Surface Analysis (KLA/Tencor Surfscan): Difference between revisions
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==About== |
==About== |
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This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to |
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches. |
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==Documentation== |
==Documentation== |
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*[[KLA-Tencor Surfscan - Standard Operating Procedure|Standard Operating Procedure]] |
*[[KLA-Tencor Surfscan - Standard Operating Procedure|Standard Operating Procedure]] |
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*[ |
*[//wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operations Manual] |
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**''For detailed measurement info, it is highly recommended that you read the manual.'' |
**''For detailed measurement info, it is highly recommended that you read the manual.'' |
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*[ |
*[//wiki.nanotech.ucsb.edu/w/images/2/27/Surfscan-Surfscan_6200_info.pdf Surfscan Info] |
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=== Screenshots === |
=== Screenshots === |
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Revision as of 04:25, 31 March 2020
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About
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches.
Documentation
- Standard Operating Procedure
- Operations Manual
- For detailed measurement info, it is highly recommended that you read the manual.
- Surfscan Info
