Dry Etching Recipes: Difference between revisions

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Latest revision as of 20:00, 22 August 2025

Process Control Data

See above linked page for process control data (dep rate/stress etc. over time), for a selection of often-used dry etches

Dry Etching Tools/Materials Table

Process Maturity Ranking

R6 - most mature process with regular calibrations recorded on SPC charts.
…
R1 - least mature - only run once ever.

The Key/Legend for this table's A...R6 values is at the bottom of the page.

Dry Etching Recipes
	RIE Etching		ICP Etching					Oxygen Plasma Systems				Other Dry Etchers
Material	RIE 2 (MRC)	RIE 5 (PlasmaTherm)	DSEIII (PlasmaTherm)	Fluorine ICP (PlasmaTherm)	ICP Etch 1 (Panasonic E646V)	ICP Etch 2 (Panasonic E626I)	Oxford ICP (PlasmaPro 100)	Ashers (Technics PEII)	Plasma Clean (YES EcoClean)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)
Ag														R1
Al		R2			R1	R2								R1
Au														R3
Cr		R2			R1	R1								R1
Cu														R1
Ge					A	R1						R2		R1
Mo														R1
Nb					A	R1
Ni														R3
Os					A	R1
Pt														R3
Ru					A	R3								R1
Si			R6	R6			R1					R3		R1
Ta					A	R1								R1
Ti					R1	R1								R1
W				R3	R1	R1								R1
TiW				R3		R1
Al₂O₃					A	R3								R1
Al₂O_{3 (Sapphire)}					R1	R1								R1
AlGaAs		R3			R1		R3							R1
AlGaN							R2							R1
AlN														R1
BCB					A
CdZnTe	R3													R1
GaAs		R3			R1	R6	R3							R1
GaN		R3			R1	R1	R6							R1
GaSb					A	R1	R1							R1
HfO₂														R1
InGaAlAs	R3						R1							R1
InGaAsP	R3						R3							R1
InP	R3				A	R1	R6							R3
ITO	R3													R1
LiNbO3														R1
Photoresist & Organics		R3		R3	R3	R3		R3	R3	R3				R1
ARC (Anti Reflective Coating)				R3
SiC					R1	R1								R1
SiN				R3	R1	R3		R3						R1
SiO₂				R6	R1	R6							R3	R1
SiOxNy					A	R1								R1
SU8					A
Ta₂O₅					A	R1								R1
TiN														R1
TiO₂														R1
ZnO₂														R1
ZnS	R3													R1
ZnSe	R2													R1
ZrO₂														R1
Material	RIE 2 (MRC)	RIE 5 (PlasmaTherm)	DSEIII (PlasmaTherm)	Fluorine ICP (PlasmaTherm)	ICP Etch 1 (Panasonic E626I)	ICP Etch 2 (Panasonic E640)	Oxford ICP (PlasmaPro 100)	Ashers (Technics PEII)	Plasma Clean (YES EcoClean)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)

Process Ranking Table

Processes in the table above are ranked by their "Process Maturity Level" as follows:

Process Level	Description of Process Level Ranking
A	Process Allowed and materials available but never done
R1	Process has been ran at least once
R2	Process has been ran and procedure is documented
R3	Process has been ran, procedure is documented, and data is available
R4	Process has a documented procedure with regular (≥4x per year) data no in-Situ control available
R5	Process has a documented procedure with regular (≥4x per year) data and in-Situ control available
R6	Process has a documented procedure and control charts/limits available. Controlled process.

