DUV Flood Expose: Difference between revisions

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Materials that are exposed are primarily spun-on thin films such as PMMA, PMGI, etc.
Materials that are exposed are primarily spun-on thin films such as PMMA, PMGI, etc.

DUV exposure can be used to:

# Expose PMGI underlayers - see the [[Lithography Recipes#Lift-Off Recipes|liftoff recipes]] for recipes.
# Harden the top of resists before develop, creating "lip" for better liftoff. [https://wiki.nanofab.ucsb.edu/w/images/b/bc/Liftoff-Techniques.pdf See the Liftoff Tutorial for an example].
# Expose DUV resists for edge-bead removal: [[Photolithography - Manual Edge-Bead Removal Techniques#DUV Photo-EBR Process|see the EBR page for recipes]].


==Detailed Specifications==
==Detailed Specifications==


*DUV wavelengths are 200-260 nm; the lamp power is limited to 1000 watts and can operate in either constant intensity or constant power mode
*DUV wavelengths are 200-260 nm; the lamp power is limited to 1000 Watts and can operate in either constant intensity or constant power mode
*The full spectrum of Hg emission wavelengths from 200-450 nm is present on the sample
*The full spectrum of Hg emission wavelengths from 200-450 nm is present on the sample
*Exposure can be performed on a 4" wafer
*Exposure can be performed on a 4" wafer
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===DUV Exposure System Spectra===
===DUV Exposure System Spectra===
[[image:DUV-System-Spectra.png|thumb|none|600px|DUV Exposure System Spectra]]
[[image:DUV-System-Spectra.png|thumb|none|482x482px|DUV Exposure System Spectra]]


==Operating Procedures==
==Documentation==


*[https://signupmonkey.ece.ucsb.edu/wiki/images/2/27/DUV_Flood_Expose_SOP.pdf DUV Flood Expose Standard Operating Procedure]
*[https://wiki.nanofab.ucsb.edu/w/images/8/89/DUV_Flood_Expose_SOP_Rev_C.pdf DUV Flood Expose Standard Operating Procedure]

Latest revision as of 04:24, 6 December 2025


DUV Flood Expose
Location Bay 6
Tool Type Lithography
Manufacturer Bachur & Associates/AB Manufacturing
Description 1000W Deep UV Flood Exposure System (LS-150X-10C2) and Illumination Controller (2130-C2)
Primary Supervisor Lee Sawyer
(805) 893-2123
lee_sawyer@ucsb.edu

Secondary Supervisor

Bill Millerski

Recipes


About

This unit consists of a collimated deep ultraviolet (DUV) light source (mercury gas discharge short arc lamp) and power supply. The substrate is placed on a rotating chuck (not presently working) and is exposed by opening a timer-controlled shutter.

Materials that are exposed are primarily spun-on thin films such as PMMA, PMGI, etc.

DUV exposure can be used to:

  1. Expose PMGI underlayers - see the liftoff recipes for recipes.
  2. Harden the top of resists before develop, creating "lip" for better liftoff. See the Liftoff Tutorial for an example.
  3. Expose DUV resists for edge-bead removal: see the EBR page for recipes.

Detailed Specifications

  • DUV wavelengths are 200-260 nm; the lamp power is limited to 1000 Watts and can operate in either constant intensity or constant power mode
  • The full spectrum of Hg emission wavelengths from 200-450 nm is present on the sample
  • Exposure can be performed on a 4" wafer
  • Lamps are nominally rated for 400 hours
  • A reset timer was added in Feb. 1995 to limit "on" time (ie. provide for auto shut-off) for bulb life conservation

Spectra Images

DUV Exposure System Spectra

DUV Exposure System Spectra

Operating Procedures

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