="#daf1ff" |[[PECVD Recipes#PECVD_1_.28PlasmaTherm_790.29|PECVD 1<br>(PlasmaTherm 790)]] |
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| width="65" | [[Thermal 2]] |
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| width="65" bgcolor="#daf1ff" |[[PECVD Recipes#PECVD_2_.28Advanced_Vacuum.29|PECVD 2<br>(Advanced Vacuum)]] |
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| width="65" bgcolor="#daf1ff" |[[PECVD_Recipes#ICP-PECVD_.28Unaxis_VLR.29|Unaxis VLR ICP-PECVD]] |
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| width="115" | [[PECVD 2 (Advanced Vacuum)|PECVD 2<br>(Advanced Vacuum)]] |
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| width="65" bgcolor="#daf1ff" |[[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition (Oxford FlexAL)]] |
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| width="75" | [[Unaxis VLR ICP-PECVD]] |
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| width="65" bgcolor="#daf1ff" |[[Molecular Vapor Deposition|Molecular Vapor Deposition (Tool)]] |
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! bgcolor="#d0e7ff" align="center" |Ag |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R1]] |
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| bgcolor="#eeffff" |[[Thermal Evaporation Recipes#Thermal Evaporator 1|R1]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 2 .28Custom.29|R2]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes#Si3N4 deposition .28IBD.29|R5]] |
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| bgcolor="#eeffff" |[[Atomic Layer Deposition Recipes#Al2O3 deposition .28ALD CHAMBER 3.29|R4]] |
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! bgcolor="#d0e7ff" align="center" |CeO<sub>2</sub> |
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! bgcolor="#d0e7ff" align="center" |Co |
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| bgcolor=" |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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| bgcolor=" |
| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor=" |
| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Thermal Evaporation Recipes#Thermal Evaporator 1|R1]] |
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| bgcolor="#eeffff" |[[Thermal Evaporation Recipes#Thermal Evaporator 2|R1]] |
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! bgcolor="#d0e7ff" align="center" |Cr |
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|[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R1]] |
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|[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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|[https://wiki.nanotech.ucsb.edu/w/index.php?title=Sputtering_Recipes#Sputter_3_.28AJA_ATC_2000-F.29 R3] |
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|[[Thermal Evaporation Recipes#Thermal Evaporator 1|R3]] |
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|[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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| [[Vacuum_Deposition_Recipes#SiN deposition (PECVD #1)|Y]] |
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| bgcolor=" |
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! bgcolor="#d0e7ff" align="center" |Gd |
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| bgcolor="EEFFFF" | |
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| bgcolor=" |
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|- |
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! bgcolor="#d0e7ff" align="center" |Hf |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R1]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br>[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R1]] |
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|[[Sputtering Recipes|R1]] |
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|[[Sputtering Recipes|R1]] |
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|<br> |
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|<br> |
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|<br> |
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| bgcolor="EEFFFF" | |
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|[[Atomic Layer Deposition Recipes#AlN deposition .28ALD CHAMBER 3.29|R4]] |
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|<br> |
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|- |
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!Hg |
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! width="75" bgcolor="#D0E7FF" align="center" | TiN |
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| bgcolor=" |
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| bgcolor="#eeffff" |[[Thermal Evaporation Recipes#Thermal Evaporator 2|R3]] |
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! |
! bgcolor="#d0e7ff" align="center" |Ir |
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|[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R1]] |
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| bgcolor="EEFFFF" | |
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|<br> |
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| bgcolor="EEFFFF" | |
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|<br> |
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| bgcolor="EEFFFF" | |
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|[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R1]] |
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|<br> |
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|- |
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! |
! bgcolor="#d0e7ff" align="center" |ITO |
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| bgcolor="#eeffff" |<br> |