Dry Etching Recipes: Difference between revisions

Latest revision as of 20:00, 22 August 2025

Contents

Process Control Data

Dry Etching Tools/Materials Table

Process Maturity Ranking

Process Ranking Table

Navigation menu

@@ Line 1: / Line 1: @@
+===<u>[[Process Group - Process Control Data#Etching .28Process Control Data.29|Process Control Data]]</u>===
-{{Recipe Table Explanation}}
+<small>''See above [[Process Group - Process Control Data#Etching .28Process Control Data.29|linked page]] for [https://en.wikipedia.org/wiki/Statistical_process_control process control data] (dep rate/stress etc. over time), for a selection of often-used dry etches''</small>
+===Dry Etching Tools/Materials Table===
+==== Process Maturity Ranking ====
+* <code>'''R6'''</code> - most mature process with regular calibrations recorded on SPC charts.
+* …
+* <code>'''R1'''</code> - least mature - only run once ever.
+''The Key/Legend for this table's <code>A...R6</code> values is at the [[Dry Etching Recipes#Process Ranking Table|bottom of the page]].''
 {| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" border="1"
+|-
+! colspan="15" width="725" height="45" |<div style="font-size: 150%;">Dry Etching Recipes</div>
 |- bgcolor="#d0e7ff"
+| bgcolor="#eaecf0" |<!-- INTENTIONALLY LEFT BLANK -->
-! colspan="18" width="725" height="45" |<div style="font-size: 150%;">Dry Etching Recipes</div>
+! colspan="2" |'''[[RIE Etching Recipes|RIE Etching]]'''
+! colspan="5" |'''[[ICP Etching Recipes|ICP Etching]]'''
+! colspan="4" bgcolor="#d0e7ff" align="center" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
+! colspan="3" bgcolor="#d0e7ff" align="center" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
 |- bgcolor="#d0e7ff"
+! bgcolor="#d0e7ff" align="center" |'''Material'''
-|<!-- INTENTIONALLY LEFT BLANK -->
+| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> <span style="font-size: 88%;">(MRC)</span>]]
-! colspan="4" width="300" height="35" align="center" bgcolor="#d0e7ff" |'''[[RIE Etching Recipes|RIE Etching]]'''
+| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
-! colspan="5" |'''[[ICP Etching Recipes|ICP Etching]]'''
+| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
-! colspan="5" align="center" bgcolor="#d0e7ff" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
-! colspan="3" align="center" bgcolor="#d0e7ff" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
+| bgcolor="#daf1ff" |[[ICP Etching Recipes#PlasmaTherm.2FSLR Fluorine Etcher|Fluorine ICP <span style="font-size: 88%;">(PlasmaTherm)</span>]]
+| bgcolor="#daf1ff" |[[ICP Etching Recipes#ICP Etch 1 .28Panasonic E646V.29|ICP Etch 1<br><span style="font-size: 88%;">(Panasonic  E646V)</span>]]
-|-
+| bgcolor="#daf1ff" |[[ICP Etching Recipes#ICP Etch 2 .28Panasonic E626I.29|ICP Etch 2<br><span style="font-size: 88%;">(Panasonic  E626I)</span>]]
-! width="65" align="center" bgcolor="#d0e7ff" |'''Material'''
-| width="65" bgcolor="#daf1ff" |[[RIE 1 (Custom)|RIE 1<br>(Retired)]]
+| bgcolor="#daf1ff" |[[ICP Etching Recipes#Oxford ICP Etcher .28PlasmaPro 100 Cobra.29|Oxford ICP <span style="font-size: 88%;">(PlasmaPro 100)</span>]]
-| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
+| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br><span style="font-size: 88%;">(Technics PEII)</span>]]
-| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
+| bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean <span style="font-size: 88%;">(YES EcoClean)</span>]]
-| width="100" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
+| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
+| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br><span style="font-size: 88%;">(EVG 810)</span>]]
-| width="100" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
+| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br><span style="font-size: 88%;">(Xetch)</span>]]
