Vacuum Deposition Recipes: Difference between revisions
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes| |
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|[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes#Si3N4 deposition .28IBD.29|R5]] |
| bgcolor="#eeffff" |[[Sputtering Recipes#Si3N4 deposition .28IBD.29|R5]] |
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| bgcolor="#eeffff" |[[Atomic Layer Deposition Recipes#Al2O3 deposition .28ALD CHAMBER 3.29|R4]] |
| bgcolor="#eeffff" |[[Atomic Layer Deposition Recipes#Al2O3 deposition .28ALD CHAMBER 3.29|R4]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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! bgcolor="#d0e7ff" align="center" |CeO<sub>2</sub> |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes| |
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| bgcolor="#eeffff" |[[Thermal Evaporation Recipes#Thermal Evaporator 1|R1]] |
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|[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
|[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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|[https://wiki.nanotech.ucsb.edu/w/index.php?title=Sputtering_Recipes#Sputter_3_.28AJA_ATC_2000-F.29 |
|[https://wiki.nanotech.ucsb.edu/w/index.php?title=Sputtering_Recipes#Sputter_3_.28AJA_ATC_2000-F.29 R3] |
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|{{Rl|Sputtering_Recipes|Sputter_5_.28AJA_ATC_2200-V.29|R3}} |
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|[[Thermal Evaporation Recipes|A]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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|[[Atomic Layer Deposition Recipes#AlN deposition .28ALD CHAMBER 3.29|R4]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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|<br> |
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|[[Sputtering Recipes#Ru Deposition .28Sputter 4.29| |
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Line 576: | Line 984: | ||
|[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R4]] |
|[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R4]] |
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| bgcolor="#eeffff" |R1 |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |[https://wiki.nanotech.ucsb.edu/w/index.php?title=PECVD_Recipes#Amorphous-Si_deposition_.28PECVD_.232.29 R3] |
| bgcolor="#eeffff" |[https://wiki.nanotech.ucsb.edu/w/index.php?title=PECVD_Recipes#Amorphous-Si_deposition_.28PECVD_.232.29 R3] |
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|[[Sputtering Recipes#Si3N4 deposition .28IBD.29|R6]] |
|[[Sputtering Recipes#Si3N4 deposition .28IBD.29|R6]] |
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| bgcolor="#eeffff" |[[Sputtering_Recipes#SiO2_deposition_.28IBD.29|R6]] |
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| bgcolor="#eeffff" |[[PECVD Recipes#SiO2 deposition .28PECVD .231.29|R6]] |
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| bgcolor="#eeffff" |[[PECVD Recipes#SiO2 deposition .28PECVD .232.29|R6]] |
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| bgcolor="#eeffff" |[[Thermal Evaporation Recipes| |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |R1 |
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| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" |R1 |
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|[https://wiki.nanotech.ucsb.edu/w/index.php?title=Sputtering_Recipes#Sputter_4_.28AJA_ATC_2200-V.29 |
|[https://wiki.nanotech.ucsb.edu/w/index.php?title=Sputtering_Recipes#Sputter_4_.28AJA_ATC_2200-V.29 R3] |
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| bgcolor="#eeffff" |[[Sputtering Recipes| |
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! bgcolor="#d0e7ff" align="center" |TiO<sub>2</sub> |
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| bgcolor="#eeffff" |[[Sputtering Recipes| |
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| bgcolor="#eeffff" |[[Sputtering Recipes#Si3N4 deposition .28IBD.29|R5]] |
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Latest revision as of 00:11, 24 August 2024
Process Control Data
See linked page for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.
Deposition Tools/Materials Table
The Key/Legend for this table's A...R6
values is at the bottom of the page.
Process Ranking Table
Processes in the table above are ranked by their "Process Maturity Level" as follows:
Process Level | Description of Process Level Ranking | ||||||||||
A | Process Allowed and materials available but never done | ||||||||||
R1 | Process has been ran at least once | ||||||||||
R2 | Process has been ran and/or procedure is documented or/and data available | ||||||||||
R3 | Process has been ran, procedure is documented, and data is available | ||||||||||
R4 | Process has a documented procedure with regular (≥4x per year) data or lookahead/in-Situ control available | ||||||||||
R5 | Process has a documented procedure with regular (≥4x per year) data and lookahead/in-Situ control available | ||||||||||
R6 | Process has a documented procedure, regular ( ≥4x per year) data, and control charts/limits available |