|||
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 2 .28Custom.29|R3]] |
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! width="75" bgcolor="#D0E7FF" align="center" | ZnO<sub>2</sub> |
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!Mg |
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! width="75" bgcolor="#D0E7FF" align="center" | ZrO<sub>2</sub> |
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|[[Thermal Evaporation Recipes#Thermal Evaporator 1|R1]] |
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! bgcolor="#d0e7ff" align="center" |MgF2 |
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|[[Sputtering Recipes|R1]] |
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|[[Thermal Evaporation Recipes#Thermal Evaporator 2|R1]] |
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! bgcolor="#d0e7ff" align="center" |MgO |
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|[[E-Beam Evaporation Recipes#E-Beam 2 .28Custom.29|R2]] |
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! bgcolor="#d0e7ff" align="center" |Mo |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R1]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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! bgcolor="#d0e7ff" align="center" |Nb |
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|[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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! bgcolor="#d0e7ff" align="center" |Nd |
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|[[Sputtering Recipes|R1]] |
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|- |
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! bgcolor="#d0e7ff" align="center" |Ni |
|||
| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Thermal Evaporation Recipes#Thermal Evaporator 1|R3]] |
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| bgcolor="#eeffff" |[[Thermal Evaporation Recipes#Thermal Evaporator 2|R2]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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|- |
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! bgcolor="#d0e7ff" align="center" |NiCr |
|||
|[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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|[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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|[[Thermal Evaporation Recipes#Thermal Evaporator 1|R3]] |
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! bgcolor="#d0e7ff" align="center" |NiFe |
|||
| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R1]] |
|||
| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R1]] |
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| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" |[[Thermal Evaporation Recipes#Thermal Evaporator 1|R3]] |
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| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" | |
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!Pb |
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!PbS |
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! bgcolor="#d0e7ff" align="center" |Pd |
|||
|[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
|||
|<br> |
|||
|[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
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|[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
|||
|<br> |
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|<br> |
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|<br> |
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|<br> |
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|[[Thermal Evaporation Recipes#Thermal Evaporator 1|R3]] |
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|[[Thermal Evaporation Recipes#Thermal Evaporator 2|R1]] |
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|<br> |
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|<br> |
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|<br> |
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|<br> |
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|<br> |
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|- |
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! bgcolor="#d0e7ff" align="center" |Pt |
|||
| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
|||
| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
|||
| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
|||
| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
|||
| bcolor="EEFFFF" |[[Sputtering Recipes|R3]] |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R4]] |
|||
| bgcolor="#eeffff" |<br> |
|||
|- |
|||
! bgcolor="#d0e7ff" align="center" |Ru |
|||
|[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
|||
|<br> |
|||
|<br> |
|||
|[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
|||
|<br> |
|||
|[[Sputtering Recipes#Ru Deposition .28Sputter 4.29|R3]] |
|||
|<br> |
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|<br> |
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|<br> |
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|<br> |
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|<br> |
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|<br> |
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|<br> |
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|[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R4]] |
|||
|<br> |
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|- |
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!Sb |
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! bgcolor="#d0e7ff" align="center" |Si |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 2 .28Custom.29|R2]] |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