-| width="100" bgcolor="#daf1ff" |[https://www.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#PlasmaTherm.2FSLR_Fluorine_Etcher SLR Fluorine ICP (PlasmaTherm)]
-| width="120" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic 1)]]
+| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br><span style="font-size: 88%;">(uETCH)</span>]]
-| width="120" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic 2)]]
+| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br><span style="font-size: 88%;">(Oxford)</span>]]
-| width="85" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br>(Unaxis VLR)]]
-| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
-| width="95" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
-| width="95" bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean (YES EcoClean)]]
-| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
-| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
-| width="85" bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br>(Xetch)]]
-| width="85" bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
-| width="85" bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
 |- bgcolor="#eeffff"
-! align="center" bgcolor="#d0e7ff" |Ag
+! bgcolor="#d0e7ff" align="center" |Ag
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@@ Line 43: / Line 51: @@
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+|R1
+|- bgcolor="#ffffff"
+! bgcolor="#d0e7ff" align="center" |Al
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+|[[RIE Etching Recipes|R2]]
 |
 |
+|{{rl|ICP Etching Recipes|Al Etch (Panasonic 1)|R1}}
-|A
+|[[ICP Etching Recipes#Al Etch .28Panasonic 2.29|R2]]
-|- bgcolor="#eeffff"
-! align="center" bgcolor="#d0e7ff" |Al
 |
 |
 |
-|[[RIE Etching Recipes|A]]
 |
 |
-|{{rl|ICP Etching Recipes|Al Etch (Panasonic 1)}}
-|{{rl|ICP Etching Recipes|Al Etch (Panasonic 2)}}
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+|R1
+|- bgcolor="#eeffff"
+! bgcolor="#d0e7ff" align="center" |Au
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@@ Line 65: / Line 76: @@
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-|A
-|- bgcolor="#eeffff"
-! align="center" bgcolor="#d0e7ff" |Au
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@@ Line 75: / Line 83: @@
 |
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+|[[Other Dry Etching Recipes|R3]]
+|- bgcolor="#ffffff"
+! bgcolor="#d0e7ff" align="center" |Cr
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+|[[RIE Etching Recipes|R2]]
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+|{{rl|ICP Etching Recipes|Cr Etch (Panasonic 1)}}
+|R1
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@@ Line 84: / Line 98: @@
 |
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+|
-|[https://www.nanotech.ucsb.edu/wiki/index.php/Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29 R]
+|R1
 |- bgcolor="#eeffff"
-! align="center" bgcolor="#d0e7ff" |Cr
+! bgcolor="#d0e7ff" align="center" |Cu
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-|A
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-|{{rl|ICP Etching Recipes|Cr Etch (Panasonic 1)}}
-|A
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@@ Line 103: / Line 115: @@
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-|A
+|R1
-|- bgcolor="#eeffff"
+|- bgcolor="#ffffff"
-! align="center" bgcolor="#d0e7ff" |Cu
+! bgcolor="#d0e7ff" align="center" |Ge
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+|A
+|R1
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@@ Line 115: / Line 129: @@
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+|[[Other Dry Etching Recipes|R2]]
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+|R1
+|- bgcolor="#eeffff"
+! bgcolor="#d0e7ff" align="center" |Mo
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-|
-|
-|
-|A
-|-
-! align="center" bgcolor="#d0e7ff" |Ge
