PECVD Recipes: Difference between revisions

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*Deposition Rate: ≈ 9.0 nm/min
*Deposition Rate: ≈ 9.0 nm/min
*Refractive Index: ≈ 1.952
*Refractive Index: ≈ 1.952
*Stress ≈ 484MPa (Tensile))
*Stress ≈ 484MPa (compressive)


== SiO<sub>2</sub> deposition (PECVD #2) ==
== SiO<sub>2</sub> deposition (PECVD #2) ==

Revision as of 23:58, 8 April 2014

Back to Vacuum Deposition Recipes.

PECVD 1 (PlasmaTherm 790)

SiN deposition (PECVD #1)

SiO2 deposition (PECVD #1)

SiOxNy deposition (PECVD #1)

PECVD 2 (Advanced Vacuum)

SiN deposition (PECVD #2)

  • Deposition Rate: ≈ 9.0 nm/min
  • Refractive Index: ≈ 1.952
  • Stress ≈ 484MPa (compressive)

SiO2 deposition (PECVD #2)

LS SiN deposition (PECVD #2)

Amorphous-Si deposition (PECVD #2)

ICP-PECVD (Unaxis VLR)

SiN deposition (Unaxis VLR)

SiN (2% SiH4)

50° 100° 250°

SiN (2% SiH4 - No-Ar)

50° 100° 250°

SiN (2% SiH4 - No-Ar - Extra N2)

50° 100° 250°

SiN (100% SiH4 )

50° 100° 250°

SiO2 deposition (Unaxis VLR)

SiO2 (2% SiH4)

50° 100° 250°

SiO2 (2% SiH4 - No Ar)

50° 100° 250°

SiO2 (100% SiH4 HDR)

50° 100° 250°

SiO2 (100% SiH4 LDR)

50° 100° 250°

Amorphous Si (100%SiH4 Ar He)

90° 250°