Process Group Internships: Difference between revisions
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The NanoFab hosts UCSB Undergraduate Interns throughout the school year and summer. |
The NanoFab hosts UCSB Undergraduate Interns throughout the school year and summer. |
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=== Internship Goals === |
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Our goals are twofold: |
Our goals are twofold: |
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# Acquire [[Process Group - Process Control Data|Process Control Data]] |
# '''Increased Tool Uptime''': Acquire [[Process Group - Process Control Data|Process Control Data]] so NanoFab staff can proactively identify equipment/process problems, and |
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# Give [[Process Group Interns|Interns]] |
# '''Industry-Relevant Experience''': Give [[Process Group Interns|Interns]] hands-on industry-relevant experience to minimize the training required at any microelectronics company/research group. |
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The skills acquired for each goal are as follows: |
The skills acquired for each goal are as follows: |
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=== Industry-relevant Experience === |
==== Industry-relevant Experience ==== |
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** Cleanroom safety & protocols such as PPE, safe waste disposal etc. |
** Cleanroom safety & protocols such as PPE, safe waste disposal etc. |
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** Managing their own schedule to accomplish weekly processing tasks. |
** Managing their own schedule to accomplish weekly processing tasks. |
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** Communications with |
** Communications with |
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*** lab users (scheduling around other users) |
*** lab users (scheduling around other users) |
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*** equipment |
*** equipment engineers (training, handling/reporting tool issues) |
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*** process supervisors/managers (reviewing process control data) |
*** process supervisors/managers (reviewing process control data, OCAP actions) |
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* '''Equipment''': Become comfortable with learning different |
* '''Equipment''': Become comfortable with learning different Operating Procedures of similar tool types |
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** Eg. 4 different plasma depositions, 4 different ICP etchers etc. |
** Eg. 4 different plasma depositions, 4 different ICP etchers etc. |
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** Once an intern has learned 3 different PECVD deposition tools, it is trivial to learn a new PECVD tool even from an unfamiliar manufacturer. |
** Once an intern has learned 3 different PECVD deposition tools, it is trivial to learn a new PECVD tool even from an unfamiliar manufacturer. |
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* [https://en.wikipedia.org/wiki/Manufacturing_execution_system '''MES''']: Learn to utilize production tracking/communications |
* [https://en.wikipedia.org/wiki/Manufacturing_execution_system '''MES''']: Learn to utilize production tracking/communications tools |
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** Travelers/Process Followers |
** Travelers/Process Followers & associated data directories are created and filled out at run-time for every calibration. (Digital/online via Google Sheets+Drive) |
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** |
** Combining ''Equipment Operating Procedures'' with ''Process Travelers'' instructions at run-time. |
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** Data collection with standardized digital filenames |
** Data collection with standardized digital filenames & directory structures, available online to all lab users. |
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** [https://docs.google.com/spreadsheets/d/1fTDNXxpf4tgNYLIEs_jvehG1KvtXqqTRDBI7sHNAVvo/edit?gid=0#gid=0 Click on the '''date''' of any SPC data row here to see a Traveler & Data folder] filled out by interns (or here is [https://drive.google.com/drive/folders/10v4pElyxNBTe4kJw8fMtuBtj54M5vkPx one example]). |
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*** Every Calibration process has the same format: see other intern-run processes here: [[Process Group - Process Control Data|Process Control Data]] |
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* '''[https://en.wikipedia.org/wiki/Statistical_process_control SPC]''': Perform metrology, process control, create SPC charts |
* '''[https://en.wikipedia.org/wiki/Statistical_process_control SPC]''': Perform metrology, process control, create SPC charts |
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** Data from the Travelers are entered into online spreadsheets, which calculate SPC charts |
** Data from the Travelers are entered into online spreadsheets, which calculate SPC charts |
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** Some interns create/modify SPC charts when needed for newly developed Cals. |
** Some interns create/modify SPC charts when needed for newly developed Cals. |
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** See the intern-generated SPC data here: [[Process Group - Process Control Data|Process Control Data]] |
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* '''OCAP/Repair''': Work with tool engineers to identify & diagnose equipment problems. |
* '''OCAP/Repair''': Work with tool engineers to identify & diagnose equipment problems. |
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** If Process Engineers identify an Out-of-Control process, Interns are involved in the communications & testing of tool repairs. |
** If Process Engineers identify an Out-of-Control process, Interns are involved in the communications & testing of tool repairs, until process is back "in control". |
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=== Process Control for Increased Uptime === |
==== Process Control (SPC) for Increased Uptime ==== |
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* Calibration processes are identical each time (unlike lab user's processes), allowing apples-to-apples comparisons. |
* Calibration processes are identical each time (unlike lab user's processes), allowing apples-to-apples comparisons. |
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* Regular meetings with Process Engineers allow us to proactively identify equipment/process issues, failing tool components, and schedule repairs/remedies sooner than if detected by a lab user. |
* Regular meetings with Process Engineers allow us to proactively identify equipment/process issues, failing tool components, and schedule repairs/remedies sooner than if detected by a lab user. |
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=== Phase 1: Deposition Cals (1st Quarter) === |
=== Phase 1: Deposition Cals (1st Quarter) === |
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* Interns |
* Interns run 4 different deposition tools weekly, in the following order: |
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** Plasmatherm PECVD 1 |
** [[PECVD 1 (PlasmaTherm 790)|Plasmatherm PECVD 1]] |
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** Advanced Vacuum PECVD 2, |
** [[PECVD 2 (Advanced Vacuum)|Advanced Vacuum PECVD 2]], |
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** Unaxis ICP-PECVD, |
** [[ICP-PECVD (Unaxis VLR)|Unaxis ICP-PECVD]], |
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** Veeco Ion Beam Deposition |
** [[Ion Beam Deposition (Veeco NEXUS)|Veeco Ion Beam Sputter Deposition]] |
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** 3-4 different films (SiO<sub>2</sub>, Si<sub>3</sub>N<sub>4</sub>, Low-stress-Si<sub>3</sub>N<sub>4</sub>) are run on <u>each tool</u>. |
** 3-4 different films (SiO<sub>2</sub>, Si<sub>3</sub>N<sub>4</sub>, Low-stress-Si<sub>3</sub>N<sub>4</sub>) are run on <u>each tool</u>. |
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* Every film undergoes the following metrology: |
* Every film undergoes the following metrology: |
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** Ellipsometry: Thin-film thickness and refractive index at 2 different wavelengths. |
** [[Ellipsometer (Woollam)|Ellipsometry]]: Thin-film thickness and refractive index at 2 different wavelengths. |
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** Reflectometry Wafer Mapping: Thin-film Uniformity across the wafer. |
** [[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)|Reflectometry Wafer Mapping]]: Thin-film Uniformity across the wafer. |
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** Particle Count: laser-scanning via Surfscan, at two different particle-size/range settings |
** [[Surface Analysis (KLA/Tencor Surfscan)|Particle Count]]: laser-scanning via Surfscan, at two different particle-size/range settings |
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** Thin-Film Stress: requires before & after wafer bow measurements via laser scanning |
** [[Film Stress (Tencor Flexus)|Thin-Film Stress]]: requires before & after wafer bow measurements via laser scanning |
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* Follow Process Protocols: |
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** Follow and Record Data onto Travelers for every Cal run, save metro data into publicly-accessible folders. |
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** Update all [[Process Group - Process Control Data|SPC data tables]] and charts accurately, report any "out of control" process issues. |
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* By the end of 1st Quarter, Interns are running 9-12 thin-film cals every 2 weeks. |
* By the end of 1st Quarter, Interns are running 9-12 thin-film cals every 2 weeks. |
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=== Phase 2: EtchCals and LithoCals (2nd Quarter) === |