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@@ Line 135: / Line 147: @@
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+|R1
+|-
+!Nb
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@@ Line 140: / Line 155: @@
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 |A
+|R1
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-|A
-|- bgcolor="#eeffff"
-! align="center" bgcolor="#d0e7ff" |Mo
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@@ Line 151: / Line 164: @@
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+|- bgcolor="#ffffff"
+! bgcolor="#d0e7ff" align="center" |Ni
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@@ Line 160: / Line 175: @@
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-|A
-|-
-! align="center" bgcolor="#d0e7ff" |Ni
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+|[[Other Dry Etching Recipes|R3]]
+|-
+!Os
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+|A
+|R1
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@@ Line 179: / Line 196: @@
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+|- bgcolor="#eeffff"
-|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
+! bgcolor="#d0e7ff" align="center" |Pt
-|-
-! align="center" bgcolor="#d0e7ff" |Pt
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@@ Line 195: / Line 211: @@
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+|[[Other Dry Etching Recipes|R3]]
-|
+|- bgcolor="#ffffff"
-|
+! bgcolor="#d0e7ff" align="center" |Ru
-|
-|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
-|-
-! align="center" bgcolor="#d0e7ff" |Ru
-|
-|
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@@ Line 208: / Line 219: @@
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 |A
-|{{Rl|ICP Etching Recipes|Ru (Ruthenium) Etch (Panasonic 2)}}
+|[[ICP Etching Recipes#Ru .28Ruthenium.29 Etch .28Panasonic 2.29|R3]]
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@@ Line 216: / Line 227: @@
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-|
+|R1
-|A
 |- bgcolor="#eeffff"
-! align="center" bgcolor="#d0e7ff" |Si
+! bgcolor="#d0e7ff" align="center" |Si
 |
 |
+|[[ICP Etching Recipes#DSEIII .28PlasmaTherm.2FDeep Silicon Etcher.29|R6]]
+|[[ICP Etching Recipes#Si Etch Recipes (Fluorine ICP Etcher)|R6]]
 |
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+|R1
-|{{rl|ICP Etching Recipes|DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)}}
-|{{Rl|ICP Etching Recipes|Si Etching}}
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+|[[Other Dry Etching Recipes|R3]]
 |
+|R1
+|- bgcolor="#ffffff"
+! bgcolor="#d0e7ff" align="center" |Ta
 |
 |
 |
-|{{rl|Other Dry Etching Recipes|Other Dry Etch (XeF2 Etcher)}}
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 |A
-|-
+|R1
-! align="center" bgcolor="#d0e7ff" |Ta
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@@ Line 246: / Line 259: @@
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+|R1
+|- bgcolor="#eeffff"
+! bgcolor="#d0e7ff" align="center" |Ti
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+|{{rl|ICP Etching Recipes|Ti Etch (Panasonic 1)}}
+|R1
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@@ Line 255: / Line 273: @@
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-|A
-|-
-! align="center" bgcolor="#d0e7ff" |Ti
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+|R1
+|- bgcolor="#ffffff"
+! bgcolor="#d0e7ff" align="center" |W
 |
 |
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+|R3
+|{{rl|ICP Etching Recipes|W-TiW Etch (Panasonic 1)}}
+|R1
 |
-|{{rl|ICP Etching Recipes|Ti Etch (Panasonic 1)}}
-|A
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@@ Line 272: / Line 291: @@
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+|R1
+|-
+!TiW
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-|A
-|-
-! align="center" bgcolor="#d0e7ff" |Al<sub>2</sub>O<sub>3</sub>
 |
+|R3
 |
+|R1
 |
 |
 |
 |
-|
