Test Data of etching SiO2 with CHF3/CF4: Difference between revisions

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{| class="wikitable"
{| class="wikitable"
| colspan="5" |ICP#2: 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec
| colspan="5" |'''ICP#2''': 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec
|
|
|-
|-
|Date
!Date
|Sample#
!Sample#
|Etch Rate (nm/min)
!Etch Rate (nm/min)
|Etch Selectivity (SiO2/PR)
!Etch Selectivity (SiO2/PR)
!Comments
|Averaged Sidewall Angle (<sup>o</sup>)
|SEM Images
!SEM Images;
|-
|-
|10/5/2018
|1/11/23
|ND_Pan2_011123
|SiO2#02
|142.9
|160
|1.2
|1.11
|
|82.1
|[https://wiki.nanotech.ucsb.edu/wiki/images/1/13/SiO2_Etch_using_ICP2-no_O2.pdf]
|[https://wiki.nanotech.ucsb.edu/w/images/1/18/30_pan2_011123_002.jpg <nowiki>[30D]</nowiki>][https://wiki.nanotech.ucsb.edu/w/images/e/eb/Cs_pan2_011123_002.jpg <nowiki>[CS]</nowiki>]
|-
|-
|1/28/2019
|12/15/22
|ND_Pan2_121522
|I21901
|146
|148
|1.23
|1.10
|
|
|[https://wiki.nanotech.ucsb.edu/wiki/images/f/f9/SiO2_Etch_using_ICP2-no_O2-a.pdf]
|[https://wiki.nanotech.ucsb.edu/w/images/a/a8/30D_pan2_121522_002.jpg <nowiki>[30D]</nowiki>][https://wiki.nanotech.ucsb.edu/w/images/3/33/CS_pan2_121522_002.jpg <nowiki>[CS]</nowiki>]
|-
|-
|3/6/2019
|12/09/22
|ND_Pan2_120922
|I21904
|151
|138
|1.23
|1.12
|
|85.6
|[https://wiki.nanotech.ucsb.edu/wiki/images/8/87/SiO2_Etch_using_ICP2_no_O2-3-06-2019.pdf]
|[https://wiki.nanotech.ucsb.edu/w/images/b/b3/30D_pan2_120922_002.jpg <nowiki>[30D]</nowiki>][https://wiki.nanotech.ucsb.edu/w/images/9/99/CS_pan2_120922_002.jpg <nowiki>[CS]</nowiki>]
|-
|-
|7/18/2019
|11/18/22
|ND_Pan2_111822
|I21905
|162
|154
|1.33
|
|[https://wiki.nanotech.ucsb.edu/w/images/8/82/30D_pan2_111822_002.jpg <nowiki>[30D]</nowiki>][https://wiki.nanotech.ucsb.edu/w/images/c/c9/CS_pan2_111822_002.jpg <nowiki>[CS]</nowiki>]
|-
|11/07/22
|ND_Pan2_110722
|155.7
|1.18
|
|[https://wiki.nanotech.ucsb.edu/w/images/f/f1/30D_pan2_110722_002.jpg <nowiki>[30]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/4/43/CS_pan2_110722_003.jpg <nowiki>[CS]</nowiki>]
|-
|10/21/22
|ND_Pan2_102122
|148.6
|1.37
|1.37
|
|
|[https://wiki.nanotech.ucsb.edu/wiki/images/2/23/I2190506.pdf]
|[https://wiki.nanotech.ucsb.edu/w/images/f/f5/30D_pan2_102122_002.jpg <nowiki>[30D]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/3/3d/CS_pan2_102122_002.jpg <nowiki>[CS]</nowiki>]
|-
|-
|1/16/2020
|10/10/22
|ND_Pan2_101022
|I22001
|118.3
|149
|1.21
|1.07
|
|
|[https://wiki.nanotech.ucsb.edu/wiki/images/0/09/I2200122.pdf]
|[https://wiki.nanotech.ucsb.edu/w/images/7/7c/30D_pan2_101022_002.jpg <nowiki>[30D]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/9/9b/CS_pan2_101022_003.jpg <nowiki>[CS]</nowiki>]
|-
|-
|8/9/2020
|10/3/22
|ND_Pan2_100322
|I22002
|143.1
|102
|0.86
|1.23
|
|caused by air leaking to CHF3 channel
|[https://wiki.nanotech.ucsb.edu/w/images/d/d4/I2200203.pdf]
|[https://wiki.nanotech.ucsb.edu/w/images/a/a0/30D_10302022_pan2_002.jpg <nowiki>[30D]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/6/6d/CS_10302022_pan2_002.jpg <nowiki>[CS]</nowiki>]
|-
|-
|1/7/2021
|9/26/22
|ND_Pan2n_092622
|I22101
|131.4
|144
|1.40
|Samples from new wafer
|[https://wiki.nanotech.ucsb.edu/w/images/b/b4/30D_Pan2n_092622_002.jpg <nowiki>[30D]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/c/c7/CS_Pan1n_092622_002.jpg <nowiki>[CS]</nowiki>]
|-
|9/26/22
|ND_Pan2o_092622
|130.6
|1.14
|Samples from old wafer
|[https://wiki.nanotech.ucsb.edu/w/images/7/79/45D_Pan2o_092622_002.jpg <nowiki>[45D]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/8/8e/CS_Pan2n_092622_002.jpg <nowiki>[CS]</nowiki>]
|-
|9/12/22
|ND_Pan2_091222
|156
|1.33
|Higher etch rate/selectivity, may be due to new Si wafer
|[https://wiki.nanotech.ucsb.edu/w/images/7/79/30D_pan2_091222_002.jpg <nowiki>[30D]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/c/cf/CS_pan2_091222_002.jpg <nowiki>[CS]</nowiki>]
|-
|8/26/22
|ND_Pan2_082622
|144.3
|1.22
|
|[https://wiki.nanotech.ucsb.edu/w/images/7/71/30D_Pan2_082622_001.jpg <nowiki>[30D]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/a/ad/CS_Pan2_082622_001.jpg <nowiki>[CS]</nowiki>]
|-
|8/8/2022
|ND_Pan2_080822
|134.3
|1.12
|
|[https://wiki.nanotech.ucsb.edu/w/images/6/6d/30D_08082022_pan2_001.jpg <nowiki>[30D]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/c/c0/CS_08082022_pan2_001.jpg <nowiki>[CS]</nowiki>]
|-
|7/29/2022
|ND_Pan2_072922
|142.3
|1.20
|1.20
|
|
|[https://wiki.nanotech.ucsb.edu/w/images/0/0c/I2210102.pdf]
|[https://wiki.nanotech.ucsb.edu/w/images/e/ef/30D_002.jpg <nowiki>[30D]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/d/db/CS_002_07-29-22.jpg <nowiki>[CS]</nowiki>]
|-
|-
|5/19/2021
|7/15/2022
|ND_Pan2_071522
|I22102
|139.1
|163
|1.20
|
|[https://wiki.nanotech.ucsb.edu/w/images/a/a5/ND_Pan2_071522_45D.jpg <nowiki>[45D]</nowiki>][https://wiki.nanotech.ucsb.edu/w/images/f/fe/ND_Pan2_071522_CS.jpg <nowiki>[CS]</nowiki>]
|-
|5/5/2022
|NP_ICP2_07
|170
|1.11
|1.11
|Right after Quartz Top-Plate Temperature reduced 100°C-->50°C.
|Etch time=130 sec
Etch Characteristics look similar to before.
|[https://wiki.nanotech.ucsb.edu/w/images/4/4c/I2210214.pdf]
|[https://wiki.nanotech.ucsb.edu/w/images/9/94/ICP2_07_45D_002.jpg <nowiki>[1]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/1/10/ICP2_07_CS_005.jpg <nowiki>[2]</nowiki>]
|-
|-
|7/21/2021
|4/26/2022
|NP_ICP2_06
|I22103
|176.3
|134
|1.09
|1.14
|
|Investigating reports of low etch rate
|[https://wiki.nanotech.ucsb.edu/w/images/c/c3/I2210308.pdf]
|[https://wiki.nanotech.ucsb.edu/w/images/e/ec/ICP2_06_45D_002.jpg <nowiki>[1]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/f/f6/ICP2_06_CS_001.jpg <nowiki>[2]</nowiki>]
|-
|4/20/2022
|NP_ICP2_05
|171.7
|1.13
|
|[https://wiki.nanotech.ucsb.edu/w/images/9/9c/ICP2_05_45D_003.jpg <nowiki>[1]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/a/a5/ICP2_05_CS_001.jpg <nowiki>[2]</nowiki>]
|-
|4/12/2022
|NP_ICP2_04
|167.9
|1.17
|
|[https://wiki.nanotech.ucsb.edu/w/images/6/6b/ICP2_004_45D_001.jpg <nowiki>[1]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/4/49/ICP2_004_CS_003.jpg <nowiki>[2]</nowiki>]
|-
|3/30/2022
|NP_ICP2_03
|164
|1.23
|
|[https://wiki.nanotech.ucsb.edu/w/images/c/c3/ICP2_03_45D_002.jpg <nowiki>[1]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/7/74/ICP2_03_CS_003.jpg <nowiki>[2]</nowiki>]
|-
|3/8/2022
|NP_ICP2_02
|144
|1.02
|
|[https://wiki.nanotech.ucsb.edu/w/images/f/f4/ICP2_02_45D_001.jpg <nowiki>[1]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/5/54/ICP2_02_CS_004.jpg <nowiki>[2]</nowiki>]
|-
|3/2/2022
|NP_ICP2_01
|169.6
|1.29
|
|[https://wiki.nanotech.ucsb.edu/w/images/2/2e/ICP2_01_45D_002.jpg <nowiki>[1]</nowiki>] [https://wiki.nanotech.ucsb.edu/w/images/6/69/ICP2_01_CS_007.jpg <nowiki>[2]</nowiki>]
|-
|8/9/2021
|I22105
|140
|0.97
|After etching diamond sample for 1 hour using Cl2/Ar. Found
chamber/etches are ok.
|[https://wiki.nanotech.ucsb.edu/w/images/2/26/I2210508.pdf]
|-
|-
|8/9/2021
|8/9/2021
Line 80: Line 180:
|[https://wiki.nanotech.ucsb.edu/w/images/2/28/I2210411.pdf]
|[https://wiki.nanotech.ucsb.edu/w/images/2/28/I2210411.pdf]
|-
|-
|8/9/2021
|7/21/2021
|I22103
|I22105
|140
|134
|0.97
|1.09
|Investigating reports of low etch rate
|After etching diamond sample for 1 hour using Cl2/Ar
|[https://wiki.nanotech.ucsb.edu/w/images/2/26/I2210508.pdf]
|[https://wiki.nanotech.ucsb.edu/w/images/c/c3/I2210308.pdf]
|}
|-
|5/19/2021

|I22102
=== Alternate Data (not updated since 2019) ===
|163
|1.11
|Etch time=130 sec
|[https://wiki.nanotech.ucsb.edu/w/images/4/4c/I2210214.pdf]
|-
|1/7/2021
|I22101
|144
|1.20
|
|[https://wiki.nanotech.ucsb.edu/w/images/0/0c/I2210102.pdf]
|-
|8/9/2020
|I22002
|102
|0.86
|caused by air leaking to CHF3 channel
|[https://wiki.nanotech.ucsb.edu/w/images/d/d4/I2200203.pdf]
|-
|1/16/2020
|I22001
|149
|1.21
|
|[https://wiki.nanotech.ucsb.edu/wiki/images/0/09/I2200122.pdf]
|-
|7/18/2019
|I21905
|162
|1.37
|
|[https://wiki.nanotech.ucsb.edu/wiki/images/2/23/I2190506.pdf]
|-
|3/6/2019
|I21904
|151
|1.23
|85.6
|[https://wiki.nanotech.ucsb.edu/wiki/images/8/87/SiO2_Etch_using_ICP2_no_O2-3-06-2019.pdf]
|-
|1/28/2019
|I21901
|146
|1.23
|
|[https://wiki.nanotech.ucsb.edu/wiki/images/f/f9/SiO2_Etch_using_ICP2-no_O2-a.pdf]
|-
|10/5/2018
|SiO2#02
|160
|1.2
|82.1
|[https://wiki.nanotech.ucsb.edu/wiki/images/1/13/SiO2_Etch_using_ICP2-no_O2.pdf]
|}<br />
===Alternate Data (not updated)===
''We stopped taking data for the following table in 2019, use the above data instead.''


