Process Group Internships: Difference between revisions

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The skills acquired for each goal are as follows:
The skills acquired for each goal are as follows:


=== Industry-relevant Experience ===
==== Industry-relevant Experience ====

* '''Protocols''': Interns become comfortable in a busy semiconductor 'fab environment. After 2-3 months of regular usage the interns are fully comfortable with:
* '''Protocols''': Interns become comfortable in a busy semiconductor 'fab environment. After 2-3 months of regular usage the interns are fully comfortable with:
** Cleanroom safety & protocols such as PPE, safe waste disposal etc.
** Cleanroom safety & protocols such as PPE, safe waste disposal etc.
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** Communications with
** Communications with
*** lab users (scheduling around other users)
*** lab users (scheduling around other users)
*** equipment staff (reporting tool issues)
*** equipment engineers (training, handling/reporting tool issues)
*** process supervisors/managers (reviewing process control data)
*** process supervisors/managers (reviewing process control data, OCAP actions)
* '''Equipment''': Become comfortable with learning different SOP's of similar tool types
* '''Equipment''': Become comfortable with learning different Operating Procedures of similar tool types
** Eg. 4 different plasma depositions, 4 different ICP etchers etc.
** Eg. 4 different plasma depositions, 4 different ICP etchers etc.
** Once an intern has learned 3 different PECVD deposition tools, it is trivial to learn a new PECVD tool even from an unfamiliar manufacturer.
** Once an intern has learned 3 different PECVD deposition tools, it is trivial to learn a new PECVD tool even from an unfamiliar manufacturer.
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** Combining ''Equipment Operating Procedures'' with ''Process Travelers'' instructions at run-time.
** Combining ''Equipment Operating Procedures'' with ''Process Travelers'' instructions at run-time.
** Data collection with standardized digital filenames & directory structures, available online to all lab users.
** Data collection with standardized digital filenames & directory structures, available online to all lab users.
** [https://docs.google.com/spreadsheets/d/1fTDNXxpf4tgNYLIEs_jvehG1KvtXqqTRDBI7sHNAVvo/edit?gid=0#gid=0 Click on the '''date''' of any SPC data row here to see a Traveler & Data folder] filled out by interns (or here is [https://drive.google.com/drive/folders/10v4pElyxNBTe4kJw8fMtuBtj54M5vkPx one example]).
*** Every Calibration process has the same format: see other intern-run processes here: [[Process Group - Process Control Data|Process Control Data]]
* '''[https://en.wikipedia.org/wiki/Statistical_process_control SPC]''': Perform metrology, process control, create SPC charts
* '''[https://en.wikipedia.org/wiki/Statistical_process_control SPC]''': Perform metrology, process control, create SPC charts
** Data from the Travelers are entered into online spreadsheets, which calculate SPC charts
** Data from the Travelers are entered into online spreadsheets, which calculate SPC charts
** Some interns create/modify SPC charts when needed for newly developed Cals.
** Some interns create/modify SPC charts when needed for newly developed Cals.
** See the intern-generated SPC data here: [[Process Group - Process Control Data|Process Control Data]]
* '''OCAP/Repair''': Work with tool engineers to identify & diagnose equipment problems.
* '''OCAP/Repair''': Work with tool engineers to identify & diagnose equipment problems.
** If Process Engineers identify an Out-of-Control process, Interns are involved in the communications & testing of tool repairs.
** If Process Engineers identify an Out-of-Control process, Interns are involved in the communications & testing of tool repairs, until process is back "in control".


=== Process Control for Increased Uptime ===
==== Process Control (SPC) for Increased Uptime ====
* Interns run process-control on the lab's most critical/high-usage tools & update [[Process Group - Process Control Data|SPC charts]].

* Interns run process-control on the lab's most critical/high-usage tools.
* Calibration processes are identical each time (unlike lab user's processes), allowing apples-to-apples comparisons.
* Calibration processes are identical each time (unlike lab user's processes), allowing apples-to-apples comparisons.
* Regular meetings with Process Engineers allow us to proactively identify equipment/process issues, failing tool components, and schedule repairs/remedies sooner than if detected by a lab user.
* Regular meetings with Process Engineers allow us to proactively identify equipment/process issues, failing tool components, and schedule repairs/remedies sooner than if detected by a lab user.
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=== Phase 1: Deposition Cals (1st Quarter) ===
=== Phase 1: Deposition Cals (1st Quarter) ===