-|[https://www.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#Al2O3_Etching_.28Panasonic_2.29 R]
 |
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+|- bgcolor="#ffffff"
+! bgcolor="#d0e7ff" align="center" |Al<sub>2</sub>O<sub>3</sub>
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@@ Line 294: / Line 315: @@
 |
 |A
+|[[ICP Etching Recipes#Al2O3 Etching .28Panasonic 2.29|R3]]
-|- bgcolor="#eeffff"
-! align="center" bgcolor="#d0e7ff" |Al<sub>2</sub>O<sub>3 (Sapphire)</sub>
 |
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@@ Line 302: / Line 322: @@
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-|{{rl|ICP Etching Recipes|Sapphire Etch (Panasonic 1)}}
-|A
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+|R1
+|- bgcolor="#eeffff"
+! bgcolor="#d0e7ff" align="center" |Al<sub>2</sub>O<sub>3 (Sapphire)</sub>
 |
 |
 |
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+|{{rl|ICP Etching Recipes|Sapphire Etch (Panasonic 1)}}
+|R1
 |
 |
 |
-|A
-|-
-! align="center" bgcolor="#d0e7ff" |AlGaAs
 |
 |
 |
-|{{rl|RIE Etching Recipes|AlGaAs\GaAs Etching (RIE 5)}}
 |
+|R1
+|- bgcolor="#ffffff"
+! bgcolor="#d0e7ff" align="center" |AlGaAs
 |
-|{{rl|ICP Etching Recipes|AlGaAs Etch (Panasonic 1)}}
+|[[RIE Etching Recipes|R3]]
 |
-|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaAs-AlGaAs Etch (Unaxis VLR)|AlGaAs Etch (Unaxis VLR)}}
 |
+|{{rl|ICP Etching Recipes|GaAs-AlGaAs Etch (Panasonic 1)}}
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+|[[ICP Etching Recipes#GaAs Etch .28Oxford ICP Etcher.29|R3]]
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@@ Line 331: / Line 354: @@
 |
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-|A
+|
+|R1
 |- bgcolor="#eeffff"
-! align="center" bgcolor="#d0e7ff" |AlGaN
+! bgcolor="#d0e7ff" align="center" |AlGaN
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@@ Line 340: / Line 364: @@
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+|[[ICP Etching Recipes#GaN Etch .28Oxford ICP Etcher.29|R2]]
 |
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-|{{rl|ICP Etching Recipes|GaN Etch (Unaxis VLR)}}
 |
 |
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+|R1
+|- bgcolor="#ffffff"
+! bgcolor="#d0e7ff" align="center" |AlN
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-|A
-|-
-! align="center" bgcolor="#d0e7ff" |AlN
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@@ Line 360: / Line 384: @@
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-|
-|{{rl|ICP Etching Recipes|GaN Etch (Unaxis VLR)}}
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+|R1
+|-
+!BCB
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@@ Line 370: / Line 395: @@
 |
 |A
-|- bgcolor="#eeffff"
-! align="center" bgcolor="#d0e7ff" |CdZnTe
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-|{{rl|RIE Etching Recipes|CdZnTe Etch (RIE 2)}}
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@@ Line 382: / Line 404: @@
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+|- bgcolor="#eeffff"
+! bgcolor="#d0e7ff" align="center" |CdZnTe
+|[[RIE Etching Recipes|R3]]
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@@ Line 388: / Line 413: @@
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-|A
-|- bgcolor="#eeffff"
-! align="center" bgcolor="#d0e7ff" |GaAs
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-|{{rl|RIE Etching Recipes|AlGaAs\GaAs Etching (RIE 5)}}
 |
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-|{{rl|ICP Etching Recipes|GaAs-AlGaAs_Etch_.28Panasonic_1.29}}
-|{{rl|ICP Etching Recipes|GaAs Etch (Panasonic 2)}}
-|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaAs-AlGaAs Etch (Unaxis VLR)|GaAs Etch (Unaxis VLR)}}
 |
+|R1
+|- bgcolor="#ffffff"
+! bgcolor="#d0e7ff" align="center" |GaAs
 |
+|[[RIE Etching Recipes|R3]]
 |
 |
+|{{rl|ICP Etching Recipes|GaAs-AlGaAs Etch (Panasonic 1)}}
+|[[ICP Etching Recipes#GaAs Etch .28Panasonic 2.29|R6]]
