Tool List: Difference between revisions
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(Created page with "__NOTOC__ =Lithography= * Suss Aligners * IR Aligner * DUV Flood Expose * Ovens * Stepper 1 * Stepper 2 * Stepper 3 * E-Beam Lithography System =…") |
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* [[E-Beam Evaporator 3]] |
* [[E-Beam Evaporator 3]] |
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* [[E-Beam Evaporator 4]] |
* [[E-Beam Evaporator 4]] |
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* [[Sputter |
* [[Sputter 1]] |
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* [[Sputter |
* [[Sputter 2]] |
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* [[Sputter |
* [[Sputter 3]] |
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* [[Sputter |
* [[Sputter 4]] |
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* [[Sputter |
* [[Sputter 5]] |
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* [[PECVD 1]] |
* [[PECVD 1]] |
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* [[PECVD 2]] |
* [[PECVD 2]] |
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* [[VLR PECVD]] |
* [[Unaxis VLR ICP-PECVD]] |
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* [[IBD]] |
* [[IBD]] |
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* [[Molecular Vapor Deposition]] |
* [[Molecular Vapor Deposition]] |
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Revision as of 22:04, 27 June 2012
Lithography
- Suss Aligners
- IR Aligner
- DUV Flood Expose
- Ovens
- Stepper 1
- Stepper 2
- Stepper 3
- E-Beam Lithography System
Vacuum Deposition
- E-Beam Evaporator 1
- E-Beam Evaporator 2
- E-Beam Evaporator 3
- E-Beam Evaporator 4
- Sputter 1
- Sputter 2
- Sputter 3
- Sputter 4
- Sputter 5
- PECVD 1
- PECVD 2
- Unaxis VLR ICP-PECVD
- IBD
- Molecular Vapor Deposition
- Atomic Layer Deposision
Dry Etch
- RIE 1
- RIE 2
- RIE 3
- RIE 5
- Si Deep RIE
- Ashers
- VLR Etch
- ICP Etch 1
- ICP Etch 2
- UV Ozone Reactor
- Plasma Clean
- XeF2 Etch
- Plasma Activation Tool
Wet Processing
Thermal Processing
Packaging
Inspection, Test and Characterization
- Field Emission SEM 1
- Field Emission SEM 2
- Step Profile
- Step Profilometer
- Ellipsometer
- Microscopes
- Probe Station & Curve Tracer
- Optical Film Thickness (Filmetrics)
- Scanning Probe Microscope
- Tencor Flexus Film Stress
- Optical Film Thickness (Nanometric)
- SEM Sample Coater
- Surface Analysis
- Photo-emission & IR Microscope
- Ellipsometer (Woollam)
- Goniometer
- 4-Point Probe Resistivity Mapper