|||
| bgcolor="#eeffff" |[[Sputtering Recipes|R1]] |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |R1 |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" | |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |[https://wiki.nanotech.ucsb.edu/w/index.php?title=PECVD_Recipes#Amorphous-Si_deposition_.28PECVD_.232.29 R3] |
|||
| bgcolor="#eeffff" | |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |<br> |
|||
|- |
|||
! bgcolor="#d0e7ff" align="center" |SiN |
|||
|<br> |
|||
|<br> |
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|<br> |
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|<br> |
|||
|[[Sputtering Recipes|R3]] |
|||
|[[Sputtering Recipes|R1]] |
|||
|<br> |
|||
|[[Sputtering Recipes#Si3N4 deposition .28IBD.29|R6]] |
|||
|<br> |
|||
|<br> |
|||
|[[PECVD Recipes#SiN deposition .28PECVD .231.29|R6]] |
|||
|[[PECVD Recipes#SiN deposition .28PECVD .232.29|R6]] |
|||
|[[PECVD Recipes#ICP-PECVD .28Unaxis VLR.29|R6]] |
|||
|<br> |
|||
|<br> |
|||
|- |
|||
! bgcolor="#d0e7ff" align="center" |SiN - Low Stress |
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| |
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| |
|||
|[[PECVD Recipes#Low Stress Si3N4 .28PECVD.231.29|R4]] |
|||
|[[PECVD Recipes#Low-Stress SiN deposition .28PECVD .232.29|R6]] |
|||
|[[PECVD Recipes#ICP-PECVD .28Unaxis VLR.29|R6]] |
|||
| |
|||
| |
|||
|- |
|||
! bgcolor="#d0e7ff" align="center" |SiO<sub>2</sub> |
|||
| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
|||
| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 2 .28Custom.29|R2]] |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
|||
| bgcolor="#eeffff" |[[Sputtering Recipes|R1]] |
|||
| bgcolor="#eeffff" |[[Sputtering Recipes|R2]] |
|||
| bgcolor="#eeffff" |[[Sputtering_Recipes#SiO2_deposition_.28IBD.29|R6]] |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" | |
|||
| bgcolor="#eeffff" |[[PECVD Recipes#SiO2 deposition .28PECVD .231.29|R6]] |
|||
| bgcolor="#eeffff" |[[PECVD Recipes#SiO2 deposition .28PECVD .232.29|R6]] |
|||
| bgcolor="#eeffff" |[[PECVD Recipes#ICP-PECVD .28Unaxis VLR.29|R6]] |
|||
| bgcolor="#eeffff" |[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R4]] |
|||
| bgcolor="#eeffff" |<br> |
|||
|- |
|||
!SiO<sub>x</sub> |
|||
| |
|||
|[[E-Beam Evaporation Recipes#E-Beam 2 .28Custom.29|R1]] |
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!SiO |
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|[[Thermal Evaporation Recipes#Thermal Evaporator 1|R1]] |
|||
|[[Thermal Evaporation Recipes#Thermal Evaporator 2|R1]] |
|||
| |
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| |
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|- |
|||
! bgcolor="#d0e7ff" align="center" |SiO<sub>x</sub>N<sub>y</sub> |
|||
|<br> |
|||
|<br> |
|||
|<br> |
|||
|<br> |
|||
|<br> |
|||
|<br> |
|||
|<br> |
|||
|[[Sputtering Recipes#Si3N4 deposition .28IBD.29|R3]] |
|||
|<br> |
|||
|<br> |
|||
|[[PECVD Recipes#SiO2 deposition .28PECVD .231.29|R4]] |
|||
|<br> |
|||
|<br> |
|||
|<br> |
|||
|<br> |
|||
|- |
|||
! bgcolor="#d0e7ff" align="center" |Sn |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |[[Thermal Evaporation Recipes#Thermal Evaporator 2|R2]] |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |<br> |
|||
|- |
|||
! bgcolor="#d0e7ff" align="center" |SrF<sub>2</sub> |
|||
|<br> |
|||
|[[E-Beam Evaporation Recipes#E-Beam 2 .28Custom.29|R2]] |
|||
|<br> |
|||
|<br> |
|||
|<br> |
|||
|<br> |
|||
|<br> |
|||
|<br> |
|||
|[[Thermal Evaporation Recipes#Thermal Evaporator 1|R1]] |
|||
|<br> |
|||
|<br> |
|||
|<br> |
|||
|<br> |
|||
|<br> |
|||
|<br> |
|||
|- |
|||
! bgcolor="#d0e7ff" align="center" |Ta |
|||
| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R1]] |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |<br> |
|||
| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
|||
| bgcolor="#eeffff" |[[Sputtering Recipes|R1]] |
|||
| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |R1 |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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|- |
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! bgcolor="#d0e7ff" align="center" |Ta<sub>2</sub>O<sub>5</sub> |
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|<br> |
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|[[E-Beam Evaporation Recipes#E-Beam 2 .28Custom.29|R1]] |
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|<br> |
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|[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R1]] |
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|<br> |
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|<br> |
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|<br> |
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|[[Sputtering Recipes#Si3N4 deposition .28IBD.29|R6]] |
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! bgcolor="#d0e7ff" align="center" |Ti |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" |R1 |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" |<br> |
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|- |
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! bgcolor="#d0e7ff" align="center" |TiN |
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|<br> |
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|<br> |
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|<br> |
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|<br> |
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|[https://wiki.nanotech.ucsb.edu/w/index.php?title=Sputtering_Recipes#Sputter_4_.28AJA_ATC_2200-V.29 R3] |
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|<br> |