+|[[ICP Etching Recipes#GaAs Etch .28Oxford ICP Etcher.29|R3]]
 |
 |
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-|A
-|-
-! align="center" bgcolor="#d0e7ff" |GaN
 |
 |
 |
+|R1
-|{{rl|RIE Etching Recipes|GaN Etching (RIE 5)}}
+|- bgcolor="#eeffff"
+! bgcolor="#d0e7ff" align="center" |GaN
+|
+|[[RIE Etching Recipes|R3]]
 |
 |
 |{{rl|ICP Etching Recipes|GaN Etch (Panasonic 1)}}
+|R1
+|[[ICP Etching Recipes#GaN Etch .28Oxford ICP Etcher.29|R6]]
 |
-|{{rl|ICP Etching Recipes|GaN Etch (Unaxis VLR)}}
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+|
+|
+|R1
+|- bgcolor="#ffffff"
+! bgcolor="#d0e7ff" align="center" |GaSb
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@@ Line 427: / Line 459: @@
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 |A
+|R1
-|- bgcolor="#eeffff"
+|R1
-! align="center" bgcolor="#d0e7ff" |GaSb
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@@ Line 435: / Line 467: @@
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+|R1
+|- bgcolor="#eeffff"
+! bgcolor="#d0e7ff" align="center" |HfO<sub>2</sub>
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-|A
-|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaSb Etch Unaxis VLR)}}
 |
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@@ Line 445: / Line 478: @@
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-|A
-|- bgcolor="#eeffff"
-! align="center" bgcolor="#d0e7ff" |HfO<sub>2</sub>
 |
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@@ Line 453: / Line 483: @@
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+|R1
+|- bgcolor="#ffffff"
+! bgcolor="#d0e7ff" align="center" |InGaAlAs
+|[[RIE Etching Recipes|R3]]
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@@ Line 458: / Line 492: @@
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+|R1
 |
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@@ Line 464: / Line 499: @@
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-|A
+|R1
 |- bgcolor="#eeffff"
-! align="center" bgcolor="#d0e7ff" |InGaAlAs
+! bgcolor="#d0e7ff" align="center" |InGaAsP
+|[[RIE Etching Recipes|R3]]
 |
-|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 |
 |
 |
 |
+|[[ICP Etching Recipes#InP Ridge Etch .28Oxford ICP Etcher.29|R3]]
 |
 |
-|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
 |
 |
 |
 |
+|R1
+|- bgcolor="#ffffff"
+! bgcolor="#d0e7ff" align="center" |InP
+|[[RIE Etching Recipes|R3]]
 |
 |
 |
 |A
-|-
+|R1
+|[[ICP Etching Recipes#InP Ridge Etch .28Oxford ICP Etcher.29|R6]]
-! align="center" bgcolor="#d0e7ff" |InGaAsP
 |
-|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 |
 |
@@ Line 493: / Line 531: @@
 |
 |
+|[[Other Dry Etching Recipes|R3]]
+|- bgcolor="#eeffff"
+! bgcolor="#d0e7ff" align="center" |ITO
+|[[RIE Etching Recipes|R3]]
 |
-|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
 |
 |
@@ Line 502: / Line 543: @@
 |
 |
-|A
-|- bgcolor="#eeffff"
-! align="center" bgcolor="#d0e7ff" |InP
 |
-|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 |
 |
 |
+|R1
+|-
+!LiNbO3
 |
-|A
-|A
-|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
 |
 |
@@ Line 521: / Line 558: @@
 |
 |
-|A
-|-
-! align="center" bgcolor="#d0e7ff" |ITO
 |
-|{{rl|RIE Etching Recipes|ITO Etch (RIE 2)}}
 |
 |
 |
 |
+|R1
+|- bgcolor="#ffffff"
+!Photoresist & Organics
 |
+|[[RIE Etching Recipes|R3]]
 |
+|[[ICP Etching Recipes#Photoresist .26 ARC .28Fluorine ICP Etcher.29|R3]]
+|[https://wiki.nanotech.ucsb.edu/wiki/ICP_Etching_Recipes#Photoresist_and_ARC_Etching_.28Panasonic_1.29 R3]
+|[[ICP Etching Recipes#Al2O3 Etching .28Panasonic 2.29|R3]]
 |
+|R3
+|[[Oxygen Plasma System Recipes#O2 Ashing|R3]]
+|[[Oxygen Plasma System Recipes#O2 Ashing|R3]]
 |
 |
 |
+|R1
+|-
+!ARC (Anti Reflective Coating)
 |
 |
 |
+|[[ICP Etching Recipes#Photoresist .26 ARC .28Fluorine ICP Etcher.29|R3]]
 |
-|A
-|- bgcolor="#eeffff"
-!Photoresist
-& ARC
 |
 |
-|A
-|[https://www.nanotech.ucsb.edu/wiki/index.php/RIE_Etching_Recipes#Photoresist_and_ARC R]