* Interns learn 4 different deposition tools, in the following order:
* Interns run 4 different deposition tools weekly, in the following order:
** Plasmatherm PECVD 1
** [[PECVD 1 (PlasmaTherm 790)|Plasmatherm PECVD 1]]
** Advanced Vacuum PECVD 2,
** [[PECVD 2 (Advanced Vacuum)|Advanced Vacuum PECVD 2]],
** Unaxis ICP-PECVD,
** [[ICP-PECVD (Unaxis VLR)|Unaxis ICP-PECVD]],
** Veeco Ion Beam Deposition
** [[Ion Beam Deposition (Veeco NEXUS)|Veeco Ion Beam Sputter Deposition]]
** 3-4 different films (SiO<sub>2</sub>, Si<sub>3</sub>N<sub>4</sub>, Low-stress-Si<sub>3</sub>N<sub>4</sub>) are run on <u>each tool</u>.
** 3-4 different films (SiO<sub>2</sub>, Si<sub>3</sub>N<sub>4</sub>, Low-stress-Si<sub>3</sub>N<sub>4</sub>) are run on <u>each tool</u>.
* Every film undergoes the following metrology:
* Every film undergoes the following metrology:
** Ellipsometry: Thin-film thickness and refractive index at 2 different wavelengths.
** [[Ellipsometer (Woollam)|Ellipsometry]]: Thin-film thickness and refractive index at 2 different wavelengths.
** Reflectometry Wafer Mapping: Thin-film Uniformity across the wafer.
** [[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)|Reflectometry Wafer Mapping]]: Thin-film Uniformity across the wafer.
** Particle Count: laser-scanning via Surfscan, at two different particle-size/range settings
** [[Surface Analysis (KLA/Tencor Surfscan)|Particle Count]]: laser-scanning via Surfscan, at two different particle-size/range settings
** Thin-Film Stress: requires before & after wafer bow measurements via laser scanning
** [[Film Stress (Tencor Flexus)|Thin-Film Stress]]: requires before & after wafer bow measurements via laser scanning
* Follow Process Protocols:
** Follow and Record Data onto Travelers for every Cal run, save metro data into publicly-accessible folders.
** Update all [[Process Group - Process Control Data|SPC data tables]] and charts accurately, report any "out of control" process issues.
* By the end of 1st Quarter, Interns are running 9-12 thin-film cals every 2 weeks.
* By the end of 1st Quarter, Interns are running 9-12 thin-film cals every 2 weeks.


=== Phase 2: EtchCals and LithoCals (2nd Quarter) ===
=== Phase 2: EtchCals and LithoCals (2nd Quarter) ===


* Interns learn 4 different ICP Etchers:
* Interns run 4 different ICP Etchers weekly:
** Plasmatherm SLR Fluorine Etcher
** [[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasmatherm SLR Fluorine ICP Etcher]] - SiO2 and Si etching
** Oxford Cobra III-V Etcher
** [[Oxford ICP Etcher (PlasmaPro 100 Cobra)|Oxford Cobra III-V ICP Etcher]] - InP etching
** Plasmatherm DSEiii
** [[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasmatherm DSEiii]] - Bosch etching of Silicon
** Panasonic ICP #2
** [[ICP Etch 2 (Panasonic E626I)|Panasonic ICP #2]] - SiO2 and GaAs etching
** 1-2 different Etches per tool; one "insensitive" to chamber condition, one "sensitive" to chamber condition.
** 1-2 different Etches per tool; one "insensitive" to chamber condition, one "sensitive" to chamber condition.
* Interns learn ASML DUV Stepper lithography: photoresist coating, exposure and develop.
** Critical particulate-sensitive process, cal shows any particles present
*** Intern's techniques are remedied if particles are detected.
* Metrology on each EtchCal:
* Metrology on each EtchCal:
** SEM of manually Cleaved Cross-section
** [[SEM 1 (JEOL IT800SHL)|SEM]] of manually Cleaved Cross-section
** Cleaving samples for cross-sectional SEM.
** Profilometry & Etch-Rate Calculation
** [[Step Profilometer (DektakXT)|Profilometry]] & Etch-Rate Calculation
** Etch Selectivity Calculation via pre/post hardmask removal profilometry
** Etch Selectivity Calculation via pre/post hardmask removal profilometry
* Interns run weekly [[Stepper 3 (ASML DUV)|ASML DUV Stepper lithography]]: photoresist coating, exposure and develop.
** Critical particulate-sensitive process, cal shows any particles present
*** Intern's techniques are remedied if particles are detected.
* Metro on each LithoCal:
* Metro on each LithoCal:
** SEM for Critical Dimension measurement; multiple locations on wafer.
** [[SEM 1 (JEOL IT800SHL)|SEM]] for Critical Dimension measurement; multiple locations on wafer.
** Identification of "hotspot" particulate contamination on wafer/tool.
** Identification of "hotspot" particulate contamination on wafer/tool.
* Follow Process Protocols:
* By the end of 2nd Quarter, Interns are running LithoCals and ~2 Etchcals weekly, with multiple SEM sessions. They are proficient at SEM by the end of the 2nd quarter.
** Follow and Record Data onto Travelers for every Cal run, save metro data into publicly-accessible folders.
** Update all [[Process Group - Process Control Data|SPC data tables]] and charts accurately, report any "out of control" process issues.
* By the end of 2nd Quarter, Interns are running LithoCals and ~2 EtchCals weekly, with multiple SEM sessions. They are proficient at SEM by the end of the 2nd quarter.

