Dicing Saw (ADT): Difference between revisions

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{{tool|{{PAGENAME}}
{{tool2|{{PAGENAME}}
|picture=ADT.jpg
|picture=ADT.jpg
|type = Packaging
|type = Packaging
|super= Lee Sawyer
|super= Lee Sawyer
|super2= Aidan Hopkins
|location=Dicing Room: ESB 1147
|location=Backend Lab: ESB 1111
|description = ADT Dicing Saw
|description = ADT Dicing Saw
|model = ADT 7100
|model = ADT 7100
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}}
}}
==About==
==About==
The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of all types can be automatically or manually cut. This dicing Saw is optimized for multi-angle dicing of tight tolerance substrates up to 200 mm diameter in size.
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock.


Check the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock.
An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.


An ADT WM-966 tape applicator is used to mount samples to UV-release tape for dicing and an Ultron Systems UH104-8 UV lamp system is used to release samples from the tape after dicing.
Contact the tool supervisor for blades and dicing frames for your group.

Contact Staff for blades and dicing frames for your group.


==Detailed Specifications==
==Detailed Specifications==


*Maximum Wafer Size: 8"
*Maximum Wafer Size: 8"
*Parts mounted to UV-release tape for cutting
*Parts mounted to UV-release tape for dicing
*Automated cut maps at multiple angles (0° and 90° typical)
*Automated cut maps at multiple angles (0° and 90° typical)
**"Polygon" cutting to approximate Coring wafers is possible.
*~few micron alignment to on-wafer features.
*~Few micron alignment to on-wafer features.
*Thermocarbon Resnoid dicing blades provided by staff
*Thermocarbon Resnoid dicing blades provided by Staff


==Operating Procedures==
==Operating Procedures==


*[https://wiki.nanotech.ucsb.edu/w/images/1/11/ADT_SOP_Rev_E.pdf ADT Dicing Saw Standard Operating Procedure]
*[https://wiki.nanofab.ucsb.edu/w/images/5/54/ADT_SOP_Rev_J.pdf ADT Dicing Saw Standard Operating Procedure]
*[https://wiki.nanofab.ucsb.edu/w/images/5/5c/Post_Dicing_Tape_Expansion_SOP.pdf Post Dicing Tape Expansion]
*[[ADT 7100 - Recovering an Old Recipe (2019)|Recovering an Old Recipe]]
*[https://wiki.nanofab.ucsb.edu/w/images/5/5a/Ultron_1042R_Film_specs.pdf Ultron Systems, Inc. 1042R Anti-Static Ultraviolet Film TDS]

*[https://wiki.nanofab.ucsb.edu/w/images/5/59/Recipe_Importing_New_Software.pdf Recovering an Old Recipe (2023)]

==Recipes==
==Recipes==


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Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.

==== Dicing Processing Parameters ====
If you are not familiar with dicing, the following document lists the important parameters you need to document before starting your job:

* [[Media:Dicing - Example Dicing Instructions for UC Santa Barbara v2.pptx|Example Dicing Instructions for UC Santa Barbara v2.pptx]] ''- by Demis D. John''

Latest revision as of 21:29, 9 December 2024

Dicing Saw (ADT)
ADT.jpg
Location Backend Lab: ESB 1111
Tool Type Packaging
Manufacturer Advanced Dicing Technologies Ltd.
Model ADT 7100
Description ADT Dicing Saw

Primary Supervisor Lee Sawyer
(805) 893-2123
lee_sawyer@ucsb.edu

Secondary Supervisor

Aidan Hopkins


Recipes

SignupMonkey: Sign up for this tool


About

The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of all types can be automatically or manually cut. This dicing Saw is optimized for multi-angle dicing of tight tolerance substrates up to 200 mm diameter in size.

Check the Dicing Saw Recipes page for the blades we currently stock.

An ADT WM-966 tape applicator is used to mount samples to UV-release tape for dicing and an Ultron Systems UH104-8 UV lamp system is used to release samples from the tape after dicing.

Contact Staff for blades and dicing frames for your group.

Detailed Specifications

  • Maximum Wafer Size: 8"
  • Parts mounted to UV-release tape for dicing
  • Automated cut maps at multiple angles (0° and 90° typical)
    • "Polygon" cutting to approximate Coring wafers is possible.
  • ~Few micron alignment to on-wafer features.
  • Thermocarbon Resnoid dicing blades provided by Staff

Operating Procedures

Recipes

Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.

Dicing Processing Parameters

If you are not familiar with dicing, the following document lists the important parameters you need to document before starting your job: