Packaging Recipes: Difference between revisions
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(moved logitech procedure to separate page.) |
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|1.275mm |
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=== Mounting/Unmounting Samples === |
=== Mounting/Unmounting Samples === |
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The UV-Release Tape dispenser is most-often used for mounting sample for dicing. |
The UV-Release Tape dispenser is most-often used for mounting sample for dicing. |
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* Full Release: 60 sec exposure |
* Full Release: 60 sec exposure |
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* Partial Release for Shipping: 9 sec exposure |
* Partial Release for Shipping: 9 sec exposure |
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=== Surface Protection === |
=== Surface Protection === |
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Users most often use sacrificial photoresists to protect the surface from accumulating dicing dust. The static-buildup of dielectric films causes the dust to adhere strongly. Ensure that the PR thickness will adequately coat all your exposed topography (eg. use a ≥2µm thick PR for protecting 1.5-2.0µm tall etched features). |
Users most often use sacrificial photoresists to protect the surface from accumulating dicing dust. The static-buildup of dielectric films causes the dust to adhere strongly. Ensure that the PR thickness will adequately coat all your exposed topography (eg. use a ≥2µm thick PR for protecting 1.5-2.0µm tall etched features). |
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# Perform your dicing |
# Perform your dicing |
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# Strip the PR in Acetone and ISO & N2 dry |
# Strip the PR in Acetone and ISO & N2 dry |
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== [[Wafer Bonder (Logitech WBS7)]] == |
== [[Wafer Bonder (Logitech WBS7)]] == |
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This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax. |
This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax. |
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* [[Logitech WBS7 - Procedure for Wax Mounting with Spin-On Crystalbond|Wax Mounting Procedure, with Spin-On Crystalbond]] |
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* [[Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick|Wax Mounting Procedure, with bulk Crystalbond Stick]] |
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=== Wax Mounting Procedure, with Spin-On Crystalbond === |
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Draft only - in progress. -- Demis 2018-10-16 |
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* Mix a fresh squirt bottle of CrystalBond diluted with Acetone (see [[Don Freeborn]] for method). |
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** XYZ grams of crystalbond, mixed into |
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** XYZ mL of Acetone, in dedicated squirt bottle |
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** Shake/stir to completely dissolve the wax |
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* Place 4-inch silicon carrier wafer on POLOS spinner in solvent bench, with non-vacuum 4-inch chuck installed. |
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* Set up POLOS recipe |
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** Spin at XYZ rpm for XYZ sec. |
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* Squirt wax solution onto wafer |
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* I/O to spin. |
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* Place carrier wafer on Logitech bonder surface |
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* Place sample to be bonded on top |
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* Place 110mm chemical filter paper on top |
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* Close lid, secure lid clamp |
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* Run recipe: |
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** XYZ °C |
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** XYZ seconds |
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** Vacuum etc.? |
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Revision as of 20:47, 17 October 2018
Dicing Saw Recipes (ADT 7100)
Cutting Parameters
| Recommended Dicing Parameters | |||
| Material | Blade P/N | Spindle Speed (KRPM) | Cut Speed (mm/s) |
| Alumina, AlN | 2.187-8C-54RU-3 | 25 | 0.5-2 |
| Ceramic | 2.187-4C-30RU-3 | 18 | 0.5-2 |
| GaAs | 2.187-4C-9RU-3 | 35 | 1-5 |
| GaN (<550um) | 2.187-4C-30RU-3 | 35 | 0.5-3 |
| GaN (>550um) | 2.187-8C-30RU-3 | 35 | 0.5-2 |
| Glass/Fused Silica | 2.187-4C-22RU-3 | 25 | 1-5 |
| InP | 2.187-4C-9RU-3 | 35 | 1-5 |
| Quartz | 2.187-4C-30RU-3 | 25 | 1-5 |
| Sapphire | 2.187-8C-54RU-3 | 18 | 0.5-2 |
| Si | 2.187-4C-9RU-3 | 35 | 4-10 |
| Si on Glasss | 2.187-4C-9RU-3 | 25 | 1-5 |
| SiC | 2.187-8C-30RU-3 | 25 | 0.5-2 |
| Ti | 2.187-8C-54RU-3 | 15 | 0.5-2 |
| Blade Diam | Flange Diam. | Blade Exposure |
|---|---|---|
| 2.187" (55.55mm) | 47mm | 4.275mm |
| 2.187" (55.55mm) | 49mm | 3.275mm |
| 2.187" (55.55mm) | 51mm | 2.275mm |
| 2.187" (55.55mm) | 52mm | 1.775mm |
| 2.187" (55.55mm) | 53mm | 1.275mm |
Mounting/Unmounting Samples
The UV-Release Tape dispenser is most-often used for mounting sample for dicing.
The Tape Model installed is XYZXYZ. Data Sheet Here.
- Procedure for mounting sample on UV-Release Tape
- Full Release: 60 sec exposure
- Partial Release for Shipping: 9 sec exposure
Surface Protection
Users most often use sacrificial photoresists to protect the surface from accumulating dicing dust. The static-buildup of dielectric films causes the dust to adhere strongly. Ensure that the PR thickness will adequately coat all your exposed topography (eg. use a ≥2µm thick PR for protecting 1.5-2.0µm tall etched features).
- Choose a photoresist of appropriate thickness, and spin-coat it & soft-bake it according to a standard recipe. Contact Alignment PR Recipes Stepper PR Recipes
- Perform your dicing
- Strip the PR in Acetone and ISO & N2 dry
Wafer Bonder (Logitech WBS7)
This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax.
- Wax Mounting Procedure, with Spin-On Crystalbond
- Wax Mounting Procedure, with bulk Crystalbond Stick