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|R1 |
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|<br> |
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|[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R4]] |
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|- |
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! bgcolor="#d0e7ff" align="center" |TiW |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R1]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R2]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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! bgcolor="#d0e7ff" align="center" |TiO<sub>2</sub> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 2 .28Custom.29|R2]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R1]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Sputtering Recipes#Si3N4 deposition .28IBD.29|R5]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R4]] |
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| bgcolor="#eeffff" |<br> |
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|- |
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! bgcolor="#d0e7ff" align="center" |V |
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|<br> |
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|[[Sputtering Recipes|R1]] |
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|[[Sputtering Recipes|R1]] |
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! bgcolor="#d0e7ff" align="center" |W |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R2]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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! bgcolor="#d0e7ff" align="center" |Zn |
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|[[Thermal Evaporation Recipes#Thermal Evaporator 1|R3]] |
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|[[Thermal Evaporation Recipes#Thermal Evaporator 2|R2]] |
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! bgcolor="#d0e7ff" align="center" |ZnO |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R3]] |
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| bgcolor="#eeffff" |<br> |
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! bgcolor="#d0e7ff" align="center" |Zr |
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|[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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|<br> |
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|<br> |
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|[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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|[[Sputtering Recipes|R1]] |
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|[[Sputtering Recipes|R1]] |
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|<br> |
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|[[Thermal Evaporation Recipes#Thermal Evaporator 2|R1]] |
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! bgcolor="#d0e7ff" align="center" |ZrO<sub>2</sub> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R4]] |
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| bgcolor="#eeffff" |<br> |
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|- |
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! width="20" bgcolor="#d0e7ff" align="center" |'''Material''' |
|||
| width="65" bgcolor="#daf1ff" |[[E-Beam Evaporation Recipes#E-Beam_1_.28Sharon.29|E-Beam 1 (Sharon)]] |
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| width="65" bgcolor="#daf1ff" |[[E-Beam Evaporation Recipes#E-Beam_2_.28Custom.29|E-Beam 2 (Custom)]] |
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| width="65" bgcolor="#daf1ff" |[[E-Beam Evaporation Recipes#E-Beam_3_.28Temescal.29|E-Beam 3 (Temescal)]] |
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| width="65" bgcolor="#daf1ff" |[[E-Beam Evaporation Recipes#E-Beam_4_.28CHA.29|E-Beam 4 (CHA)]] |
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| width="65" bgcolor="#daf1ff" |[[Sputtering Recipes#Sputter_3_.28ATC_2000-F.29|Sputter 3<br>(ATC 2000-F)]] |
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| width="65" bgcolor="#daf1ff" |[[Sputtering_Recipes#Sputter_4_.28AJA_ATC_2200-V.29|Sputter 4<br>(ATC 2200-V)]] |
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| width="65" bgcolor="#daf1ff" |[[Sputtering Recipes|Sputter 5 (ATC 2200-V)]] |
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| width="55" bgcolor="#daf1ff" |[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|Ion Beam<br>Deposition (Veeco Nexus)]] |
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| width="45" bgcolor="#daf1ff" |[[Thermal Evaporation Recipes#Thermal_Evap_1|Thermal<br>Evap 1]] |
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| width="65" bgcolor="#daf1ff" |[[Thermal Evaporation Recipes#Thermal_Evap_2_.28Solder.29|Thermal Evap 2 (Solder)]] |
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| width="65" bgcolor="#daf1ff" |[[PECVD Recipes#PECVD_1_.28PlasmaTherm_790.29|PECVD 1<br>(PlasmaTherm 790)]] |
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| width="65" bgcolor="#daf1ff" |[[PECVD Recipes#PECVD_2_.28Advanced_Vacuum.29|PECVD 2<br>(Advanced Vacuum)]] |
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| width="65" bgcolor="#daf1ff" |[[PECVD_Recipes#ICP-PECVD_.28Unaxis_VLR.29|Unaxis VLR ICP-PECVD]] |
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| width="65" bgcolor="#daf1ff" |[[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition (Oxford FlexAl)]] |
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| width="65" bgcolor="#daf1ff" |[[Molecular Vapor Deposition|Molecular Vapor Deposition (Tool)]] |
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|} |
|} |
