PECVD Recipes: Difference between revisions

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==LS SiN deposition (PECVD #2) ==
==LS SiN deposition (PECVD #2) ==


*[[media:Advanced PECVD-Nitride2 300C standard recipe Nitride2 recipe.pdf|Nitride2 Standard Recipe]]
*[[media:|LS Nitride2 Standard Recipe]]
*[[media:Advanced PECVD LS NITRIDE2 March 2014.pdf|LS Nitride2 Data (Deposition Rate, Refractive Index, Stress, HF etch rate )]]
*[[media:Advanced PECVD LS NITRIDE2 March 2014.pdf|LS Nitride2 Data (Deposition Rate, Refractive Index, Stress, HF etch rate )]]



Revision as of 17:17, 31 March 2014

Back to Vacuum Deposition Recipes.

PECVD 1 (PlasmaTherm 790)

SiN deposition (PECVD #1)

SiO2 deposition (PECVD #1)

SiOxNy deposition (PECVD #1)

PECVD 2 (Advanced Vacuum)

SiN deposition (PECVD #2)

SiO2 deposition (PECVD #2)


LS SiN deposition (PECVD #2)


Amorphous-Si deposition (PECVD #2)

ICP-PECVD (Unaxis VLR)

SiN deposition (Unaxis VLR)

SiN (2% SiH4)

50° 100° 250°

SiN (2% SiH4 - No-Ar)

50° 100° 250°

SiN (2% SiH4 - No-Ar - Extra N2)

50° 100° 250°

SiN (100% SiH4 )

50° 100° 250°

SiO2 deposition (Unaxis VLR)

SiO2 (2% SiH4)

50° 100° 250°

SiO2 (2% SiH4 - No Ar)

50° 100° 250°

SiO2 (100% SiH4 HDR)

50° 100° 250°

SiO2 (100% SiH4 LDR)

50° 100° 250°

Amorphous Si (100%SiH4 Ar He)

90° 250°