Dicing Saw (ADT): Difference between revisions

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{{tool|{{PAGENAME}}
{{tool2|{{PAGENAME}}
|picture=ADT.jpg
|picture=ADT.jpg
|type = Packaging
|type = Packaging
|super= Aidan Hopkins
|super= Lee Sawyer
|super2= Aidan Hopkins
|phone= 805-893-3918x208
|location=Dicing Saw Room
|location=Backend Lab: ESB 1111
|email=hopkins@ece.ucsb.edu
|description = ADT Dicing Saw
|description = ADT Dicing Saw
|model = ADT 7100
|manufacturer = Advanced Dicing Technologies Ltd.
|manufacturer = Advanced Dicing Technologies Ltd.
|materials =
|materials =
|toolid=49
|toolid=49
}}
}}
== About ==
==About==
The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of all types can be automatically or manually cut. This dicing Saw is optimized for multi-angle dicing of tight tolerance substrates up to 200 mm diameter in size.
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the Dicing Saw Recipes page for the blades we currently stock.


⚫
Check the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock.
⚫
== Detailed Specifications ==


An ADT WM-966 tape applicator is used to mount samples to UV-release tape for dicing and an Ultron Systems UH104-8 UV lamp system is used to release samples from the tape after dicing.
⚫
== Operating Procedures ==
Right click on the blade icon in the lower left corner of the screen and select 'Blade Change'.


Contact Staff for blades and dicing frames for your group.
Open the dicing saw cover and place the interlock defeating key in the door interlock.


⚫
==Detailed Specifications==
Grab your blade/flange (with the grabbing tool or hand) and CAREFULLY place it onto the spindle. This should require very little force. If the flange doesn't easily slide onto the spindle please contact me immediately.


*Maximum Wafer Size: 8"
Once you have installed your blade and flange onto the spindle you must secure it with the lock nut. To do this, line up any of the two holes on the lock nut with the two pins on the two piece torque wrench tool. Hold the back part of the wrench in place with one hand and turn the front part of the wrench clockwise with the other hand. Once the lock nut is hand tight you'll have to crank on the torque wrench until you hear a click. That should be the appropriate amount of torque to keep the flange on the spindle.
*Parts mounted to UV-release tape for dicing
*Automated cut maps at multiple angles (0° and 90° typical)
**"Polygon" cutting to approximate Coring wafers is possible.
*~Few micron alignment to on-wafer features.
*Thermocarbon Resnoid dicing blades provided by Staff


⚫
==Operating Procedures==
From the 'Blade Selection' drop down menu, choose blade you just installed. If you are using a different flange diameter from the one selected in the software click the 'Change Flange' box and manually enter in the new flange diameter. Click 'Done' and then click 'Finish' in the lower left dialogue box.


*[https://wiki.nanofab.ucsb.edu/w/images/5/54/ADT_SOP_Rev_J.pdf ADT Dicing Saw Standard Operating Procedure]
DO NOT STICK YOUR HANDS INTO THE SYSTEM! The saw will eventually start to rotate and go through its blade exposure measurement sequence.
*[https://wiki.nanofab.ucsb.edu/w/images/5/5c/Post_Dicing_Tape_Expansion_SOP.pdf Post Dicing Tape Expansion]
*[https://wiki.nanofab.ucsb.edu/w/images/5/5a/Ultron_1042R_Film_specs.pdf Ultron Systems, Inc. 1042R Anti-Static Ultraviolet Film TDS]
*[https://wiki.nanofab.ucsb.edu/w/images/5/59/Recipe_Importing_New_Software.pdf Recovering an Old Recipe (2023)]
⚫
==Recipes==


*Recipes > Packaging > '''[[Packaging Recipes#Dicing Saw Recipes .28ADT 7100.29|Dicing Saw Recipes (ADT 7100)]]'''
Once it says 'Blade change completed' inside the dialogue box you can check the three water sources.


⚫
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.
BE EXTREMELY CAREFUL! The spindle is still rotating! Carefully pull the spindle cover lock to the left and open the spindle cover.


==== Dicing Processing Parameters ====
Press the 'Water Adjust' to turn on the three different water sources. Verify that the Cut water is
If you are not familiar with dicing, the following document lists the important parameters you need to document before starting your job:


* [[Media:Dicing - Example Dicing Instructions for UC Santa Barbara v2.pptx|Example Dicing Instructions for UC Santa Barbara v2.pptx]] ''- by Demis D. John''
⚫
== Recipes ==
⚫
* Packaging Recipes > [https://www.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes?venotify=created#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes (ADT 7100)]
⚫
Be sure to also see the methods for protecting your sample from dicing dust, and mounting/unmounting.

Latest revision as of 21:29, 9 December 2024

Dicing Saw (ADT)
ADT.jpg
Location Backend Lab: ESB 1111
Tool Type Packaging
Manufacturer Advanced Dicing Technologies Ltd.
Model ADT 7100
Description ADT Dicing Saw
Primary Supervisor Lee Sawyer
(805) 893-2123
lee_sawyer@ucsb.edu

Secondary Supervisor

Aidan Hopkins

Recipes
SignupMonkey: Sign up for this tool


About

The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of all types can be automatically or manually cut. This dicing Saw is optimized for multi-angle dicing of tight tolerance substrates up to 200 mm diameter in size.

Check the Dicing Saw Recipes page for the blades we currently stock.

An ADT WM-966 tape applicator is used to mount samples to UV-release tape for dicing and an Ultron Systems UH104-8 UV lamp system is used to release samples from the tape after dicing.

Contact Staff for blades and dicing frames for your group.

Detailed Specifications

  • Maximum Wafer Size: 8"
  • Parts mounted to UV-release tape for dicing
  • Automated cut maps at multiple angles (0° and 90° typical)
    • "Polygon" cutting to approximate Coring wafers is possible.
  • ~Few micron alignment to on-wafer features.
  • Thermocarbon Resnoid dicing blades provided by Staff

Operating Procedures

Recipes

Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.

Dicing Processing Parameters

If you are not familiar with dicing, the following document lists the important parameters you need to document before starting your job:

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