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===Process Ranking Table=== |
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= Recipes = |
|||
Processes in the table above are ranked by their "''Process Maturity Level''" as follows: |
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{| class="wikitable" |
|||
== E-Beam Evaporation == |
|||
|'''Process Level''' |
|||
| colspan="11" |'''Description of Process Level Ranking''' |
|||
=== Recipe 1 === |
|||
|- |
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|A |
|||
#Step 1 .... |
|||
| colspan="11" |Process '''A'''llowed and materials available but never done |
|||
#Step 2... |
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|- |
|||
|R1 |
|||
=== Recipe 2 === |
|||
| colspan="11" |Process has been ran at least once |
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|- |
|||
== Sputtering == |
|||
|R2 |
|||
| colspan="11" |Process has been ran and/or procedure is documented or/and data available |
|||
== Thermal Evaporation == |
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|- |
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|R3 |
|||
== <sub></sub>Plasma Enhanced Chemical Vapor Deposition (PECVD) == |
|||
| colspan="11" |Process has been ran, procedure is documented, and data is available |
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|- |
|||
=== SiN deposition (PECVD #1) === |
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|R4 |
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| colspan="11" |Process has a documented procedure with regular (≥4x per year) data '''or''' lookahead/in-Situ control available |
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#'''Clean''' (30CLN_SN) |
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|- |
|||
##Initial t=10", p=2x10-2, T=250C |
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|R5 |
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##N2 Purge t=30", p=300mT |
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| colspan="11" |Process has a documented procedure with regular (≥4x per year) data '''and''' lookahead/in-Situ control available |
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##evacuate, base pressure=2x10-2, t=10" |
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|- |
|||
##loop |
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|R6 |
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##gas stabilization, t=30" |
|||
| colspan="11" |Process has a documented procedure, regular ( ≥4x per year) data, and control charts/limits available |
|||
##etch chamber, t=30' |
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|} |
|||
##evacuate, t=10" |
|||
[[Category:Processing]] |
|||
##N2 purge |
|||
##evacuate |
|||
##loop |
|||
##SiN gas stabilization |
|||
##SiN deposition( 200A coat) |
|||
##evacuate |
|||
##N2purge, t=30" |
|||
##end |
|||
#'''SiN deposition''' (SiN_10) 130.8 A/min |
|||
##Initial t=10" |
|||
##N2 purge t=30" |
|||
##evacuate, t=10" |
|||
##loop |
|||
##SiN gas stabilization, t=30" |
|||
##SiN deposition t=8'11.2" |
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##evacuate, t=10" |
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##N2 purge t=30" |
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##evacuate t=10" |
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##loop |
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=== SiO<sub>2</sub> deposition (PECVD #2) === |
|||
#'''Standard clean''' |
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##'''Pump down''': stabilization time t=15", step time(m)=0', step time(s)=30" |
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##'''Pre-purge''': purge=1, stabilization time=15, step time(m)=1, step time(sec)=0 |
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##'''High Pressure''': process pressure=600, RF point=300, stabilization time=35, step time(m)=30, step time(s)=0, CF4/O2(5)=500 |
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##'''Low pressure''': process pressure=300, RF setpoint=300, stabilization time=15, step time(m)=30, step time(s)=0, CF4/O2(5)=500 |
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#'''Oxide'''(HF, n=1.46, 25nm/min) |
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##process pressure=800, RF setpoint=30, stabilization time=15, step time(m)=10, step time(s)=0, 2%SiH4%He(1)=600, N2O(4)=1420 |
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== Atomic Layer Deposition (ALD) == |
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== Ion-Beam Deposition (IBD) == |
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== Molecular Vapor Deposition (MVD) == |
Revision as of 21:57, 7 November 2024
Process Control Data
See linked page for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.
Deposition Tools/Materials Table
The Key/Legend for this table's A...R6
values is at the bottom of the page.
Process Ranking Table
Processes in the table above are ranked by their "Process Maturity Level" as follows:
Process Level | Description of Process Level Ranking | ||||||||||
A | Process Allowed and materials available but never done | ||||||||||
R1 | Process has been ran at least once | ||||||||||
R2 | Process has been ran and/or procedure is documented or/and data available | ||||||||||
R3 | Process has been ran, procedure is documented, and data is available | ||||||||||
R4 | Process has a documented procedure with regular (≥4x per year) data or lookahead/in-Situ control available | ||||||||||
R5 | Process has a documented procedure with regular (≥4x per year) data and lookahead/in-Situ control available | ||||||||||
R6 | Process has a documented procedure, regular ( ≥4x per year) data, and control charts/limits available |