Latest revision as of 01:53, 25 November 2025

The NanoFab hosts UCSB Undergraduate Interns throughout the school year and summer.

Internship Goals

Our goals are twofold:

  1. Increased Tool Uptime: Acquire Process Control Data so NanoFab staff can proactively identify equipment/process problems, and
  2. Industry-Relevant Experience: Give Interns hands-on industry-relevant experience to minimize the training required at any microelectronics company/research group.


The skills acquired for each goal are as follows:

Industry-relevant Experience

  • Protocols: Interns become comfortable in a busy semiconductor 'fab environment. After 2-3 months of regular usage the interns are fully comfortable with:
    • Cleanroom safety & protocols such as PPE, safe waste disposal etc.
    • Managing their own schedule to accomplish weekly processing tasks.
    • Multi-tasking to run simultaneous processes fast and efficiently.
      • Interns learn new tools only once their current cals have been condensed into a few hours.
    • Communications with
      • lab users (scheduling around other users)
      • equipment engineers (training, handling/reporting tool issues)
      • process supervisors/managers (reviewing process control data, OCAP actions)
  • Equipment: Become comfortable with learning different Operating Procedures of similar tool types
    • Eg. 4 different plasma depositions, 4 different ICP etchers etc.
    • Once an intern has learned 3 different PECVD deposition tools, it is trivial to learn a new PECVD tool even from an unfamiliar manufacturer.
  • MES: Learn to utilize production tracking/communications tools
    • Travelers/Process Followers & associated data directories are created and filled out at run-time for every calibration. (Digital/online via Google Sheets+Drive)
    • Combining Equipment Operating Procedures with Process Travelers instructions at run-time.
    • Data collection with standardized digital filenames & directory structures, available online to all lab users.
    • Click on the date of any SPC data row here to see a Traveler & Data folder filled out by interns (or here is one example).
      • Every Calibration process has the same format: see other intern-run processes here: Process Control Data
  • SPC: Perform metrology, process control, create SPC charts
    • Data from the Travelers are entered into online spreadsheets, which calculate SPC charts
    • Some interns create/modify SPC charts when needed for newly developed Cals.
    • See the intern-generated SPC data here: Process Control Data
  • OCAP/Repair: Work with tool engineers to identify & diagnose equipment problems.
    • If Process Engineers identify an Out-of-Control process, Interns are involved in the communications & testing of tool repairs, until process is back "in control".

Process Control (SPC) for Increased Uptime

  • Interns run process-control on the lab's most critical/high-usage tools & update SPC charts.
  • Calibration processes are identical each time (unlike lab user's processes), allowing apples-to-apples comparisons.
  • Regular meetings with Process Engineers allow us to proactively identify equipment/process issues, failing tool components, and schedule repairs/remedies sooner than if detected by a lab user.
  • Lab users are notified of process anomalies & repair plans, reducing bad outcomes for lab users.
  • "Contamination" checks via On-Demand process-checks
    • Determine whether a new process affects other processes on the same tool, by running pre/post Cal Etches.
    • On ICP Etchers, enables data-driven equipment sharing between processes.
    • Enables lab-users to quickly determine whether problems lie with the Equipment/"contamination", another user's process or their own Process.

Job Description: 2 phases

Internships are generally run in 2 phases, with each phase being approx. 1 Quarter (3 months) long.

Phase 1: Deposition Cals (1st Quarter)

  • Interns run 4 different deposition tools weekly, in the following order:
  • Every film undergoes the following metrology:
  • Follow Process Protocols:
    • Follow and Record Data onto Travelers for every Cal run, save metro data into publicly-accessible folders.
    • Update all SPC data tables and charts accurately, report any "out of control" process issues.
  • By the end of 1st Quarter, Interns are running 9-12 thin-film cals every 2 weeks.

Phase 2: EtchCals and LithoCals (2nd Quarter)

  • Interns run 4 different ICP Etchers weekly:
  • Metrology on each EtchCal:
    • SEM of manually Cleaved Cross-section
    • Cleaving samples for cross-sectional SEM.
    • Profilometry & Etch-Rate Calculation
    • Etch Selectivity Calculation via pre/post hardmask removal profilometry
  • Interns run weekly ASML DUV Stepper lithography: photoresist coating, exposure and develop.
    • Critical particulate-sensitive process, cal shows any particles present
      • Intern's techniques are remedied if particles are detected.
  • Metro on each LithoCal:
    • SEM for Critical Dimension measurement; multiple locations on wafer.
    • Identification of "hotspot" particulate contamination on wafer/tool.
  • Follow Process Protocols:
    • Follow and Record Data onto Travelers for every Cal run, save metro data into publicly-accessible folders.
    • Update all SPC data tables and charts accurately, report any "out of control" process issues.
  • By the end of 2nd Quarter, Interns are running LithoCals and ~2 EtchCals weekly, with multiple SEM sessions. They are proficient at SEM by the end of the 2nd quarter.