Dry Etching Recipes: Difference between revisions

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Dry Etching Recipes
	RIE Etching				ICP Etching				Oxygen Plasma Systems				Other Dry Etchers
Material	RIE 1 (Custom)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	Si Deep RIE (PTI/Bosch)	ICP Etch 1 (Panasonic 1)	ICP Etch 2 (Panasonic 2)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)
Al				A		R1	R1
Ti						R1	A
Cr				A		R1	A
Ge
Ag
Pt															R1
Au															R1
Ru
Mo
Ta
W-TiW						R1	A
Al₂O₃
HfO₂
ITO		R1
SiO₂						R1	R1							R1
SiN						R1	R1
SiOxNy
Ta₂O₅
TiO₂
TiN
ZnO₂
ZrO₂
GaAs				R1		R1	R1	R1
AlGaAs				R1		R1		R1
InGaAlAs		R1						R1
InGaAsP		R1
InP		R1						R1
GaN				R1		R1		R1
AlGaN
AlN
GaN
AlGaN
AlN
GaSb
CdZnTe		R1
ZnSe
Si					R1								R1
SiC						R1	A
Sapphire						R1	A
Material	RIE 1 (Custom)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	Si Deep RIE (PlasmaTherm/Bosch Etch)	ICP Etch 1 (Panasonic E626I)	ICP Etch 2 (Panasonic E640)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)

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