Vacuum Deposition Recipes: Difference between revisions

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Noahdutra (talk | contribs)
staff
328 edits
added R4s to all dep, could do a look ahead. all R4s should have written procedures and data
Noahdutra (talk | contribs)
staff
328 edits
deleting As, Be, all Cd compounds, Ga, GaAs, InSb, Pb, PbS, Sb, Se, SiOx (SiO accounts for this), TiO, ZnS from dep list. Also removed TaO from EB4, and demoted GeO2 to R1
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! bgcolor="#d0e7ff" align="center" |GeO<sub>2</sub>
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|[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R4]]
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| bgcolor="#eeffff" |[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R4]]
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| bgcolor="#eeffff" |[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R4]]
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Revision as of 21:29, 14 August 2025

Process Control Data

See linked page for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.

Deposition Tools/Materials Table

Process Maturity Ranking

  • R6 - most mature process with regular calibrations recorded on SPC charts.
  • …
  • R1 - least mature - "possible" but you'll have to figure it out.

The Key/Legend for this table's R1...R6 values is at the bottom of the page.

Vacuum Deposition Recipes

 E-Beam Evaporation Sputtering Thermal Evaporation Plasma Enhanced Chemical
Vapor Deposition (PECVD) 		Atomic Layer Deposition Molecular Vapor Deposition
Material E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 3
(AJA ATC 2000-F) 		Sputter 4
(AJA ATC 2200-V) 		Sputter 5 (AJA ATC 2200-V) Ion Beam
Deposition (Veeco Nexus) 		Thermal
Evap 1 		Thermal Evap 2 (Solder) PECVD 1
(PlasmaTherm 790) 		PECVD 2
(Advanced Vacuum) 		Unaxis VLR ICP-PECVD Atomic Layer Deposition (Oxford FlexAL) Molecular Vapor Deposition (Tool)
Ag R2
R2 R2 R1 R1
R1 R1




AgBr
AgCl
Al R2
R2 R2 R1 R4 R5 R1 R4 R1




Al2O3 R2

R4 R4 R1 R4




R4
AuPd R1
AuZn R1
AuSn R1
AuGe R1
AlN



R1 R1
R1




R4
Au R6
R2 R6 R1 R4 R4
R4 R2




B













C R4
CaF2 R2
CeO2
R4












Co R2

R2 R4


R1 R1




Cr R6

R6 R4
R5
R4 R2




Cu R1


R4 R2

R2 R1




Fe R2

R2 R4


R1 R1




Ge R2
R2 R2 R1 R1







GeO2 R1
Gd R2

R1










Hf R1


R1










HfO2



R1 R1






R4
Hg
In








R4




Ir R1

R1








ITO
R4

R1 R1 R1 R1






KCl
LiF
Mg R1 R1
MgF2 R1 R1 R1
MgO R2
Mn
MnS
Mo R2


R4 R1






Na
NaCl
Nb R2



R4






NbO5
Nd



R1






Ni R6
R2 R6 R4
R1
R4 R2




NiCr R2 R2 R4
NiFe R1 R2 R1 R4
Pd R2
R2 R2



R4 R1




Pt R2
R2 R2 R4 R4 R4




R4
Ru R2

R2
R4






R4
Si
R2

R4 R1
R1

R4

SiN



R4 R1
R6

R6 R6 R6

SiN - Low Stress R4 R6 R6
SiN - Low Stress 3xTime R6
SiO2 R2 R2

R4 R1 R2 R6
R6 R6 R6 R4
SiO R1 R1
SiOxNy






R4

R4



Sn








R2




SrF2
R2





R1





Ta R1


R4 R1
R1





Ta2O5
R1



R6





Ti R6
R2 R6 R4 R4 R5 R1





TiN




R4
R1




R4
TiW R1


R2 R4








TiO2
R2

R1 R4
R4



R4
V



R1 R1







W R2


R2 R4







WC
Zn







R4 R2




ZnO










R4
Zr R2

R2 R1 R1


R1




ZrO2











R4
Material E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 3
(ATC 2000-F) 		Sputter 4
(ATC 2200-V) 		Sputter 5 (ATC 2200-V) Ion Beam
Deposition (Veeco Nexus) 		Thermal
Evap 1 		Thermal Evap 2 (Solder) PECVD 1
(PlasmaTherm 790) 		PECVD 2
(Advanced Vacuum) 		Unaxis VLR ICP-PECVD Atomic Layer Deposition (Oxford FlexAl) Molecular Vapor Deposition (Tool)

Process Ranking Table

Processes in the table above are ranked by their "Process Maturity Level" as follows:

Process Level Description of Process Level Ranking
A Process Allowed and materials available but never done
R1 Process has been ran at least once
R2 Process has been ran and/or procedure is documented or/and data available
R3 Process has been ran, procedure is documented, and data is available
R4 Process has a documented procedure with regular (≥4x per year) data or lookahead/in-Situ control available
R5 Process has a documented procedure with regular (≥4x per year) data and lookahead/in-Situ control available
R6 Process has a documented procedure, regular ( ≥4x per year) data, and control charts/limits available
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