Dicing Saw (ADT): Difference between revisions
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(→About: added Recipes > Example dicing Instructions for remote work) |
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{{tool2|{{PAGENAME}} |
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|picture=ADT.jpg |
|picture=ADT.jpg |
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|type = Packaging |
|type = Packaging |
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|super= |
|super= Lee Sawyer |
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|super2= Aidan Hopkins |
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|phone= 805-893-3918x208 |
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|location= |
|location=Backend Lab: ESB 1111 |
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|email=hopkins@ece.ucsb.edu |
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|description = ADT Dicing Saw |
|description = ADT Dicing Saw |
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|model = ADT 7100 |
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|manufacturer = Advanced Dicing Technologies Ltd. |
|manufacturer = Advanced Dicing Technologies Ltd. |
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|materials = |
|materials = |
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|toolid=49 |
|toolid=49 |
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}} |
}} |
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== |
==About== |
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The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of all types can be automatically or manually cut. This dicing Saw is optimized for multi-angle dicing of tight tolerance substrates up to 200 mm diameter in size. |
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The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the Dicing Saw Recipes page for the blades we currently stock. |
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An ADT WM-966 tape applicator is used to mount samples to UV-release tape for dicing and an Ultron Systems UH104-8 UV lamp system is used to release samples from the tape after dicing. |
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Install Your Blade and Flange |
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Contact Staff for blades and dicing frames for your group. |
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Right click on the blade icon in the lower left corner of the screen and select 'Blade Change'. |
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Open the dicing saw cover and place the interlock defeating key in the door interlock. |
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*Maximum Wafer Size: 8" |
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Grab your blade/flange (with the grabbing tool or hand) and CAREFULLY place it onto the spindle. This should require very little force. If the flange doesn't easily slide onto the spindle please contact me immediately. |
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*Parts mounted to UV-release tape for dicing |
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*Automated cut maps at multiple angles (0° and 90° typical) |
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**"Polygon" cutting to approximate Coring wafers is possible. |
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*~Few micron alignment to on-wafer features. |
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*Thermocarbon Resnoid dicing blades provided by Staff |
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Once you have installed your blade and flange onto the spindle you must secure it with the lock nut. To do this, line up any of the two holes on the lock nut with the two pins on the two piece torque wrench tool. Hold the back part of the wrench in place with one hand and turn the front part of the wrench clockwise with the other hand. Once the lock nut is hand tight you'll have to crank on the torque wrench until you hear a click. That should be the appropriate amount of torque to keep the flange on the spindle. |
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*[https://wiki.nanofab.ucsb.edu/w/images/5/54/ADT_SOP_Rev_J.pdf ADT Dicing Saw Standard Operating Procedure] |
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From the 'Blade Selection' drop down menu, choose blade you just installed. If you are using a different flange diameter from the one selected in the software click the 'Change Flange' box and manually enter in the new flange diameter. Click 'Done' and then click 'Finish' in the lower left dialogue box. |
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*[https://wiki.nanofab.ucsb.edu/w/images/5/5c/Post_Dicing_Tape_Expansion_SOP.pdf Post Dicing Tape Expansion] |
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*[https://wiki.nanofab.ucsb.edu/w/images/5/5a/Ultron_1042R_Film_specs.pdf Ultron Systems, Inc. 1042R Anti-Static Ultraviolet Film TDS] |
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*[https://wiki.nanofab.ucsb.edu/w/images/5/59/Recipe_Importing_New_Software.pdf Recovering an Old Recipe (2023)] |
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*Recipes > Packaging > '''[[Packaging Recipes#Dicing Saw Recipes .28ADT 7100.29|Dicing Saw Recipes (ADT 7100)]]''' |
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DO NOT STICK YOUR HANDS INTO THE SYSTEM! The saw will eventually start to rotate and go through its blade exposure measurement sequence. |
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Once it says 'Blade change completed' inside the dialogue box you can check the three water sources. |
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==== Dicing Processing Parameters ==== |
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Adjust the Cut Water |
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If you are not familiar with dicing, the following document lists the important parameters you need to document before starting your job: |
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* [[Media:Dicing - Example Dicing Instructions for UC Santa Barbara v2.pptx|Example Dicing Instructions for UC Santa Barbara v2.pptx]] ''- by Demis D. John'' |
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BE EXTREMELY CAREFUL! The spindle is still rotating! Carefully pull the spindle cover lock to the left and open the spindle cover. |
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Press the 'Water Adjust' to turn on the three different water sources. Verify that the Cut water is being forked by the blade (you should see a stream of water in front of the blade and one behind it). The Cut water should be hitting the blade/flange at approximately 7pm if the blade was a clock. If adjustments are needed, you can move the Cut water nozzle by holding the knob behind the nozzle with one hand and turning the top knob above counter clockwise. This will unlock the Cut water nozzle and give you free range of motion. Make sure you do not rotate the Cut water nozzle up into the blade! Once the Cut water looks good you can lock it in place by turning the top knob clockwise until it's tight. |
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Verify that the flow rates of the Cut water, Clean jets, and Spray bars are 0.9 LPM, 0.8 LPM, and 0.8 LPM respectively. You can turn down the flow rates by adjusting the three small regulator knobs below the computer monitor. Just make sure to return the flow rates to their default values before ending your dicing session. |
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Once the water situation looks good you can right click on the spindle speedometer in the top right of the screen and choose 'Operate'. This will turn the spindle off. Once the spindle has reached 0 RPM you can pull the interlock key and close the dicing saw cover. |
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Initialize System |
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After your initial blade change you must go to User =>System Init. This will initialize the chuck and saw and get the system ready to accept your sample. |
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Once, the screen stops flashing yellow you can choose one of two routes. You can either create or load a recipe or load your sample. |
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Create a Recipe |
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To create a recipe, click on the book icon (Programming Workspace). In order to create a recipe in the software you must duplicate an old recipe. You can either duplicate a group/company member's recipe or open the 'RECIPES' folder on the left hand side of the software and select 'Recipe_APC'. Click 'Duplicate Recipe' and create a recipe name. Make sure you save your recipe in any other folder besides the 'RECIPES' folder. You can either find your folder by using the drop down menu or you can create a new folder name by typing into the 'Folder' box. |
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Latest revision as of 21:29, 9 December 2024
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About
The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of all types can be automatically or manually cut. This dicing Saw is optimized for multi-angle dicing of tight tolerance substrates up to 200 mm diameter in size.
Check the Dicing Saw Recipes page for the blades we currently stock.
An ADT WM-966 tape applicator is used to mount samples to UV-release tape for dicing and an Ultron Systems UH104-8 UV lamp system is used to release samples from the tape after dicing.
Contact Staff for blades and dicing frames for your group.
Detailed Specifications
- Maximum Wafer Size: 8"
- Parts mounted to UV-release tape for dicing
- Automated cut maps at multiple angles (0° and 90° typical)
- "Polygon" cutting to approximate Coring wafers is possible.
- ~Few micron alignment to on-wafer features.
- Thermocarbon Resnoid dicing blades provided by Staff
Operating Procedures
- ADT Dicing Saw Standard Operating Procedure
- Post Dicing Tape Expansion
- Ultron Systems, Inc. 1042R Anti-Static Ultraviolet Film TDS
- Recovering an Old Recipe (2023)
Recipes
- Recipes > Packaging > Dicing Saw Recipes (ADT 7100)
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.
Dicing Processing Parameters
If you are not familiar with dicing, the following document lists the important parameters you need to document before starting your job:
- Example Dicing Instructions for UC Santa Barbara v2.pptx - by Demis D. John