Dicing Saw (ADT): Difference between revisions

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{{tool|{{PAGENAME}}
{{tool2|{{PAGENAME}}
|picture=ADT.jpg
|picture=ADT.jpg
|type = Packaging
|type = Packaging
|super= Lee Sawyer
|super= Lee Sawyer
|super2= Aidan Hopkins
|location=Dicing Room: ESB 1147
|location=Backend Lab: ESB 1111
|description = ADT Dicing Saw
|description = ADT Dicing Saw
|model = ADT 7100
|model = ADT 7100
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|toolid=49
|toolid=49
}}
}}
== About ==
==About==
The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of all types can be automatically or manually cut. This dicing Saw is optimized for multi-angle dicing of tight tolerance substrates up to 200 mm diameter in size.
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The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the [https://wiki.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock.


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Check the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock.
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An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.


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An ADT WM-966 tape applicator is used to mount samples to UV-release tape for dicing and an Ultron Systems UH104-8 UV lamp system is used to release samples from the tape after dicing.
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Contact the tool supervisor for blades and dicing frames for your group.


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Contact Staff for blades and dicing frames for your group.
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== Detailed Specifications ==


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==Detailed Specifications==
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== Operating Procedures ==
* [[ADT 7100 - Initial Setup Before Cutting|Setting up the Saw before Cutting]]
* [[ADT 7100 - Standard Dicing Procedure - Programmed Cut Map|Standard Dicing Procedure - Programmed Cut Map]]
* [[ADT 7100 - Standard Dicing Procedure - Single Cuts|Standard Dicing Procedure - Single Cuts]]
* [[ADT 7100 - Recovering an Old Recipe (2019)|Recovering an Old Recipe]]


*Maximum Wafer Size: 8"
*Parts mounted to UV-release tape for dicing
*Automated cut maps at multiple angles (0° and 90° typical)
**"Polygon" cutting to approximate Coring wafers is possible.
*~Few micron alignment to on-wafer features.
*Thermocarbon Resnoid dicing blades provided by Staff

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==Operating Procedures==

*[https://wiki.nanofab.ucsb.edu/w/images/5/54/ADT_SOP_Rev_J.pdf ADT Dicing Saw Standard Operating Procedure]
*[https://wiki.nanofab.ucsb.edu/w/images/5/5c/Post_Dicing_Tape_Expansion_SOP.pdf Post Dicing Tape Expansion]
*[https://wiki.nanofab.ucsb.edu/w/images/5/5a/Ultron_1042R_Film_specs.pdf Ultron Systems, Inc. 1042R Anti-Static Ultraviolet Film TDS]
*[https://wiki.nanofab.ucsb.edu/w/images/5/59/Recipe_Importing_New_Software.pdf Recovering an Old Recipe (2023)]
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==Recipes==

*Recipes > Packaging > '''[[Packaging Recipes#Dicing Saw Recipes .28ADT 7100.29|Dicing Saw Recipes (ADT 7100)]]'''


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== Recipes ==
* Recipes > Packaging > [https://wiki.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes?venotify=created#Dicing_Saw_Recipes_.28ADT_7100.29 '''Dicing Saw Recipes (ADT 7100)''']
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.

==== Dicing Processing Parameters ====
If you are not familiar with dicing, the following document lists the important parameters you need to document before starting your job:

* [[Media:Dicing - Example Dicing Instructions for UC Santa Barbara v2.pptx|Example Dicing Instructions for UC Santa Barbara v2.pptx]] ''- by Demis D. John''

Latest revision as of 21:29, 9 December 2024

Dicing Saw (ADT)
ADT.jpg
Location Backend Lab: ESB 1111
Tool Type Packaging
Manufacturer Advanced Dicing Technologies Ltd.
Model ADT 7100
Description ADT Dicing Saw
Primary Supervisor Lee Sawyer
(805) 893-2123
lee_sawyer@ucsb.edu

Secondary Supervisor

Aidan Hopkins

Recipes
SignupMonkey: Sign up for this tool


About

The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of all types can be automatically or manually cut. This dicing Saw is optimized for multi-angle dicing of tight tolerance substrates up to 200 mm diameter in size.

Check the Dicing Saw Recipes page for the blades we currently stock.

An ADT WM-966 tape applicator is used to mount samples to UV-release tape for dicing and an Ultron Systems UH104-8 UV lamp system is used to release samples from the tape after dicing.

Contact Staff for blades and dicing frames for your group.

Detailed Specifications

  • Maximum Wafer Size: 8"
  • Parts mounted to UV-release tape for dicing
  • Automated cut maps at multiple angles (0° and 90° typical)
    • "Polygon" cutting to approximate Coring wafers is possible.
  • ~Few micron alignment to on-wafer features.
  • Thermocarbon Resnoid dicing blades provided by Staff

Operating Procedures

Recipes

Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.

Dicing Processing Parameters

If you are not familiar with dicing, the following document lists the important parameters you need to document before starting your job:

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