=== Phase 2: EtchCals and LithoCals (2nd Quarter) === |
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* Interns |
* Interns run 4 different ICP Etchers weekly: |
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** Plasmatherm SLR Fluorine Etcher |
** [[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasmatherm SLR Fluorine ICP Etcher]] - SiO2 and Si etching |
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** Oxford Cobra III-V Etcher |
** [[Oxford ICP Etcher (PlasmaPro 100 Cobra)|Oxford Cobra III-V ICP Etcher]] - InP etching |
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** Plasmatherm DSEiii |
** [[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasmatherm DSEiii]] - Bosch etching of Silicon |
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** Panasonic ICP #2 |
** [[ICP Etch 2 (Panasonic E626I)|Panasonic ICP #2]] - SiO2 and GaAs etching |
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** 1-2 different Etches per tool; one "insensitive" to chamber condition, one "sensitive" to chamber condition. |
** 1-2 different Etches per tool; one "insensitive" to chamber condition, one "sensitive" to chamber condition. |
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* Metrology on each EtchCal: |
* Metrology on each EtchCal: |
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** SEM of manually Cleaved Cross-section |
** [[SEM 1 (JEOL IT800SHL)|SEM]] of manually Cleaved Cross-section |
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** Cleaving samples for cross-sectional SEM. |
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** Profilometry & Etch-Rate Calculation |
** [[Step Profilometer (DektakXT)|Profilometry]] & Etch-Rate Calculation |
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** Etch Selectivity Calculation via pre/post hardmask removal profilometry |
** Etch Selectivity Calculation via pre/post hardmask removal profilometry |
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* Metro on each LithoCal: |
* Metro on each LithoCal: |
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** SEM for Critical Dimension measurement; multiple locations on wafer. |
** [[SEM 1 (JEOL IT800SHL)|SEM]] for Critical Dimension measurement; multiple locations on wafer. |
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** Identification of "hotspot" particulate contamination on wafer/tool. |
** Identification of "hotspot" particulate contamination on wafer/tool. |
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* Follow Process Protocols: |
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| ⚫ | |||
** Follow and Record Data onto Travelers for every Cal run, save metro data into publicly-accessible folders. |
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** Update all [[Process Group - Process Control Data|SPC data tables]] and charts accurately, report any "out of control" process issues. |
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Latest revision as of 01:53, 25 November 2025
The NanoFab hosts UCSB Undergraduate Interns throughout the school year and summer.
Internship Goals
Our goals are twofold:
- Increased Tool Uptime: Acquire Process Control Data so NanoFab staff can proactively identify equipment/process problems, and
- Industry-Relevant Experience: Give Interns hands-on industry-relevant experience to minimize the training required at any microelectronics company/research group.
The skills acquired for each goal are as follows:
Industry-relevant Experience
- Protocols: Interns become comfortable in a busy semiconductor 'fab environment. After 2-3 months of regular usage the interns are fully comfortable with:
- Cleanroom safety & protocols such as PPE, safe waste disposal etc.
- Managing their own schedule to accomplish weekly processing tasks.
- Multi-tasking to run simultaneous processes fast and efficiently.
- Interns learn new tools only once their current cals have been condensed into a few hours.
- Communications with
- lab users (scheduling around other users)
- equipment engineers (training, handling/reporting tool issues)
- process supervisors/managers (reviewing process control data, OCAP actions)
- Equipment: Become comfortable with learning different Operating Procedures of similar tool types
- Eg. 4 different plasma depositions, 4 different ICP etchers etc.
- Once an intern has learned 3 different PECVD deposition tools, it is trivial to learn a new PECVD tool even from an unfamiliar manufacturer.
- MES: Learn to utilize production tracking/communications tools
- Travelers/Process Followers & associated data directories are created and filled out at run-time for every calibration. (Digital/online via Google Sheets+Drive)
- Combining Equipment Operating Procedures with Process Travelers instructions at run-time.
- Data collection with standardized digital filenames & directory structures, available online to all lab users.
- Click on the date of any SPC data row here to see a Traveler & Data folder filled out by interns (or here is one example).
