Other Dry Etching Recipes: Difference between revisions
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{{recipes|Dry Etching}} |
{{recipes|Dry Etching}} |
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=[[XeF2 Etch (Xetch)]]= |
=[[XeF2 Etch (Xetch)]]= |
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*[https://wiki.nanotech.ucsb.edu/w/images/2/25/06-XeF2-etch-recipe.pdf Si Etch Recipe] |
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=[[Vapor HF Etch (uETCH)]]= |
=[[Vapor HF Etch (uETCH)]]= |
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*[https://wiki.nanotech.ucsb.edu/w/images/e/e2/25-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-a.pdf SiO<sub>2</sub> Etch Recipe 1] |
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=[[CAIBE (Oxford Ion Mill)]]= |
=[[CAIBE (Oxford Ion Mill)]]= |
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*'''Reminder: From now on, one should always use P<sub>RF</sub>=200W! (see [[Bill Millerski|supervisor]] for explanation)''' |
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*[https://wiki.nanotech.ucsb.edu/w/images/5/53/InP_Etching_result-CAIBE.pdf InP Etch Recipe] |
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=Misc= |
=Misc= |
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Latest revision as of 15:17, 9 December 2022
Back to Dry Etching Recipes.
XeF2 Etch (Xetch)
Vapor HF Etch (uETCH)
CAIBE (Oxford Ion Mill)
- Reminder: From now on, one should always use PRF=200W! (see supervisor for explanation)
- Pt Etch Recipe
- Au Etch Recipe
- Ni Etch Recipe
- InP Etch Recipe