 |
 |
-|[https://www.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#Photoresist_and_ARC_Etching R]
-|[https://www.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#Photoresist_and_ARC_etching_2 R]
 |
-|A
-|A
-|A
 |
 |
 |
 |
+|- bgcolor="#eeffff"
-|A
+! bgcolor="#d0e7ff" align="center" |SiC
-|-
-! align="center" bgcolor="#d0e7ff" |SiC
-|
-|
 |
 |
@@ Line 570: / Line 603: @@
 |
 |{{rl|ICP Etching Recipes|SiC Etch (Panasonic 1)}}
-|A
+|R1
 |
 |
@@ Line 578: / Line 611: @@
 |
 |
-|
+|R1
+|- bgcolor="#ffffff"
-|A
+! bgcolor="#d0e7ff" align="center" |SiN
-|-
-! align="center" bgcolor="#d0e7ff" |SiN
-|
-|
-|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiN<sub>x</sub> Etching (RIE 3)}}
 |
 |
 |
+|[[ICP Etching Recipes#Si3N4 Etching .28Fluorine ICP Etcher.29|R3]]
 |{{rl|ICP Etching Recipes|SiNx Etching (Panasonic 1)}}
-|{{rl|ICP Etching Recipes|SiNx Etching (Panasonic 2)}}
+|[[ICP Etching Recipes#SiNx Etching .28Panasonic 2.29|R3]]
 |
+|[[Oxygen Plasma System Recipes#O2 Ashing|R3]]
-|A
 |
 |
@@ Line 597: / Line 627: @@
 |
 |
-|
+|R1
-|A
 |- bgcolor="#eeffff"
-! align="center" bgcolor="#d0e7ff" |SiO<sub>2</sub>
+! bgcolor="#d0e7ff" align="center" |SiO<sub>2</sub>
 |
 |
-|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiO<sub>2</sub> Etching (RIE 3)}}
 |
+|[[ICP Etching Recipes#SiO2 Etch Recipes (Fluorine ICP Etcher)|R6]]
-|
-|A
 |{{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 1)}}
-|{{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 2)}}
+|[[ICP Etching Recipes#SiO2 Etching .28Panasonic 2.29|R6]]
 |
 |
@@ Line 615: / Line 642: @@
 |
 |
+|[[Other Dry Etching Recipes|R3]]
+|R1
+|- bgcolor="#ffffff"
+! bgcolor="#d0e7ff" align="center" |SiOxNy
 |
-|{{rl|Other Dry Etching Recipes|Other Dry Etch (Vapor HF Etcher)}}
-|A
-|- bgcolor="#eeffff"
-! align="center" bgcolor="#d0e7ff" |SiOxNy
 |
 |
 |
+|A
+|R1
 |
 |
 |
-|A
-|A
 |
 |
 |
 |
+|R1
+|-
+!SU8
 |
 |
@@ Line 637: / Line 667: @@
 |
 |A
-|-
-! align="center" bgcolor="#d0e7ff" |Ta<sub>2</sub>O<sub>5</sub>
 |
 |
@@ Line 644: / Line 672: @@
 |
 |
-|
-|
-|[https://www.osapublishing.org/optica/abstract.cfm?uri=optica-4-5-532 A]
 |
 |
 |
 |
+|- bgcolor="#eeffff"
+! bgcolor="#d0e7ff" align="center" |Ta<sub>2</sub>O<sub>5</sub>
 |
 |
@@ Line 656: / Line 683: @@
 |
 |A
-|-
+|R1
-! align="center" bgcolor="#d0e7ff" |TiN
 |
 |
@@ Line 665: / Line 691: @@
 |
 |
+|R1
+|- bgcolor="#ffffff"
+! bgcolor="#d0e7ff" align="center" |TiN
 |
 |
@@ Line 674: / Line 703: @@
 |
 |
-|A
-|- bgcolor="#eeffff"
-! align="center" bgcolor="#d0e7ff" |TiO<sub>2</sub>
 |
 |
 |
 |
-|
+|R1
-|
-|
-|
-|
-|
-|
-|
-|
-|
-|
-|
-|A
 |- bgcolor="#eeffff"
-! align="center" bgcolor="#d0e7ff" |W-TiW
+! bgcolor="#d0e7ff" align="center" |TiO<sub>2</sub>
 |
 |
@@ Line 702: / Line 716: @@
 |
 |
-|{{rl|ICP Etching Recipes|W-TiW Etch (Panasonic 1)}}
-|A
 |
 |
@@ Line 711: / Line 723: @@
 |
 |
-|
+|R1
-|A
 |- bgcolor="#eeffff"
-! align="center" bgcolor="#d0e7ff" |ZnO<sub>2</sub>
+! bgcolor="#d0e7ff" align="center" |ZnO<sub>2</sub>
 |
 |
@@ Line 728: / Line 739: @@
 |
 |
+|R1
+|- bgcolor="#ffffff"
+! bgcolor="#d0e7ff" align="center" |ZnS
+|[[RIE Etching Recipes|R3]]
 |
 |
 |
-|A
-|-
-! align="center" bgcolor="#d0e7ff" |ZnS
 |
-|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
 |
 |
@@ Line 744: / Line 755: @@
 |
 |
+|R1
+|- bgcolor="#eeffff"
+! bgcolor="#d0e7ff" align="center" |ZnSe
+|[[RIE Etching Recipes|R2]]
 |
 |
@@ Line 750: / Line 765: @@
 |
 |
-|A
-|-
-! align="center" bgcolor="#d0e7ff" |ZnSe
 |
-|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
 |
 |
@@ Line 760: / Line 771: @@
 |
 |
-|
+|R1
+|- bgcolor="#ffffff"
-|
+! bgcolor="#d0e7ff" align="center" |ZrO<sub>2</sub>
-|
-|
-|
-|
-|
-|
-|
-|A
-|-
-! align="center" bgcolor="#d0e7ff" |ZrO<sub>2</sub>
-|
-|
-|
 |
 |
@@ Line 788: / Line 787: @@
 |
 |
+|R1
+|- bgcolor="#eeffff"