- Every Calibration process has the same format: see other intern-run processes here: Process Control Data
- SPC: Perform metrology, process control, create SPC charts
- Data from the Travelers are entered into online spreadsheets, which calculate SPC charts
- Some interns create/modify SPC charts when needed for newly developed Cals.
- See the intern-generated SPC data here: Process Control Data
- OCAP/Repair: Work with tool engineers to identify & diagnose equipment problems.
- If Process Engineers identify an Out-of-Control process, Interns are involved in the communications & testing of tool repairs, until process is back "in control".
Process Control (SPC) for Increased Uptime
- Interns run process-control on the lab's most critical/high-usage tools & update SPC charts.
- Calibration processes are identical each time (unlike lab user's processes), allowing apples-to-apples comparisons.
- Regular meetings with Process Engineers allow us to proactively identify equipment/process issues, failing tool components, and schedule repairs/remedies sooner than if detected by a lab user.
- Lab users are notified of process anomalies & repair plans, reducing bad outcomes for lab users.
- "Contamination" checks via On-Demand process-checks
- Determine whether a new process affects other processes on the same tool, by running pre/post Cal Etches.
- On ICP Etchers, enables data-driven equipment sharing between processes.
- Enables lab-users to quickly determine whether problems lie with the Equipment/"contamination", another user's process or their own Process.
Job Description: 2 phases
Internships are generally run in 2 phases, with each phase being approx. 1 Quarter (3 months) long.
Phase 1: Deposition Cals (1st Quarter)
- Interns run 4 different deposition tools weekly, in the following order:
- Plasmatherm PECVD 1
- Advanced Vacuum PECVD 2,
- Unaxis ICP-PECVD,
- Veeco Ion Beam Sputter Deposition
- 3-4 different films (SiO2, Si3N4, Low-stress-Si3N4) are run on each tool.
- Every film undergoes the following metrology:
- Ellipsometry: Thin-film thickness and refractive index at 2 different wavelengths.
- Reflectometry Wafer Mapping: Thin-film Uniformity across the wafer.
- Particle Count: laser-scanning via Surfscan, at two different particle-size/range settings
- Thin-Film Stress: requires before & after wafer bow measurements via laser scanning
- Follow Process Protocols:
- Follow and Record Data onto Travelers for every Cal run, save metro data into publicly-accessible folders.
- Update all SPC data tables and charts accurately, report any "out of control" process issues.
- By the end of 1st Quarter, Interns are running 9-12 thin-film cals every 2 weeks.
Phase 2: EtchCals and LithoCals (2nd Quarter)
- Interns run 4 different ICP Etchers weekly:
- Plasmatherm SLR Fluorine ICP Etcher - SiO2 and Si etching
- Oxford Cobra III-V ICP Etcher - InP etching
- Plasmatherm DSEiii - Bosch etching of Silicon
- Panasonic ICP #2 - SiO2 and GaAs etching
- 1-2 different Etches per tool; one "insensitive" to chamber condition, one "sensitive" to chamber condition.
- Metrology on each EtchCal:
- SEM of manually Cleaved Cross-section
- Cleaving samples for cross-sectional SEM.
- Profilometry & Etch-Rate Calculation
- Etch Selectivity Calculation via pre/post hardmask removal profilometry
- Interns run weekly ASML DUV Stepper lithography: photoresist coating, exposure and develop.
- Critical particulate-sensitive process, cal shows any particles present
- Intern's techniques are remedied if particles are detected.
- Critical particulate-sensitive process, cal shows any particles present
- Metro on each LithoCal:
- SEM for Critical Dimension measurement; multiple locations on wafer.
- Identification of "hotspot" particulate contamination on wafer/tool.
- Follow Process Protocols:
- Follow and Record Data onto Travelers for every Cal run, save metro data into publicly-accessible folders.
- Update all SPC data tables and charts accurately, report any "out of control" process issues.
- By the end of 2nd Quarter, Interns are running LithoCals and ~2 EtchCals weekly, with multiple SEM sessions. They are proficient at SEM by the end of the 2nd quarter.