Dicing Saw (ADT)

Dicing Saw (ADT) Location Backend Lab: ESB 1111 Tool Type Packaging Manufacturer Advanced Dicing Technologies Ltd. Model ADT 7100 Description ADT Dicing Saw Primary Supervisor Lee Sawyer (805) 893-2123 lee_sawyer@ucsb.edu Secondary Supervisor Aidan Hopkins Recipes SignupMonkey: Sign up for this tool

About

The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of all types can be automatically or manually cut. This dicing Saw is optimized for multi-angle dicing of tight tolerance substrates up to 200 mm diameter in size.

Check the Dicing Saw Recipes page for the blades we currently stock.

An ADT WM-966 tape applicator is used to mount samples to UV-release tape for dicing and an Ultron Systems UH104-8 UV lamp system is used to release samples from the tape after dicing.

Contact Staff for blades and dicing frames for your group.

Detailed Specifications

• Maximum Wafer Size: 8"
• Parts mounted to UV-release tape for dicing
• Automated cut maps at multiple angles (0° and 90° typical)
  • "Polygon" cutting to approximate Coring wafers is possible.
• ~Few micron alignment to on-wafer features.
• Thermocarbon Resnoid dicing blades provided by Staff

Operating Procedures

• ADT Dicing Saw Standard Operating Procedure
• Post Dicing Tape Expansion
• Ultron Systems, Inc. 1042R Anti-Static Ultraviolet Film TDS
• Recovering an Old Recipe (2023)

Recipes

• Recipes > Packaging > Dicing Saw Recipes (ADT 7100)

Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.

Dicing Processing Parameters

If you are not familiar with dicing, the following document lists the important parameters you need to document before starting your job:

• Example Dicing Instructions for UC Santa Barbara v2.pptx - by Demis D. John