Surface Analysis (KLA/Tencor Surfscan): Difference between revisions
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(reorg, remove old SOP, replaced with new PDF SOP's for each wafer size) |
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==Documentation== |
==Documentation== |
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=== Operating Procedures === |
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*[[KLA-Tencor Surfscan - Standard Operating Procedure|Standard Operating Procedure]] |
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*[https://wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operations Manual] |
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*[https://wiki.nanofab.ucsb.edu/w/images/4/4e/SURFSCAN_6200_Small_substrates.pdf Surfscan 6200 Small samples] * |
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*[[Wafer scanning process traveler]] |
*[[Wafer scanning process traveler]] |
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**''This is the procedure Staff uses to calibrate particle counts on our deposition tools.'' |
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*[[Errors]] |
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=== Other Documentation === |
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==Standard Recipes== |
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* [https://wiki. |
* [https://wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operations Manual] |
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*[[Surfscan Errors and Workarounds|Common Errors & Workarounds]] |
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==Examples== |
==Examples== |
Revision as of 18:34, 4 January 2024
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About
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches.
Documentation
Operating Procedures
- Surfscan 6200 8inch wafers *
- Surfscan 6200 6inch wafers *
- Surfscan 6200 4inch wafers *
- Surfscan 6200 2 and 3inch wafers *
- Surfscan 6200 Small samples *
- Wafer scanning process traveler
- This is the procedure Staff uses to calibrate particle counts on our deposition tools.
Other Documentation
- Operations Manual
- For detailed measurement info, it is highly recommended that you read the manual.
Examples
Gain 4: Small Particles
(0.160µm – 1.60µm) |
Gain 2: Large Particles
(1.60µm – 28.0µm) |
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Gain 4: Small Particles
(0.160µm – 1.60µm) |
Gain 2: Large Particles
(1.60µm – 28.0µm) |
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