* [[Test Data of etching SiO2 with CHF3/CF4/O2 (using this recipe only for Fluorine etch of the underneath layer)|Test Data of etching SiO2 with CHF3/CF4/O2]]
*[[Test Data of etching SiO2 with CHF3/CF4/O2 (using this recipe only for Fluorine etch of the underneath layer)|Test Data of etching SiO2 with CHF3/CF4/O2]]

Latest revision as of 20:15, 11 January 2023

ICP#2: 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec
Date Sample# Etch Rate (nm/min) Etch Selectivity (SiO2/PR) Comments SEM Images;
1/11/23 ND_Pan2_011123 142.9 1.11 [30D][CS]
12/15/22 ND_Pan2_121522 148 1.10 [30D][CS]
12/09/22 ND_Pan2_120922 138 1.12 [30D][CS]
11/18/22 ND_Pan2_111822 154 1.33 [30D][CS]
11/07/22 ND_Pan2_110722 155.7 1.18 [30] [CS]
10/21/22 ND_Pan2_102122 148.6 1.37 [30D] [CS]
10/10/22 ND_Pan2_101022 118.3 1.07 [30D] [CS]
10/3/22 ND_Pan2_100322 143.1 1.23 [30D] [CS]
9/26/22 ND_Pan2n_092622 131.4 1.40 Samples from new wafer [30D] [CS]
9/26/22 ND_Pan2o_092622 130.6 1.14 Samples from old wafer [45D] [CS]
9/12/22 ND_Pan2_091222 156 1.33 Higher etch rate/selectivity, may be due to new Si wafer [30D] [CS]
8/26/22 ND_Pan2_082622 144.3 1.22 [30D] [CS]
8/8/2022 ND_Pan2_080822 134.3 1.12 [30D] [CS]
7/29/2022 ND_Pan2_072922 142.3 1.20 [30D] [CS]
7/15/2022 ND_Pan2_071522 139.1 1.20 [45D][CS]
5/5/2022 NP_ICP2_07 170 1.11 Right after Quartz Top-Plate Temperature reduced 100°C-->50°C.

Etch Characteristics look similar to before.

[1] [2]
4/26/2022 NP_ICP2_06 176.3 1.14 [1] [2]
4/20/2022 NP_ICP2_05 171.7 1.13 [1] [2]
4/12/2022 NP_ICP2_04 167.9 1.17 [1] [2]
3/30/2022 NP_ICP2_03 164 1.23 [1] [2]
3/8/2022 NP_ICP2_02 144 1.02 [1] [2]
3/2/2022 NP_ICP2_01 169.6 1.29 [1] [2]
8/9/2021 I22105 140 0.97 After etching diamond sample for 1 hour using Cl2/Ar. Found

chamber/etches are ok.

[1]
8/9/2021 I22104 147 1.06 Before etching diamond sample for 1 hour using Cl2/Ar [2]
7/21/2021 I22103 134 1.09 Investigating reports of low etch rate [3]
5/19/2021 I22102 163 1.11 Etch time=130 sec [4]
1/7/2021 I22101 144 1.20 [5]
8/9/2020 I22002 102 0.86 caused by air leaking to CHF3 channel [6]
1/16/2020 I22001 149 1.21 [7]
7/18/2019 I21905 162 1.37 [8]
3/6/2019 I21904 151 1.23 85.6 [9]
1/28/2019 I21901 146 1.23 [10]
10/5/2018 SiO2#02 160 1.2 82.1 [11]


Alternate Data (not updated)

We stopped taking data for the following table in 2019, use the above data instead.

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