+! bgcolor="#d0e7ff" align="center" |'''Material'''
+| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> <span style="font-size: 88%;">(MRC)</span>]]
+| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
+| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
+| bgcolor="#daf1ff" |[[ICP Etching Recipes#PlasmaTherm.2FSLR Fluorine Etcher|Fluorine ICP <span style="font-size: 88%;">(PlasmaTherm)</span>]]
+| bgcolor="#daf1ff" |[[ICP Etching Recipes#ICP Etch 1 .28Panasonic E646V.29|ICP Etch 1<br><span style="font-size: 88%;">(Panasonic E626I)</span>]]
+| bgcolor="#daf1ff" |[[ICP Etching Recipes#ICP Etch 2 .28Panasonic E626I.29|ICP Etch 2<br><span style="font-size: 88%;">(Panasonic E640)</span>]]
+| bgcolor="#daf1ff" |[[ICP Etching Recipes#Oxford ICP Etcher .28PlasmaPro 100 Cobra.29|Oxford ICP <span style="font-size: 88%;">(PlasmaPro 100)</span>]]
+| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br><span style="font-size: 88%;">(Technics PEII)</span>]]
+| bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean <span style="font-size: 88%;">(YES EcoClean)</span>]]
+| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
+| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br><span style="font-size: 88%;">(EVG 810)</span>]]
+| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br><span style="font-size: 88%;">(Xetch)</span>]]
+| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br><span style="font-size: 88%;">(uETCH)</span>]]
+| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br><span style="font-size: 88%;">(Oxford)</span>]]
+|}
+===Process Ranking Table===
+Processes in the table above are ranked by their "''Process Maturity Level''" as follows:
+{| class="wikitable"
+!Process  Level
+! colspan="11" |Description of  Process Level Ranking
+|-
 |A
+| colspan="11" |Process '''A'''llowed and materials available but never done
 |-
+|R1
-! align="center" bgcolor="#d0e7ff" |'''Material'''
+| colspan="11" |Process has been ran at least once
-| bgcolor="#daf1ff" |[[RIE 1 (Custom)|RIE 1<br>(Retired)]]
+|-
-| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
+|R2
-| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
+| colspan="11" |Process has been ran and procedure is documented
-| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
+|-
-| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
+|R3
-| bgcolor="#daf1ff" |[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|SLR Fluorine ICP (PlasmaTherm)]]
+| colspan="11" |Process has been ran, procedure is documented, and data is available
-| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic E626I)]]
+|-
-| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic E640)]]
+|R4
-| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br>(Unaxis VLR)]]
+| colspan="11" |Process has a documented procedure with regular (≥4x per year) data '''no''' in-Situ control available
-| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
+|-
-| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
+|R5
-| width="95" bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean (YES EcoClean)]]
+| colspan="11" |Process has a documented procedure with regular (≥4x per year) data '''and''' in-Situ control available
-| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
+|-
-| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
+|R6
-| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br>(Xetch)]]
+| colspan="11" |Process has a documented procedure and control charts/limits available.  Controlled process.
-| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
-| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
 |}
 [[Category:Processing]]

Dry Etching Recipes: Difference between revisions

Latest revision as of 20:00, 22 August 2025

Process Control Data

Dry Etching Tools/Materials Table

Process Maturity Ranking

Process Ranking Table

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